Patents by Inventor Marcelo Schupbach
Marcelo Schupbach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11888392Abstract: A power converter module includes an active metal braze (AMB) substrate, power converter circuitry, and a housing. The AMB substrate includes an aluminum nitride base layer, a first conductive layer on a first surface of the aluminum nitride base layer, and a second conductive layer on a second surface of the aluminum nitride base layer opposite the first surface. The power converter circuitry includes a number of silicon carbide switching components coupled to one another via the first conductive layer. The housing is over the power converter circuitry and the AMB substrate. By using an AMB substrate with an aluminum nitride base layer, the thermal dissipation characteristics of the power converter module may be substantially improved while maintaining the structural integrity of the power converter module.Type: GrantFiled: April 17, 2020Date of Patent: January 30, 2024Assignee: Wolfspeed, Inc.Inventors: Mrinal K. Das, Adam Barkley, Henry Lin, Marcelo Schupbach
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Publication number: 20200244164Abstract: A power converter module includes an active metal braze (AMB) substrate, power converter circuitry, and a housing. The AMB substrate includes an aluminum nitride base layer, a first conductive layer on a first surface of the aluminum nitride base layer, and a second conductive layer on a second surface of the aluminum nitride base layer opposite the first surface. The power converter circuitry includes a number of silicon carbide switching components coupled to one another via the first conductive layer. The housing is over the power converter circuitry and the AMB substrate. By using an AMB substrate with an aluminum nitride base layer, the thermal dissipation characteristics of the power converter module may be substantially improved while maintaining the structural integrity of the power converter module.Type: ApplicationFiled: April 17, 2020Publication date: July 30, 2020Inventors: Mrinal K. Das, Adam Barkley, Henry Lin, Marcelo Schupbach
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Patent number: 10680518Abstract: A power converter module includes an active metal braze (AMB) substrate, power converter circuitry, and a housing. The AMB substrate includes an aluminum nitride base layer, a first conductive layer on a first surface of the aluminum nitride base layer, and a second conductive layer on a second surface of the aluminum nitride base layer opposite the first surface. The power converter circuitry includes a number of silicon carbide switching components coupled to one another via the first conductive layer. The housing is over the power converter circuitry and the AMB substrate. By using an AMB substrate with an aluminum nitride base layer, the thermal dissipation characteristics of the power converter module may be substantially improved while maintaining the structural integrity of the power converter module.Type: GrantFiled: February 29, 2016Date of Patent: June 9, 2020Assignee: Cree, Inc.Inventors: Mrinal K. Das, Adam Barkley, Henry Lin, Marcelo Schupbach
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Publication number: 20200177079Abstract: A power converter module includes an active metal braze (AMB) substrate, power converter circuitry, and a housing. The AMB substrate includes an aluminum nitride base layer, a first conductive layer on a first surface of the aluminum nitride base layer, and a second conductive layer on a second surface of the aluminum nitride base layer opposite the first surface. The power converter circuitry includes a number of silicon carbide switching components coupled to one another via the first conductive layer. The housing is over the power converter circuitry and the AMB substrate. By using an AMB substrate with an aluminum nitride base layer, the thermal dissipation characteristics of the power converter module may be substantially improved while maintaining the structural integrity of the power converter module.Type: ApplicationFiled: February 7, 2020Publication date: June 4, 2020Inventors: Mrinal K. Das, Adam Barkley, Henry Lin, Marcelo Schupbach
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Patent number: 10269955Abstract: A vertical FET includes a silicon carbide substrate having a top surface and a bottom surface opposite the top surface; a drain/collector contact on the bottom surface of the silicon carbide substrate; and an epitaxial structure on the top surface of the silicon carbide substrate having formed therein a first source/emitter implant. A gate dielectric is provided on a portion of the epitaxial structure. First source/emitter contact segments are spaced apart from each other and on the first source/emitter implant. A first elongated gate contact and a second elongated gate contact are on the gate dielectric and positioned such that the first source/emitter implant is below and between the first elongated gate contact and the second elongated gate contact. Inter-gate plates extend from at least one of the first elongated gate contact and the second elongated gate contact into spaces formed between the first source/emitter contact segments.Type: GrantFiled: January 17, 2017Date of Patent: April 23, 2019Assignee: Cree, Inc.Inventors: Sei-Hyung Ryu, Marcelo Schupbach, Adam Barkley, Scott Allen
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Patent number: 10224810Abstract: A power converter module includes a baseplate, a substrate on the baseplate, one or more silicon carbide switching components on the substrate, and a housing over the baseplate, the substrate, and the one or more silicon carbide switching components. The housing has a footprint less than 25 cm2. Including a baseplate in a power converter module with a footprint less than 25 cm2 runs counter to accepted design principles for silicon and silicon carbide-based power converter modules, but may improve performance of the power converter module and/or decrease the cost of the power converter module.Type: GrantFiled: October 17, 2016Date of Patent: March 5, 2019Assignee: Cree, Inc.Inventors: Adam Barkley, Marcelo Schupbach
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Patent number: 10141302Abstract: A power module includes a housing with an interior chamber and multiple switch modules mounted within the interior chamber of the housing. The switch modules are interconnected and configured to facilitate switching power to a load. Each one of the switch modules includes at least one transistor and at least one diode. The at least one transistor and the at least one diode may be formed from a wide band-gap material system, such as silicon carbide (SiC), thereby allowing the power module to operate at high frequencies with lower switching losses when compared to conventional power modules.Type: GrantFiled: March 22, 2016Date of Patent: November 27, 2018Assignee: Cree, Inc.Inventors: Mrinal K. Das, Henry Lin, Marcelo Schupbach, John Williams Palmour
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Publication number: 20180204945Abstract: A vertical FET includes a silicon carbide substrate having a top surface and a bottom surface opposite the top surface; a drain/collector contact on the bottom surface of the silicon carbide substrate; and an epitaxial structure on the top surface of the silicon carbide substrate having formed therein a first source/emitter implant. A gate dielectric is provided on a portion of the epitaxial structure. First source/emitter contact segments are spaced apart from each other and on the first source/emitter implant. A first elongated gate contact and a second elongated gate contact are on the gate dielectric and positioned such that the first source/emitter implant is below and between the first elongated gate contact and the second elongated gate contact. Inter-gate plates extend from at least one of the first elongated gate contact and the second elongated gate contact into spaces formed between the first source/emitter contact segments.Type: ApplicationFiled: January 17, 2017Publication date: July 19, 2018Inventors: Sei-Hyung Ryu, Marcelo Schupbach, Adam Barkley, Scott Allen
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Patent number: 9906137Abstract: AC to DC power electronic converter circuitry includes isolated converter circuitry and control circuitry coupled to the isolated converter circuitry. The isolated converter circuitry includes one or more wide bandgap switching components. The control circuitry is configured to drive at least one of the wide bandgap switching components such that the power electronic converter circuitry is configured to generate a DC output with an output power greater than 100W at an efficiency greater than 92%. Using wide bandgap components in the isolated converter circuitry allows the power electronic converter circuitry to achieve a high efficiency and high power density.Type: GrantFiled: September 23, 2014Date of Patent: February 27, 2018Assignee: Cree, Inc.Inventors: Adam Barkley, XueChao Liu, Marcelo Schupbach
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Publication number: 20170040890Abstract: A power converter module includes a baseplate, a substrate on the baseplate, one or more silicon carbide switching components on the substrate, and a housing over the baseplate, the substrate, and the one or more silicon carbide switching components. The housing has a footprint less than 25 cm2. Including a baseplate in a power converter module with a footprint less than 25 cm2 runs counter to accepted design principles for silicon and silicon carbide-based power converter modules, but may improve performance of the power converter module and/or decrease the cost of the power converter module.Type: ApplicationFiled: October 17, 2016Publication date: February 9, 2017Inventors: Adam Barkley, Marcelo Schupbach
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Publication number: 20160276927Abstract: A power converter module includes an active metal braze (AMB) substrate, power converter circuitry, and a housing. The AMB substrate includes an aluminum nitride base layer, a first conductive layer on a first surface of the aluminum nitride base layer, and a second conductive layer on a second surface of the aluminum nitride base layer opposite the first surface. The power converter circuitry includes a number of silicon carbide switching components coupled to one another via the first conductive layer. The housing is over the power converter circuitry and the AMB substrate. By using an AMB substrate with an aluminum nitride base layer, the thermal dissipation characteristics of the power converter module may be substantially improved while maintaining the structural integrity of the power converter module.Type: ApplicationFiled: February 29, 2016Publication date: September 22, 2016Inventors: Mrinal K. Das, Adam Barkley, Henry Lin, Marcelo Schupbach
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Patent number: 9435819Abstract: A turbine environment wireless transmitter for monitoring bearing health inside jet turbines. This transmitter has the ability to operate in 225 to 300 degree Celsius environments and monitor real time bearing temperature and vibration and transmit that data to a centralized system for processing. The system is powered by a built in thermal electric generator, which produces power in response to a thermal gradient across it. The information transmitted is used to monitor and diagnose a bearing operating parameters in real-time and predict a failure event before any damage occurs.Type: GrantFiled: April 29, 2013Date of Patent: September 6, 2016Assignee: Cree Fayetteville, Inc.Inventors: John Fraley, Bryon Western, Roberto Marcelo Schupbach
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Publication number: 20160204101Abstract: A power module includes a housing with an interior chamber and multiple switch modules mounted within the interior chamber of the housing. The switch modules are interconnected and configured to facilitate switching power to a load. Each one of the switch modules includes at least one transistor and at least one diode. The at least one transistor and the at least one diode may be formed from a wide band-gap material system, such as silicon carbide (SiC), thereby allowing the power module to operate at high frequencies with lower switching losses when compared to conventional power modules.Type: ApplicationFiled: March 22, 2016Publication date: July 14, 2016Inventors: Mrinal K. Das, Henry Lin, Marcelo Schupbach, John Williams Palmour
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Patent number: 9373617Abstract: A power module includes a housing with an interior chamber and multiple switch modules mounted within the interior chamber of the housing. The switch modules are interconnected and configured to facilitate switching power to a load. Each one of the switch modules includes at least one transistor and at least one diode. The at least one transistor and the at least one diode may be formed from a wide band-gap material system, such as silicon carbide (SiC), thereby allowing the power module to operate at high frequencies with lower switching losses when compared to conventional power modules.Type: GrantFiled: May 15, 2014Date of Patent: June 21, 2016Assignee: Cree, Inc.Inventors: Mrinal K. Das, Henry Lin, Marcelo Schupbach, John Williams Palmour
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Publication number: 20160087537Abstract: AC to DC power electronic converter circuitry includes isolated converter circuitry and control circuitry coupled to the isolated converter circuitry. The isolated converter circuitry includes one or more wide bandgap switching components. The control circuitry is configured to drive at least one of the wide bandgap switching components such that the power electronic converter circuitry is configured to generate a DC output with an output power greater than 100W at an efficiency greater than 92%. Using wide bandgap components in the isolated converter circuitry allows the power electronic converter circuitry to achieve a high efficiency and high power density.Type: ApplicationFiled: September 23, 2014Publication date: March 24, 2016Inventors: Adam Barkley, XueChao Liu, Marcelo Schupbach
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Patent number: 9095054Abstract: A four quadrant power module with lower substrate parallel power paths and upper substrate equidistant clock tree timing utilizing parallel leg construction in a captive fastener power module housing.Type: GrantFiled: October 15, 2013Date of Patent: July 28, 2015Assignee: Arkansas Power Electronics International, Inc.Inventors: Jack Bourne, Jared Hornberger, Alex Lostetter, Brice McPherson, Ty McNutt, Brad Reese, Marcelo Schupbach, Robert Shaw, Eric Cole, Leonard Schaper
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Patent number: 8952674Abstract: A voltage regulator circuitry (50) adapted to operate in a high-temperature environment of a turbine engine is provided. The voltage regulator may include a constant current source (52) including a first semiconductor switch (54) and a first resistor (56) connected between a gate terminal (G) and a source terminal (S) of the first semiconductor switch. A second resistor (58) is connected to the gate terminal of the first semiconductor switch (54) and to an electrical ground (64). The constant current source is coupled to generate a voltage reference across the second resistor 58. A source follower output stage 66 may include a second semiconductor switch (68) and a third resistor (58) connected between the electrical ground and a source terminal of the second semiconductor switch. The generated voltage reference is applied to a gating terminal of the second semiconductor switch (58).Type: GrantFiled: June 29, 2012Date of Patent: February 10, 2015Assignees: Siemens Energy, Inc., Arkansas Power Electronics International, Inc.Inventors: David J. Mitchell, John R. Fraley, Jie Yang, Cora Schillig, Bryon Western, Roberto Marcelo Schupbach
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Publication number: 20140246681Abstract: A power module includes a housing with an interior chamber and multiple switch modules mounted within the interior chamber of the housing. The switch modules are interconnected and configured to facilitate switching power to a load. Each one of the switch modules includes at least one transistor and at least one diode. The at least one transistor and the at least one diode may be formed from a wide band-gap material system, such as silicon carbide (SiC), thereby allowing the power module to operate at high frequencies with lower switching losses when compared to conventional power modules.Type: ApplicationFiled: May 15, 2014Publication date: September 4, 2014Applicant: Cree, Inc.Inventors: Mrinal K. Das, Henry Lin, Marcelo Schupbach, John Williams Palmour
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Patent number: 8803703Abstract: A circuitry adapted to operate in a high-temperature environment of a turbine engine is provided. A relatively high-gain differential amplifier (102) may have an input terminal coupled to receive a voltage indicative of a sensed parameter of a component (20) of the turbine engine. A hybrid load circuitry may be coupled to the differential amplifier. A voltage regulator circuitry (244) may be coupled to power the differential amplifier. The differential amplifier, the hybrid load circuitry and the voltage regulator circuitry may each be disposed in the high-temperature environment of the turbine engine.Type: GrantFiled: July 12, 2012Date of Patent: August 12, 2014Assignees: Siemens Energy, Inc., Arkansas Power Electronics International, Inc.Inventors: David J. Mitchell, John R. Fraley, Jie Yang, Cora Schillig, Bryon Western, Roberto Marcelo Schupbach
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Patent number: 8766720Abstract: A circuitry (120) adapted to operate in a high-temperature environment of a turbine engine is provided. The circuitry may include a differential amplifier (122) having an input terminal (124) coupled to a sensing element to receive a voltage indicative of a sensed parameter. A hybrid load circuitry (125) may be AC-coupled to the differential amplifier. The hybrid load circuitry may include a resistor-capacitor circuit (134) arranged to provide a path to an AC signal component with respect to the drain terminal of the switch (e.g., 126) of a differential pair of semiconductor switches 126, 128, which receives the voltage indicative of the sensed parameter.Type: GrantFiled: June 29, 2012Date of Patent: July 1, 2014Assignee: Siemens Energy, Inc.Inventors: David J. Mitchell, John R. Fraley, Jie Yang, Cora Schillig, Roberto Marcelo Schupbach, Bryon Western