Abstract: Certain example embodiments relate to sputtering apparatuses that include a plurality of targets such that a first one or ones of target(s) may be used for sputtering in a first mode, while a second one or ones of target(s) may be used for sputtering in a second mode. Modes may be switched in certain example embodiments by rotating the position of the targets, e.g., such that one or more target(s) to be used protrude into the main chamber of the apparatus, while one or more target(s) to be unused are recessed into a body portion of a cathode of (e.g., integrally formed with) the sputtering apparatus. The targets may be cylindrical magnetic targets or planar targets. At least one target location also may be made to accommodate an ion beam source.

Abstract: Certain example embodiments relate to sputtering apparatuses that include a plurality of targets such that a first one or ones of target(s) may be used for sputtering in a first mode, while a second one or ones of target(s) may be used for sputtering in a second mode. Modes may be switched in certain example embodiments by rotating the position of the targets, e.g., such that one or more target(s) to be used protrude into the main chamber of the apparatus, while one or more target(s) to be unused are recessed into a body portion of a cathode of (e.g., integrally formed with) the sputtering apparatus. The targets may be cylindrical magnetic targets or planar targets. At least one target location also may be made to accommodate an ion beam source.

Abstract: Certain example embodiments relate to sputtering apparatuses that include a plurality of targets such that a first one or ones of target(s) may be used for sputtering in a first mode, while a second one or ones of target(s) may be used for sputtering in a second mode. Modes may be switched in certain example embodiments by rotating the position of the targets, e.g., such that one or more target(s) to be used protrude into the main chamber of the apparatus, while one or more target(s) to be unused are recessed into a body portion of a cathode of (e.g., integrally formed with) the sputtering apparatus. The targets may be cylindrical magnetic targets or planar targets. At least one target location also may be made to accommodate an ion beam source.

Abstract: An endblock for a rotatable sputtering target, such as a rotatable magnetron sputtering target, is provided. A sputtering apparatus, including one or more such endblock(s), includes locating the electrical contact(s) (e.g., brush(es)) between the collector and rotor in the endblock(s) in an area under vacuum (as opposed to in an area at atmospheric pressure).

Abstract: An endblock for a rotatable sputtering target, such as a rotatable magnetron sputtering target, is provided. A sputtering apparatus, including one or more such endblock(s), includes locating the electrical contact(s) (e.g., brush(es)) between the collector and rotor in the endblock(s) in an area under vacuum (as opposed to in an area at atmospheric pressure).

Abstract: An endblock for a rotatable sputtering target, such as a rotatable magnetron sputtering target, is provided. A sputtering apparatus, including one or more such endblock(s), includes locating the electrical contact(s) (e.g., brush(es)) between the collector and rotor in the endblock(s) in an area under vacuum (as opposed to in an area at atmospheric pressure).

Abstract: A method of making an insulating glass (IG) window unit includes: having a coated article including a multi-layered low-E coating on a glass substrate; at least two flexible protective sheets adhered to a top surface of the low-E coating via at least an adhesive layer, and a protective coating over the low-E coating and/or over at least one of the flexible protective sheets in order to substantially fill one or more gaps formed between the low-E coating and the flexible protective sheet(s) and/or between the flexible protective sheets; and following cutting, edge seaming, and/or washing, removing at least part of the temporary protective coating by peeling the protective sheets off and removing at least part of the protective coating when peeling off the protective sheets.

Abstract: A method of making an insulating glass (IG) window unit includes: having a coated article including a multi-layered low-E coating on a glass substrate; at least two flexible protective sheets adhered to a top surface of the low-E coating via at least an adhesive layer, and a protective coating over the low-E coating and/or over at least one of the flexible protective sheets in order to substantially fill one or more gaps formed between the low-E coating and the flexible protective sheet(s) and/or between the flexible protective sheets; and following cutting, edge seaming, and/or washing, removing at least part of the temporary protective coating by peeling the protective sheets off and removing at least part of the protective coating when peeling off the protective sheets.

Abstract: In certain example embodiments of this invention, there is provided a method of making a window, the method including: forming a multi-layered low-E and/or solar control coating on a glass substrate; providing at least two flexible protective sheets in non-liquid form to the glass substrate over at least part of the low-E and/or solar control coating; applying at least one protective coating in liquid form, before and/or after the flexible protective sheets are provided, so as to reduce one or more gaps formed between the low-E and/or solar control coating and the flexible protective sheet(s) and/or between the flexible protective sheets; and performing one or more of cutting, edge seaming, and/or washing the coated article with the protective coating and protective sheets thereon and peeling the protective sheets and at least part of the protective coating off of the top surface of the low-E and/or solar control coating. Heat treatment (e.g.

Abstract: Certain example embodiments relate to sputtering apparatuses that include a plurality of targets such that a first one or ones of target(s) may be used for sputtering in a first mode, while a second one or ones of target(s) may be used for sputtering in a second mode. Modes may be switched in certain example embodiments by rotating the position of the targets, e.g., such that one or more target(s) to be used protrude into the main chamber of the apparatus, while one or more target(s) to be unused are recessed into a body portion of a cathode of (e.g., integrally formed with) the sputtering apparatus. The targets may be cylindrical magnetic targets or planar targets. At least one target location also may be made to accommodate an ion beam source.

Abstract: In certain example embodiments of this invention, there is provided a method of making a window, the method including: forming a multi-layered low-E and/or solar control coating on a glass substrate; providing at least two flexible protective sheets in non-liquid form to the glass substrate over at least part of the low-E and/or solar control coating; applying at least one protective coating in liquid form, before and/or after the flexible protective sheets are provided, so as to reduce one or more gaps formed between the low-E and/or solar control coating and the flexible protective sheet(s) and/or between the flexible protective sheets; and performing one or more of cutting, edge seaming, and/or washing the coated article with the protective coating and protective sheets thereon and peeling the protective sheets and at least part of the protective coating off of the top surface of the low-E and/or solar control coating. Heat treatment (e.g.

Abstract: A sputter coating apparatus includes at least a first sputter coating line and a second sputter coating line. The first and second sputter coating lines may be operated in parallel with one another in certain embodiments in order to independently form coating systems and respective coated articles. However, the two coating lines may also be utilized so as to operate in series with one another to form a coated article. In the latter case, a transition zone is provided between an end of the first line and an end of the second line so as to selectively couple an output of the first line to an input of the second line when it is desired to utilize the two sputter coating lines in series with one another. In such a manner, it is possible to avoid many of the inefficiencies associated with conventional sputter coating apparatuses and processes.

Abstract: A sputter coating apparatus includes at least a first sputter coating line and a second sputter coating line. The first and second sputter coating lines may be operated in parallel with one another in certain embodiments in order to independently form coating systems and respective coated articles. However, the two coating lines may also be utilized so as to operate in series with one another to form a coated article. In the latter case, a transition zone is provided between an end of the first line and an end of the second line so as to selectively couple an output of the first line to an input of the second line when it is desired to utilize the two sputter coating lines in series with one another. In such a manner, it is possible to avoid many of the inefficiencies associated with conventional sputter coating apparatuses and processes.

Abstract: A sputter coating apparatus includes at least a first sputter coating line and a second sputter coating line. The first and second sputter coating lines may be operated in parallel with one another in certain embodiments in order to independently form coating systems and respective coated articles. However, the two coating lines may also be utilized so as to operate in series with one another to form a coated article. In the latter case, a transition zone is provided between an end of the first line and an end of the second line so as to selectively couple an output of the first line to an input of the second line when it is desired to utilize the two sputter coating lines in series with one another. In such a manner, it is possible to avoid many of the inefficiencies associated with conventional sputter coating apparatuses and processes.