Abstract: A method of unloading an object from a support table, the object clamped to the support table during an exposure process by: applying a first pressure to a central region of the support table under a central portion of the object; and applying a second pressure to a peripheral region of the support table under a peripheral portion of the object, wherein during clamping the first pressure and the second pressure are controlled such that liquid is retained between the object and a seal member that is positioned radially between the central region and the peripheral region at an upper surface of the support table and protrudes towards the object, the method including: increasing the first pressure towards ambient pressure; removing at least some of the liquid retained between the object and the seal member by decreasing the second pressure; and increasing the second pressure towards the ambient pressure.

Abstract: A substrate support system is provided that includes: a support part configured to support a bottom surface of a substrate on a support plane; a moveable part moveable between a retracted position, in which a top end of the moveable part is below the support plane, and an extended position, in which the top end of the moveable part is above the support plane, such that the top end supports the bottom surface of the substrate above the support plane in the extended position; and a measurement system configured to measure a time taken for the moveable part to move from the retracted position to the extended position, to compare the measured time with a reference time, and to generate a signal when the measured time deviates from the reference time by more than a predetermined amount.

Abstract: A method of unloading an object from a support table, the object clamped to the support table during an exposure process by: applying a first pressure to a central region of the support table under a central portion of the object; and applying a second pressure to a peripheral region of the support table under a peripheral portion of the object, wherein during clamping the first pressure and the second pressure are controlled such that liquid is retained between the object and a seal member that is positioned radially between the central region and the peripheral region at an upper surface of the support table and protrudes towards the object, the method including: increasing the first pressure towards ambient pressure; removing at least some of the liquid retained between the object and the seal member by decreasing the second pressure; and increasing the second pressure towards the ambient pressure.

Abstract: A method of unloading an object from a support table, the object clamped to the support table during an exposure process by: applying a first pressure to a central region of the support table under a central portion of the object; and applying a second pressure to a peripheral region of the support table under a peripheral portion of the object, wherein during clamping the first pressure and the second pressure are controlled such that liquid is retained between the object and a seal member that is positioned radially between the central region and the peripheral region at an upper surface of the support table and protrudes towards the object, the method including: increasing the first pressure towards ambient pressure; removing at least some of the liquid retained between the object and the seal member by decreasing the second pressure; and increasing the second pressure towards the ambient pressure.

Abstract: A method of unloading an object from a support table, the object clamped to the support table during an exposure process by: applying a first pressure to a central region of the support table under a central portion of the object; and applying a second pressure to a peripheral region of the support table under a peripheral portion of the object, wherein during clamping the first pressure and the second pressure are controlled such that liquid is retained between the object and a seal member that is positioned radially between the central region and the peripheral region at an upper surface of the support table and protrudes towards the object, the method including: increasing the first pressure towards ambient pressure; removing at least some of the liquid retained between the object and the seal member by decreasing the second pressure; and increasing the second pressure towards the ambient pressure.

Abstract: A method of unloading an object from a support table, the object clamped to the support table during an exposure process by: applying a first pressure to a central region of the support table under a central portion of the object; and applying a second pressure to a peripheral region of the support table under a peripheral portion of the object, wherein during clamping the first pressure and the second pressure are controlled such that liquid is retained between the object and a seal member that is positioned radially between the central region and the peripheral region at an upper surface of the support table and protrudes towards the object, the method including: increasing the first pressure towards ambient pressure; removing at least some of the liquid retained between the object and the seal member by decreasing the second pressure; and increasing the second pressure towards the ambient pressure.

Abstract: A method of unloading an object from a support table, the object clamped to the support table during an exposure process by: applying a first pressure to a central region of the support table under a central portion of the object; and applying a second pressure to a peripheral region of the support table under a peripheral portion of the object, wherein during clamping the first pressure and the second pressure are controlled such that liquid is retained between the object and a seal member that is positioned radially between the central region and the peripheral region at an upper surface of the support table and protrudes towards the object, the method including: increasing the first pressure towards ambient pressure; removing at least some of the liquid retained between the object and the seal member by decreasing the second pressure; and increasing the second pressure towards the ambient pressure.

Abstract: A substrate support, includes: a substrate support location configured to support a substrate, and a vacuum clamping device configured to clamp the substrate on the substrate support location, wherein the vacuum clamping device includes at least one reduced pressure source to create a reduced pressure, at least one vacuum section connected to the at least one reduced pressure source, wherein the at least one vacuum section is configured to attract the substrate towards the substrate support location, and a control device configured to control a spatial pressure profile along the at least one vacuum section with which the substrate is attracted by the vacuum clamping device, wherein the control device includes a substrate shape data input to receive substrate shape data representing shape data of the substrate to be clamped, and wherein the control device is configured to adapt the spatial pressure profile in dependency of the substrate shape data.

Abstract: A support table to support a surface of a substrate, wherein the support table includes: a base surface substantially parallel to the surface of the substrate, a plurality of burls protruding above the base surface, each of the burls having a respective distal end and a first height above the base surface, the burls arranged such that, when the substrate is supported by the support table, the substrate is supported by the respective distal ends, and a plurality of elongate raised protrusions separated by gaps, each of the elongate raised protrusions having a second height above the base surface, wherein the elongate raised protrusions protrude above the base surface between the burls, and the second height is less than the first height; wherein the protrusions are arranged such that a plurality of the gaps are aligned to form a straight gas flow path towards an edge of the base surface.

Abstract: A substrate support, includes: a substrate support location configured to support a substrate, and a vacuum clamping device configured to clamp the substrate on the substrate support location, wherein the vacuum clamping device includes at least one reduced pressure source to create a reduced pressure, at least one vacuum section connected to the at least one reduced pressure source, wherein the at least one vacuum section is configured to attract the substrate towards the substrate support location, and a control device configured to control a spatial pressure profile along the at least one vacuum section with which the substrate is attracted by the vacuum clamping device, wherein the control device includes a substrate shape data input to receive substrate shape data representing shape data of the substrate to be clamped, and wherein the control device is configured to adapt the spatial pressure profile in dependency of the substrate shape data.

Abstract: A support table to support a surface of a substrate, wherein the support table includes: a base surface substantially parallel to the surface of the substrate, a plurality of burls protruding above the base surface, each of the burls having a respective distal end and a first height above the base surface, the burls arranged such that, when the substrate is supported by the support table, the substrate is supported by the respective distal ends, and a plurality of elongate raised protrusions separated by gaps, each of the elongate raised protrusions having a second height above the base surface, wherein the elongate raised protrusions protrude above the base surface between the burls, and the second height is less than the first height; wherein the protrusions are arranged such that a plurality of the gaps are aligned to form a straight gas flow path towards an edge of the base surface.

Abstract: A calibration method for calibrating an optimum take over height of a substrate in a lithographic apparatus between a substrate table and an ejector element moveable to load and unload the substrate from the substrate table, the method including clamping the substrate on one of the substrate table and ejector element; moving the ejector element between an unloaded state wherein the substrate is supported by the substrate table and a loaded state wherein the substrate is at least partly supported by the ejector element; determining a reference height of the ejector element at the moment that the weight of the substrate is at least partly taken over between the substrate table and the ejector element; and determining the optimum take over height for the ejector element from the determined reference height.

Abstract: A method of placing a substrate onto a surface of a substrate holder, in which the surface is provided with a plurality of burls. Substrate placement data for allowing placement of the substrate at a certain position with respect to a position of the plurality of burls on the surface of the substrate holder is calculated. The substrate is placed at the certain position in accordance with the substrate placement data. The certain position may be based on the position at which placement would result in a minimized overlay error or may be based on the position at which placement would result in minimized substrate deformation.

Abstract: A method of placing a substrate onto a surface of a substrate holder, in which the surface is provided with a plurality of burls. Substrate placement data for allowing placement of the substrate at a certain position with respect to a position of the plurality of burls on the surface of the substrate holder is calculated. The substrate is placed at the certain position in accordance with the substrate placement data. The certain position may be based on the position at which placement would result in a minimized overlay error or may be based on the position at which placement would result in minimized substrate deformation.

Abstract: A calibration method for calibrating an optimum take over height of a substrate in a lithographic apparatus between a substrate table and an ejector element moveable to load and unload the substrate from the substrate table, the method including clamping the substrate on one of the substrate table and ejector element; moving the ejector element between an unloaded state wherein the substrate is supported by the substrate table and a loaded state wherein the substrate is at least partly supported by the ejector element; determining a reference height of the ejector element at me moment that me weight of me substrate is at least partly taken over between the substrate table and the ejector element; and determining the optimum take over height for the ejector element from the determined reference height.