Patents by Inventor Marcel GIESEN
Marcel GIESEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220345828Abstract: Electroacoustic devices with a capacitive element and methods for fabricating such electroacoustic devices. An example method includes forming an acoustic device above a first region of a substrate, and forming a capacitive element above a second region of the substrate and adjacent to the acoustic device. The forming of the capacitive element may include forming a protective layer above the substrate where a first portion of the protective layer is above the second region of the substrate and a second portion of the protective layer is above the first region of the substrate, forming a dielectric region above the protective layer, and forming an electrode above the dielectric region. The dielectric region may include a different material than the protective layer.Type: ApplicationFiled: April 26, 2021Publication date: October 27, 2022Inventors: Stephan POHLNER, Christoph EGGS, Stefan FREISLEBEN, Matthias JUNGKUNZ, Thomas TELGMANN, Marc ESQUIUS MOROTE, Ilya LUKASHOV, Marcel GIESEN
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Publication number: 20210143793Abstract: An RF filter device that provides small spatial dimensions and good electric performance is provided. The filter device comprises a resonator structure and a further electric circuit. An acoustic minor is arranged between the active structure and the further electric circuit.Type: ApplicationFiled: July 1, 2019Publication date: May 13, 2021Inventors: Alexandre Agusto SHIRAKAWA, Marcel GIESEN
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Patent number: 10532924Abstract: A packaging structure including at least one hermetically sealed cavity in which at least one microelectronic device is arranged, the cavity being formed between a substrate and at least one cap layer through which several release holes are formed. Several separated portions of metallic material are provided such that each of the separated portions of metallic material is arranged on the cap layer above and around one of the release holes and forms an individual and hermetical plug of said one of the release holes. At least one diffusion barrier layer including at least one non-metallic material is arranged on the cap layer and forms a diffusion barrier against an atmosphere outside the cavity at least around the release holes. Parts of the diffusion barrier layer are not covered by the portions of metallic material.Type: GrantFiled: December 6, 2013Date of Patent: January 14, 2020Assignees: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, EPCOS AGInventors: Damien Saint-Patrice, Arnoldus Den Dekker, Marcel Giesen, Gudrun Henn, Jean-Louis Pornin, Bruno Reig
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Patent number: 10136226Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.Type: GrantFiled: December 18, 2012Date of Patent: November 20, 2018Assignee: TDK CORPORATIONInventors: Jan Tue Ravnkilde, Marcel Giesen, Kurt Rasmussen, Morten Ginnerup, Pirmin Hermann Otto Rombach, Wolfgang Pahl, Anton Leidl, Armin Schober, Jürgen Portmann
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Patent number: 10076035Abstract: A component includes a carrier and a functional structure on the carrier. A thin-film cover covers the functional structure and is used as a mounting base for a circuit part, which is arranged over the thin-film cover. The circuit part is connected to the functional structure by means of a lead.Type: GrantFiled: January 29, 2014Date of Patent: September 11, 2018Assignee: SnapTrack, Inc.Inventors: Gudrun Henn, Marcel Giesen
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Patent number: 9908773Abstract: A method for packaging a microelectronic device in an hermetically sealed cavity and managing an atmosphere of the cavity with a dedicated hole, including making said cavity between a support and a cap layer such that a sacrificial material and the device are arranged in the cavity; removing the sacrificial material through at least one release hole, and hermetically sealing the release hole; making a portion of wettable material on the cap layer, around a blind hole or a part of said outside surface corresponding to a location of said dedicated hole; making a portion of fuse material on the portion of wettable material; making the dedicated hole by etching the cap layer; and reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole.Type: GrantFiled: December 6, 2013Date of Patent: March 6, 2018Assignees: Commissariat à l'énergie atomique et aux énergies alternatives, EPCOS AGInventors: Damien Saint-Patrice, Arnoldus Den Dekker, Marcel Giesen, Florent Greco, Gudrun Henn, Jean-Louis Pornin, Bruno Reig
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Publication number: 20170144883Abstract: The present invention concerns a microelectronic package (1) comprising a microelectronic structure (2) having at least a first opening (3) and defining a first cavity (4), a capping layer (9) having at least a second opening (10) and defining a second cavity (11) which is connected to the first cavity (4), wherein the capping layer (9) is arranged over the microelectronic structure (2) such that the second opening (10) is arranged over the first opening (3), and a sealing layer (13) covering the second opening (10), thereby sealing the first cavity (4) and the second cavity (11). Moreover, the present invention concerns a method of manufacturing the microelectronic package (1).Type: ApplicationFiled: June 16, 2014Publication date: May 25, 2017Applicants: EPCOS AG, Commissariat a l'energie atomique et aux energies alternativesInventors: Gudrun HENN, Marcel GIESEN, Arnoldus DEN DEKKER, Jean-Louis PORNIN, Damien SAINT-PATRICE, Bruno REIG
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Patent number: 9637379Abstract: A method can be used for producing a microelectromechanical transducer. A plurality of microelectromechanical transducers are produced on a single wafer. Each transducer includes a diaphragm. The wafer is divided into at least a first and a second region. The mechanical tensions of a random sample of diaphragms of the first region are established and the values are compared with a predetermined desired value. The mechanical tensions of a random sample of diaphragms of the second region are established and the values are compared with the predetermined desired value. The tensions of the diaphragms in the first region are adjusted to the predetermined desired value, and the tensions of the diaphragms in the second region are adjusted to the predetermined desired value.Type: GrantFiled: July 2, 2014Date of Patent: May 2, 2017Assignee: TDK CorporationInventors: Marcel Giesen, Thomas Metzger, Phillip Ekkels, Ansgar Schäufele
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Publication number: 20170057809Abstract: A packaging structure including at least one hermetically sealed cavity in which at least one microelectronic device is arranged, the cavity being formed between a substrate and at least one cap layer through which several release holes are formed; several separated portions of metallic material such that each of the separated portions of metallic material is arranged on the cap layer above and around one of the release holes and forms an individual and hermetical plug of said one of the release holes; at least one diffusion barrier layer comprising at least one non-metallic material, arranged on the cap layer and forming a diffusion barrier against an atmosphere outside the cavity at least around the release holes; and wherein parts of the diffusion barrier layer are not covered by the portions of metallic material.Type: ApplicationFiled: December 6, 2013Publication date: March 2, 2017Applicants: Commissariat A L'Energie Atomique Et Aux Energies Alternatives, Epcos AGInventors: Damien SAINT-PATRICE, Arnoldus DEN DEKKER, Marcel GIESEN, Gudrun HENN, Jean-Louis PORNIN, Bruno REIG
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Publication number: 20160304338Abstract: A method for packaging a microelectronic device in an hermetically sealed cavity and managing an atmosphere of the cavity with a dedicated hole, including making said cavity between a support and a cap layer such that a sacrificial material and the device are arranged in the cavity; removing the sacrificial material through at least one release hole, and hermetically sealing the release hole; making a portion of wettable material on the cap layer, around a blind hole or a part of said outside surface corresponding to a location of said dedicated hole; making a portion of fuse material on the portion of wettable material; making the dedicated hole by etching the cap layer; and reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole.Type: ApplicationFiled: December 6, 2013Publication date: October 20, 2016Applicants: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, EPCOS AGInventors: Damiel SAINT-PATRICE, Arnoldus DEN DEKKER, Marcel GIESEN, Florent GRECO, Gudrun HENN, Jean-Louis PORNIN, Bruno REIG
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Publication number: 20160167960Abstract: A method can be used for producing a microelectromechanical transducer. A plurality of microelectromechanical transducers are produced on a single wafer. Each transducer includes a diaphragm. The wafer is divided into at least a first and a second region. The mechanical tensions of a random sample of diaphragms of the first region are established and the values are compared with a predetermined desired value. The mechanical tensions of a random sample of diaphragms of the second region are established and the values are compared with the predetermined desired value. The tensions of the diaphragms in the first region are adjusted to the predetermined desired value, and the tensions of the diaphragms in the second region are adjusted to the predetermined desired value.Type: ApplicationFiled: July 2, 2014Publication date: June 16, 2016Inventors: Marcel GIESEN, Thomas METZGER, Phillip EKKELS, Ansgar SCHÄUFELE
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Publication number: 20160014902Abstract: A component includes a carrier and a functional structure on the carrier. A thin-film cover covers the functional structure and is used as a mounting base for a circuit part, which is arranged over the thin-film cover. The circuit part is connected to the functional structure by means of a lead.Type: ApplicationFiled: January 29, 2014Publication date: January 14, 2016Inventors: Gudrun HENN, Marcel GIESEN
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Patent number: 9199839Abstract: Method of hermetically sealing a hole with a fuse material, comprising the following steps: applying a portion of wettable material onto a surface such that it completely surrounds the hole made through said surface and is located outside the hole, or completely surrounds a first part of said surface corresponding to a location of the hole; applying a portion of fuse material on the portion of wettable material and on a second part of said surface located around the portion of wettable material; reflowing the portion of fuse material to form a bump of fuse material which has a shape corresponding to a part of a sphere, which is fastened only to the portion of wettable material and which hermetically plugs the hole; wherein the hole is made in said surface before reflowing the portion of fuse material.Type: GrantFiled: November 24, 2014Date of Patent: December 1, 2015Assignees: Commissariat à l'énergie atomique et aux énergies alternatives, EPCOS AGInventors: Jean-Louis Pornin, Arnoldus Den Dekker, Marcel Giesen, Florent Greco, Gudrun Henn, Bruno Reig, Damien Saint-Patrice
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Publication number: 20150326979Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.Type: ApplicationFiled: December 18, 2012Publication date: November 12, 2015Inventors: Jan Tue Ravnkilde, Marcel Giesen, Kurt Rasmussen, Morten Ginnerup, Pirmin Hermann Otto Rombach, Wolfgang Pahl, Anton Leidl, Armin Schober, Jürgen Portmann
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Publication number: 20150158725Abstract: Method of hermetically sealing a hole with a fuse material, comprising the following steps: applying a portion of wettable material onto a surface such that it completely surrounds the hole made through said surface and is located outside the hole, or completely surrounds a first part of said surface corresponding to a location of the hole; applying a portion of fuse material on the portion of wettable material and on a second part of said surface located around the portion of wettable material; reflowing the portion of fuse material to form a bump of fuse material which has a shape corresponding to a part of a sphere, which is fastened only to the portion of wettable material and which hermetically plugs the hole; wherein the hole is made in said surface before reflowing the portion of fuse material.Type: ApplicationFiled: November 24, 2014Publication date: June 11, 2015Applicants: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT, EPCOS AGInventors: Jean-Louis PORNIN, Arnold DEN DEKKER, Marcel GIESEN, Florent GRECO, Gudrun HENN, Bruno REIG, Damien SAINT-PATRICE