Patents by Inventor Marc Stephan Dittes

Marc Stephan Dittes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic package with illuminated backside exterior
    Patent number: 10411000
    Abstract: A microelectronic package is described with an illuminated backside exterior. In one example, the package has a package substrate, a die attached to the package substrate, a cover over the die and the package substrate, a lamp, and a screen over the die, externally visible and optically coupled to the lamp so that when the lamp is illuminated the illumination is externally visible through the screen.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: September 10, 2019
    Assignee: Intel IP Corporation
    Inventors: Marc Stephan Dittes, Sven Albers, Christian Georg Geissler, Andreas Wolter, Klaus Reingruber, Georg Seidemann, Thomas Wagner, Richard Patten
  • Microelectronic Package with Illuminated Backside Exterior
    Publication number: 20170284636
    Abstract: A microelectronic package is described with an illuminated backside exterior. In one example, the package has a package substrate, a die attached to the package substrate, a cover over the die and the package substrate, a lamp, and a screen over the die, externally visible and optically coupled to the lamp so that when the lamp is illuminated the illumination is externally visible through the screen.
    Type: Application
    Filed: March 31, 2016
    Publication date: October 5, 2017
    Applicant: Intel IP Corporation
    Inventors: Marc Stephan Dittes, Sven Albers, Christian Georg Geissler, Andreas Wolter, Klaus Reingruber, Georg Seidemann, Thomas Wagner, Richard Patten