Patents by Inventor Marc Tarrabia

Marc Tarrabia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Software and method for via spacing in a semiconductor device
    Patent number: 8859416
    Abstract: A computer-readable software product is provided for executing a method of determining the location of a plurality of power rail vias in a semiconductor device. The semiconductor device includes an active region and a power rail. Locations of a first via and a second via are assigned along the power rail. The spacing between the location of the first via and the location of the second via is a minimum spacing allowable. The spacing between the location of the second via and the locations of structures in the active region which may electrically interfere with the second via is determined. The location of the second via is changed in response to the spacing between the location of the second via and the location of one of the structures in the active region being less than a predetermined distance.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: October 14, 2014
    Assignee: GLOBALFOUNDRIES, Inc.
    Inventors: David S. Doman, Mahbub Rashed, Marc Tarrabia
  • SOFTWARE AND METHOD FOR VIA SPACING IN A SEMICONDUCTOR DEVICE
    Publication number: 20130280905
    Abstract: A computer-readable software product is provided for executing a method of determining the location of a plurality of power rail vias in a semiconductor device. The semiconductor device includes an active region and a power rail. Locations of a first via and a second via are assigned along the power rail. The spacing between the location of the first via and the location of the second via is a minimum spacing allowable. The spacing between the location of the second via and the locations of structures in the active region which may electrically interfere with the second via is determined. The location of the second via is changed in response to the spacing between the location of the second via and the location of one of the structures in the active region being less than a predetermined distance.
    Type: Application
    Filed: April 24, 2012
    Publication date: October 24, 2013
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: David S. Doman, Mahbub Rashed, Marc Tarrabia