Patents by Inventor Marcel Said

Marcel Said has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OPTICAL BRIDGE FOR PHOTONIC INTERPOSER TO PHOTONIC INTERPOSER COMMUNICATIONS
    Publication number: 20250216636
    Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, the photonics package comprises a substrate. In an embodiment, a first interposer is over the substrate, and a first die is on the first interposer. In an embodiment, a second interposer is over the substrate, and a second die is on the second interposer. In an embodiment, an optical bridge is between the first interposer and the second interposer.
    Type: Application
    Filed: June 27, 2022
    Publication date: July 3, 2025
    Inventors: Vinod ADIVARAHAN, Liqiang CUI, Kristof DARMAWIKARTA, Gang DUAN, Benjamin DUONG, Shereen ELHALAWATY, Sandeep GAAN, Brandon C. MARIN, Srinivas V. PIETAMBARAM, Marcel SAID
  • OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT DEVICE PACKAGES
    Publication number: 20240345324
    Abstract: An integrated circuit package includes a substrate with an integrated circuit device mounting surface, and at least one optical fiber mount in the substrate. The optical fiber mount includes a support having at least one optical fiber mounting channel, and the optical fiber mounting channel is configured to mount at least one clad optical fiber.
    Type: Application
    Filed: April 11, 2023
    Publication date: October 17, 2024
    Applicant: Intel Corporation
    Inventors: Benjamin Duong, Kristof Darmawikarta, Soham Agarwal, Marcel Said, Sandeep Gaan