Abstract: The invention relates to a method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections. The substrate (S1) is given a slanted, roof-shaped or convex contour (K1) in the area of at least one front face and/or in the area of at least one inner wall of a recess. After metallizing the substrate (S1), printed-board conductor-shaped cross connections (Q) are produced in the area of the above-mentioned contours (K1) simultaneously with laser structuring of printed board conductors (L) on the top part (0) and the bottom part (U) of the substrate (S1).

Abstract: The printed circuit boards (LP) are conducted through treatment baths (BB1 through BB3) in vertical attitude on at least two horizontal conveying paths (TW1 through TW4) proceeding next to one another, these treatment baths being accommodated in treatment cells (BZ10 through BZ13, BZ20 through BZ23, BZ30 through BZ33) that are arranged successively and next to one another. The end walls of the treatment cells are provided with vertical slots (S) and allocated seals (D) for the passage of the printed circuit boards. The bath liquid emerging from treatment cells arranged next to one another is collected in common collecting tanks (AW1 through AW3) and is returned into the treatment cells with the assistance of pumps (P). A common treatment cell for treatment zones lying next to one another can also be provided in a common collecting tank. The conveying of the printed circuit boards on the conveying paths lying next to one another preferably ensues with a common conveyor device.