Abstract: Provided are embodiments for a computer-implemented method, system and computer program product for identifying dependencies in a control sequence. Embodiments include receiving a control block that comprises a first error dependency (EDEP) level, maintaining the first EDEP level, and determining whether the received control block was successfully executed. Embodiments also include receiving a subsequent control block that comprises a second EDEP level, comparing the first EDEP level and the second EDEP level, and providing the subsequent control block for execution based at least in part on the successful execution of the received control block, and on the second EDEP level being less than or equal to the first EDEP level.

Abstract: Provided are embodiments for a computer-implemented method, system and computer program product for identifying dependencies in a control sequence. Embodiments include receiving a control block that comprises a first error dependency (EDEP) level, maintaining the first EDEP level, and determining whether the received control block was successfully executed. Embodiments also include receiving a subsequent control block that comprises a second EDEP level, comparing the first EDEP level and the second EDEP level, and providing the subsequent control block for execution based at least in part on the successful execution of the received control block, and on the second EDEP level being less than or equal to the first EDEP level.

Abstract: Aspects include receiving a request from a requesting system to move data from a source memory on a source system to a target memory on a target system. The receiving is at a first hardware engine configured to access the source memory and the target memory. In response to receiving the request, the first hardware engine reads the data from the source memory and writes the data to the target memory. In response to the reading being completed, the first hardware engine transmits a data clearing request to a second hardware engine that is configured to access the source memory. The data clearing request specifies a location of the data in the source memory to be cleared.

Abstract: A computer implemented method and system for managing power in a 3D chip stack formed of multiple memory layers each having a plurality memory banks and a plurality of Through-Silicon-Vias (TSVs) connecting the memory banks. The TSVs are arranged in a plurality of subsets, each subset of TSVs connecting a corresponding vertical stack of memory banks aligned across a plurality of memory layers. The method includes determining a power delivery budget for each subset of TSVs connecting the corresponding vertical stack of memory banks based on memory requests, keeping track of memory requests to the memory banks of each vertical stack of memory banks and scheduling the memory requests to the memory banks of each vertical stack of memory banks based on the power budget. The memory controller is configured with a scorecard scheduler to manage the memory requests based on the power budget.

Abstract: A computer implemented method and system for managing power in a 3D chip stack formed of multiple memory layers each having a plurality memory banks and a plurality of Through-Silicon-Vias (TSVs) connecting the memory banks. The TSVs are arranged in a plurality of subsets, each subset of TSVs connecting a corresponding vertical stack of memory banks aligned across a plurality of memory layers. The method includes determining a power delivery budget for each subset of TSVs connecting the corresponding vertical stack of memory banks based on memory requests, keeping track of memory requests to the memory banks of each vertical stack of memory banks and scheduling the memory requests to the memory banks of each vertical stack of memory banks based on the power budget. The memory controller is configured with a scorecard scheduler to manage the memory requests based on the power budget.

Abstract: A computer implemented method and system for managing power in a 3D chip stack formed of multiple memory layers each having a plurality memory banks and a plurality of Through-Silicon-Vias (TSVs) connecting the memory banks. The TSVs are arranged in a plurality of subsets, each subset of TSVs connecting a corresponding vertical stack of memory banks aligned across a plurality of memory layers. The method includes determining a power delivery budget for each subset of TSVs connecting the corresponding vertical stack of memory banks based on memory requests, keeping track of memory requests to the memory banks of each vertical stack of memory banks and scheduling the memory requests to the memory banks of each vertical stack of memory banks based on the power budget. The memory controller is configured with a scorecard scheduler to manage the memory requests based on the power budget.