Patents by Inventor Marcel Schaal

Marcel Schaal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260195620
    Abstract: Secure verification of trained models, including: performing an inference operation on input inference data using a trained model; applying, to verifiable input data, one or more transformations based on an inference path of the trained model during the inference operation, thereby generating transformed verifiable input data; and verifying the trained model based on the transformed verifiable input data.
    Type: Application
    Filed: January 9, 2025
    Publication date: July 9, 2026
    Inventors: TYLER VEZIO RIMALDI, MICHAEL E GILDEIN, TABARI ALEXANDER, MARCEL SCHAAL
  • Publication number: 20260064610
    Abstract: Address validation for peer-to-peer communication among a plurality of I/O devices via an interconnect includes identifying a number of isolation groups within a virtual partitioning of address space of the I/O devices; and storing address filters at locations associated with the plurality of I/O devices. Let N be the number of isolation groups, and i be an index from 1 to N. Each isolation group includes a subset of the plurality of I/O devices. The address filter associated with an I/O device of an ith isolation group includes identifications and address ranges of other I/O devices of the ith isolation group so as to authorize read and write operations on peer address space of the ith isolation group.
    Type: Application
    Filed: September 4, 2024
    Publication date: March 5, 2026
    Inventors: APOORVE MOHAN, Christoph Raisch, Marco Kraemer, Marcel Schaal, Hubertus Franke
  • Publication number: 20250005326
    Abstract: Provided are a computer program product, system, and method for reusing weights and biases in an artificial intelligence accelerator for a neural network for different minibatch sizes of inferences. A minibatch size is selected of inference jobs batched to process in the accelerator. A representation of a neural network is processed to determine a set of weights and biases for the selected minibatch size to load into the core. The set of weights and biases is loaded into the core for use by the array of processing elements in the core of the accelerator. The weights and the biases are reused in the processing elements for the neural network, loaded for the selected minibatch size, to apply to minibatches of inferences having minibatch sizes less than the selected minibatch size.
    Type: Application
    Filed: June 29, 2023
    Publication date: January 2, 2025
    Inventors: Swagath Venkataramani, Marcel Schaal, Sanchari Sen, Amrit Nagarajan, Vijayalakshmi Srinivasan, Shyam Ramji
  • Patent number: 11604653
    Abstract: Provided are embodiments for a computer-implemented method, system and computer program product for identifying dependencies in a control sequence. Embodiments include receiving a control block that comprises a first error dependency (EDEP) level, maintaining the first EDEP level, and determining whether the received control block was successfully executed. Embodiments also include receiving a subsequent control block that comprises a second EDEP level, comparing the first EDEP level and the second EDEP level, and providing the subsequent control block for execution based at least in part on the successful execution of the received control block, and on the second EDEP level being less than or equal to the first EDEP level.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: March 14, 2023
    Assignee: International Business Machines Corporation
    Inventors: Scot Rider, Marcel Schaal
  • Publication number: 20220188119
    Abstract: Provided are embodiments for a computer-implemented method, system and computer program product for identifying dependencies in a control sequence. Embodiments include receiving a control block that comprises a first error dependency (EDEP) level, maintaining the first EDEP level, and determining whether the received control block was successfully executed. Embodiments also include receiving a subsequent control block that comprises a second EDEP level, comparing the first EDEP level and the second EDEP level, and providing the subsequent control block for execution based at least in part on the successful execution of the received control block, and on the second EDEP level being less than or equal to the first EDEP level.
    Type: Application
    Filed: December 11, 2020
    Publication date: June 16, 2022
    Inventors: Scot Rider, Marcel Schaal
  • Patent number: 11288001
    Abstract: Aspects include receiving a request from a requesting system to move data from a source memory on a source system to a target memory on a target system. The receiving is at a first hardware engine configured to access the source memory and the target memory. In response to receiving the request, the first hardware engine reads the data from the source memory and writes the data to the target memory. In response to the reading being completed, the first hardware engine transmits a data clearing request to a second hardware engine that is configured to access the source memory. The data clearing request specifies a location of the data in the source memory to be cleared.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: March 29, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Scot Rider, Marcel Schaal
  • Patent number: 11169848
    Abstract: A computer implemented method and system for managing power in a 3D chip stack formed of multiple memory layers each having a plurality memory banks and a plurality of Through-Silicon-Vias (TSVs) connecting the memory banks. The TSVs are arranged in a plurality of subsets, each subset of TSVs connecting a corresponding vertical stack of memory banks aligned across a plurality of memory layers. The method includes determining a power delivery budget for each subset of TSVs connecting the corresponding vertical stack of memory banks based on memory requests, keeping track of memory requests to the memory banks of each vertical stack of memory banks and scheduling the memory requests to the memory banks of each vertical stack of memory banks based on the power budget. The memory controller is configured with a scorecard scheduler to manage the memory requests based on the power budget.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: November 9, 2021
    Assignee: International Business Machines Corporation
    Inventors: Philip Jacob, James P. Coghlan, Michael Grassi, Kirk Pospesel, Marcel Schaal, Douglas J. Joseph
  • Publication number: 20200285512
    Abstract: A computer implemented method and system for managing power in a 3D chip stack formed of multiple memory layers each having a plurality memory banks and a plurality of Through-Silicon-Vias (TSVs) connecting the memory banks. The TSVs are arranged in a plurality of subsets, each subset of TSVs connecting a corresponding vertical stack of memory banks aligned across a plurality of memory layers. The method includes determining a power delivery budget for each subset of TSVs connecting the corresponding vertical stack of memory banks based on memory requests, keeping track of memory requests to the memory banks of each vertical stack of memory banks and scheduling the memory requests to the memory banks of each vertical stack of memory banks based on the power budget. The memory controller is configured with a scorecard scheduler to manage the memory requests based on the power budget.
    Type: Application
    Filed: January 14, 2020
    Publication date: September 10, 2020
    Inventors: Philip Jacob, James P. Coghlan, Michael Grassi, Kirk Pospesel, Marcel Schaal, Douglas J. Joseph
  • Patent number: 10579425
    Abstract: A computer implemented method and system for managing power in a 3D chip stack formed of multiple memory layers each having a plurality memory banks and a plurality of Through-Silicon-Vias (TSVs) connecting the memory banks. The TSVs are arranged in a plurality of subsets, each subset of TSVs connecting a corresponding vertical stack of memory banks aligned across a plurality of memory layers. The method includes determining a power delivery budget for each subset of TSVs connecting the corresponding vertical stack of memory banks based on memory requests, keeping track of memory requests to the memory banks of each vertical stack of memory banks and scheduling the memory requests to the memory banks of each vertical stack of memory banks based on the power budget. The memory controller is configured with a scorecard scheduler to manage the memory requests based on the power budget.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: March 3, 2020
    Assignee: International Business Machines Corporation
    Inventors: Philip Jacob, James P. Coghlan, Michael Grassi, Kirk Pospesel, Marcel Schaal, Douglas J. Joseph