Abstract: A semiconductor device comprising a substrate, a first integrated circuit package mounted on the substrate, the first integrated circuit package comprising a first antenna sub-array having a uniform pitch, and a second integrated circuit package mounted on the substrate, the second integrated circuit package comprising a second antenna sub-array having a uniform pitch. The second integrated circuit package is mounted adjacent to the first integrated circuit package to form a multi-package module having an antenna array formed of the first antenna sub-array and the second antenna sub-array, wherein the antenna array has a uniform pitch. Also provided is a method of manufacturing a multi-package module and a method of providing package-to-package grounding.

Abstract: Embodiments are provided for a multi-die packaged semiconductor device including: a panel of embedded dies including a plurality of radio frequency (RF) dies, wherein each RF die includes RF front-end circuitry, each RF die has an active side that includes a plurality of pads, each RF die has a back side exposed in a back side of the panel; a plurality of antenna connectors formed on a subset of the plurality of pads of each RF die; and an array of antennas formed over a front side of the panel and connected to the plurality of antenna connectors.

Abstract: Embodiments are provided for a multi-die packaged semiconductor device including: a panel of embedded dies including a plurality of radio frequency (RF) dies, wherein each RF die includes RF front-end circuitry, each RF die has an active side that includes a plurality of pads, each RF die has a back side exposed in a back side of the panel; a plurality of antenna connectors formed on a subset of the plurality of pads of each RF die; and an array of antennas formed over a front side of the panel and connected to the plurality of antenna connectors.

Abstract: A down-converter for receiving a multiband radio frequency signal (RF) and a local oscillator signal comprises a frequency divider and a heterodyne receive chain. The frequency divider is configured to divide the local oscillator signal and provide different divided local oscillator signals. The heterodyne receive chain comprises a first stage mixer and second stage mixers. The first stage mixer is configured to mix the multiband radio frequency signal and either the local oscillator signal or a divided local oscillator signal to generate a first intermediate frequency signal. Each second stage mixer is configured to mix the first intermediate signal and a divided local oscillator signal to generate second intermediate frequency signals that each represent a band from the multiband radio frequency signal. The frequency divider is configured to provide a different divided local oscillator signal to each of the second stage mixers.

Abstract: A down-converter for receiving a multiband radio frequency signal (RF) and a local oscillator signal comprises a frequency divider and a heterodyne receive chain. The frequency divider is configured to divide the local oscillator signal and provide different divided local oscillator signals. The heterodyne receive chain comprises a first stage mixer and second stage mixers. The first stage mixer is configured to mix the multiband radio frequency signal and either the local oscillator signal or a divided local oscillator signal to generate a first intermediate frequency signal. Each second stage mixer is configured to mix the first intermediate signal and a divided local oscillator signal to generate second intermediate frequency signals that each represent a band from the multiband radio frequency signal. The frequency divider is configured to provide a different divided local oscillator signal to each of the second stage mixers.