Abstract: An optical component (11) can include a chip comprising a carrier substrate (13) made of a semiconductor material and a membrane (15) disposed on a planar membrane-carrying surface of the carrier substrate (13). The membrane (15) is formed integrally with the carrier substrate (13). A cavity (14) is formed in the carrier substrate (13), the cavity having a first end and a second end. The membrane (15) has a cavity-spanning portion that spans the cavity (14) at its first end. The cavity-spanning portion of the membrane (15) is transparent to light in a desired wavelength range. An optical element (16) for shaping, diffusing, or filtering the light is formed on or in the cavity-spanning portion of the membrane (15). The optical component (11) may be manufactured in a wafer-level process. Also disclosed is an optoelectronic module that includes the optical component (11) together with an optoelectronic device.