Patents by Inventor Marcel Berveiller

Marcel Berveiller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for the translatory manipulation of an element such as an axle
    Patent number: 4879467
    Abstract: The present invention relates to an apparatus for translatory manipulation of an element, such as an axle.Apparatus characterized in that it comprises a displacement device (2) for each direction in space in which the axle (1) is to be manipulated, each displacement device (2) comprising two blades (3) prestressed in opposition, constituted by an alloy which is pseudoelastic or has shape memory, disposed on opposite sides of heating and/or cooling means (4) giving rise to a thermal gradient between the two blades (3) and thus their martensitic transformation causing their deformation.
    Type: Grant
    Filed: August 23, 1988
    Date of Patent: November 7, 1989
    Assignee: Universite de Metz
    Inventors: Jean F. Muller, Francois G. Tollitte, Gabriel Krier, Serge Dominiak, Andre Eberhardt, Marcel Berveiller
  • Compensating element for stresses of thermal or mechanical orgin, especially for printed circuits, and process for making such an element employed in a printed circuit
    Patent number: 4857387
    Abstract: A printed circuit comprising an electrically insulating substrate and an electrically conductive layer on the substrate, this layer being a pseudo-elastic or elastically deformable alloy that undergoes significant deformations in a reversible manner and is a copper alloy containing at least 50% by weight copper in the form of large-grained polycrystals that undergo martensitic transformation. Preferably, the layer contains 60-80% by weight of copper, the large-grained polycrystals having a grain size of at least about 3 mm. The martensitic transformation takes place within the temperature range -55.degree. C. to +125.degree. C., and the layer has a thickness between 30.mu. and 200.mu., preferably about 100.mu..
    Type: Grant
    Filed: October 27, 1987
    Date of Patent: August 15, 1989
    Assignee: Cimulec, S.A.
    Inventors: Eberhardt, Andre, Serge Dominiak, Marcel Berveiller, Jean P. Lucas, Robert P. Y. Guyon