Abstract: A device includes a first layer of an electrically insulating material and a second layer of a non-electrically insulating material (e.g., semiconductor or electrically conductive) extending on the first layer. The second layer is structured so as to define opposite, lateral walls of a microchannel, a bottom wall of which is defined by an exposed surface of the first layer. The second layer is further structured to form one or more electrical insulation barriers; each barrier includes a line of through holes, each surrounded by an oxidized region of the material of the second layer. The through holes alternate with oxidized portions of the oxidized region along the line. Each barrier extends, as a whole, laterally across the second layer up to one of the lateral walls and delimits two sections of the second layer on each side of the barrier and on a same side of the microchannel.

Abstract: A device includes a first layer of an electrically insulating material and a second layer of a non-electrically insulating material (e.g., semiconductor or electrically conductive) extending on the first layer. The second layer is structured so as to define opposite, lateral walls of a microchannel, a bottom wall of which is defined by an exposed surface of the first layer. The second layer is further structured to form one or more electrical insulation barriers; each barrier includes a line of through holes, each surrounded by an oxidized region of the material of the second layer. The through holes alternate with oxidized portions of the oxidized region along the line. Each barrier extends, as a whole, laterally across the second layer up to one of the lateral walls and delimits two sections of the second layer on each side of the barrier and on a same side of the microchannel.

Abstract: A structure including a first layer of one or more molecular components having a first top anchor group, a first functional moiety and a first bottom anchor group. The first functional moiety connects the first top anchor group to the first bottom anchor group. The structure further includes a first conductive film of one or more nanoparticles disposed on the first layer of one or more molecular components. Each of at least a portion of the one or more nanoparticles bond with the first top anchor group of the one or more molecular components. Each of at least a portion of the one or more nanoparticles cross-link with at least one other of the nanoparticles. The first conductive film forms a first contact for the first layer of one or more molecular components.

Abstract: A method and devices for deprotecting anchored molecular compounds is provided which relies on an electrically addressable surface S with multiple compounds C thereon. Each compound C comprises three distinct moieties, including: a first moiety A, anchored to the surface S; a second moiety, which comprises an acetylene unit U, that is a molecular backbone bonded to the first moiety; and a third moiety P, which is a protection moiety for acetylene. The protection moiety P is bonded to the acetylene unit U of the second moiety via an electrochemically breakable bond. The surface S is submerged in an electrolyte, so that the compounds C are immersed in the electrolyte. The protection moiety P of at least a subset of the compounds C can be electrochemically cleaved by applying an electric potential between the surface S and the electrolyte, so as to obtain cleaved compounds C? with free acetylene terminals.

Abstract: A structure including a first layer of one or more molecular components having a first top anchor group, a first functional moiety and a first bottom anchor group. The first functional moiety connects the first top anchor group to the first bottom anchor group. The structure further includes a first conductive film of one or more nanoparticles disposed on the first layer of one or more molecular components. Each of at least a portion of the one or more nanoparticles bond with the first top anchor group of the one or more molecular components. Each of at least a portion of the one or more nanoparticles cross-link with at least one other of the nanoparticles. The first conductive film forms a first contact for the first layer of one or more molecular components.

Abstract: A method for forming a contact to a layer of one or more molecular components that comprises depositing one or more nanoparticles on the layer of one or more molecular components. Each of at least a portion of the one or more nanoparticles bond with each of at least a portion of the one or more molecular components. When there is more than one nanoparticle, each of at least a portion of the one and more nanoparticles cross-link with at least one other of the one or more nanoparticles. The bonded and cross-linked nanoparticles form both a mechanical and electrical contact for the layer of molecular components. The contact may further act as protection and sealing layers to preserve the chemical integrity at ambient operation conditions and/or enable mass and ionic exchange.

Abstract: A method for manufacturing a gap device includes forming a template structure on a substrate, depositing an active material layer on the substrate and on the template structure, wherein the active material layer covers at least top and side surfaces of the template structure, planarizing the active material layer, and selectively removing the template structure with respect to the active material layer and the substrate.

Abstract: A method for forming a contact to a layer of one or more molecular components that comprises depositing one or more nanoparticles on the layer of one or more molecular components. Each of at least a portion of the one or more nanoparticles bond with each of at least a portion of the one or more molecular components. When there is more than one nanoparticle, each of at least a portion of the one and more nanoparticles cross-link with at least one other of the one or more nanoparticles. The bonded and cross-linked nanoparticles form both a mechanical and electrical contact for the layer of molecular components. The contact may further act as protection and sealing layers to preserve the chemical integrity at ambient operation conditions and/or enable mass and ionic exchange.

Abstract: A method for manufacturing a gap device includes forming a template structure on a substrate, depositing an active material layer on the substrate and on the template structure, wherein the active material layer covers at least top and side surfaces of the template structure, planarizing the active material layer, and selectively removing the template structure with respect to the active material layer and the substrate.

Abstract: A method for producing an organometallic layer includes providing a substrate having at least a layer with atoms of an oxidizable metal on its surface. The surface is exposed to a fluid that includes organic molecules having at least two functional groups that contain elements of main group VI such that the atoms of the oxidizable metal form a bond with the organic molecules. By consumption of the atoms of oxidizable metal and of the organic molecules, the organometallic layer is formed on the substrate at locations on the surface of the substrate where the atoms of oxizable are disposed, the atoms of oxizable metal being incorporated into the organometallic layer. A thickness of the organometallic layer is determined by a duration of the exposing, a thickness of the layer including the atoms of the oxidizable metal, and the number of organic molecules in the fluid.

Abstract: A method for producing an organometallic layer includes providing a substrate having at least a layer with atoms of an oxidizable metal on its surface. The surface is exposed to a fluid that includes organic molecules having at least two functional groups that contain elements of main group VI such that the atoms of the oxidizable metal form a bond with the organic molecules. By consumption of the atoms of oxidizable metal and of the organic molecules, the organometallic layer is formed on the substrate at locations on the surface of the substrate where the atoms of oxizable are disposed, the atoms of oxizable metal being incorporated into the organometallic layer. A thickness of the organometallic layer is determined by a duration of the exposing, a thickness of the layer including the atoms of the oxidizable metal, and the number of organic molecules in the fluid.