Abstract: A solution for making multi-component structures (145) is proposed. A corresponding method comprises delivering a plurality of galvanic solutions (115) at least in part different from each other through corresponding delivering ports (110) and removing the galvanic solutions (115) being delivered through a plurality of removing ports (120) thereby creating corresponding dynamic drops (125). Corresponding deposition currents (Ia-Id) are set individually for the galvanic solutions (115) as a function of an amount of the components of the galvanic solutions (115) in the multi-component structure (145). The substrate (130) and the dynamic drops (125) are brought into contact with each other in succession, thereby transforming the dynamic drops (125) into corresponding dynamic menisci (135a-135d) that galvanically deposit layers (140a-140d) of the corresponding components of the multi-component structure (145) onto the substrate (130). A corresponding deposition system (600; 700) is also proposed.

Abstract: A solution for making multi-component structures (145) is proposed. A corresponding method comprises delivering a plurality of galvanic solutions (115) at least in part different from each other through corresponding delivering ports (110) and removing the galvanic solutions (115) being delivered through a plurality of removing ports (120) thereby creating corresponding dynamic drops (125). Corresponding deposition currents (Ia-Id) are set individually for the galvanic solutions (115) as a function of an amount of the components of the galvanic solutions (115) in the multi-component structure (145). The substrate (130) and the dynamic drops (125) are brought into contact with each other in succession, thereby transforming the dynamic drops (125) into corresponding dynamic menisci (135a-135d) that galvanically deposit layers (140a-140d) of the corresponding components of the multi-component structure (145) onto the substrate (130). A corresponding deposition system (600; 700) is also proposed.

Abstract: A flexible electrode (1) for applying an electric field to the human body, comprising: a gripping portion (3); a deformable structure (5) having a first face (5a) fixed to the gripping portion (3); a flexible polymeric film (7) arranged on a flat second face (5b) of the deformable structure (5) and provided, on a flat face (7a) thereof facing outwards the electrode (1), with flat metal structures (10,11) defining at least one first electrode and one second electrode (A,B), surfaces (10a,11a) of the flat metal structures (10,11) facing outwards the polymeric film (7) being coplanar with the flat face (7a) of the polymeric film (7).

Abstract: A photovoltaic cell is proposed. The photovoltaic cell includes a substrate of semiconductor material, and a plurality of contact terminals each one arranged on a corresponding contact area of the substrate for collecting electric charges being generated in the substrate by the light. For at least one of the contact areas, the substrate includes at least one porous semiconductor region extending from the contact area into the substrate for anchoring the whole corresponding contact terminal on the substrate. In the solution according to an embodiment of the invention, each porous semiconductor region has a porosity decreasing moving away from the contact area inwards the substrate. An etching module and an electrolytic module for processing photovoltaic cells, a production line for producing photovoltaic cells, and a process for producing photovoltaic cells are also proposed.

Abstract: A photovoltaic cell is proposed. The photovoltaic cell includes a substrate of semiconductor material, and a plurality of contact terminals each one arranged on a corresponding contact area of the substrate for collecting electric charges being generated in the substrate by the light. For at least one of the contact areas, the substrate includes at least one porous semiconductor region extending from the contact area into the substrate for anchoring the whole corresponding contact terminal on the substrate. In the solution according to an embodiment of the invention, each porous semiconductor region has a porosity decreasing moving away from the contact area inwards the substrate. An etching module and an electrolytic module for processing photovoltaic cells, a production line for producing photovoltaic cells, and a process for producing photovoltaic cells are also proposed.

Abstract: A photovoltaic cell is proposed. The photovoltaic cell includes a substrate of semiconductor material, and a plurality of contact terminals each one arranged on a corresponding contact area of the substrate for collecting electric charges being generated in the substrate by the light. For at least one of the contact areas, the substrate includes at least one porous semiconductor region extending from the contact area into the substrate for anchoring the whole corresponding contact terminal on the substrate. In the solution according to an embodiment of the invention, each porous semiconductor region has a porosity decreasing moving away from the contact area inwards the substrate. An etching module and an electrolytic module for processing photovoltaic cells, a production line for producing photovoltaic cells, and a process for producing photovoltaic cells are also proposed.

Abstract: An embodiment of an elastic contact device for electrically contacting electronic components is proposed. The contact device includes at least one basic module with a longitudinal axis, each one including an elastic core for defining an elasticity of the basic module (undergoing an axial elastic deformation in response to an axial compression), a first contact terminal element and a second contact terminal element coupled with the elastic core in axially opposed positions, and at least one elongated contact element extending axially between the first and second terminal elements, wherein each elongated element is configured to have a buckling axial critical load higher than zero for self-sustaining in absence of external forces during a production of the basic module and lower than a threshold compression (ranging approximately between 0.1% and 50%) for buckling thereby not contributing to the elasticity of the basic module during operation thereof.

Abstract: A photovoltaic cell (100) is proposed. The photovoltaic cell includes a substrate (105; 105?) of semiconductor material, and a plurality of contact terminals (Tf,Tb) each one arranged on a corresponding contact area (122) of the substrate for collecting electric charges being generated in the substrate by the light. For at least one of the contact areas, the substrate includes at least one porous semiconductor region (125) extending from the contact area into the substrate for anchoring the whole corresponding contact terminal on the substrate. In the solution according to an embodiment of the invention, each porous semiconductor region has a porosity decreasing moving away from the contact area inwards the substrate. An etching module (400) and an electrolytic module (700;700?;800;800?) for processing photovoltaic cells, a production line (900) for producing photovoltaic cells, and a process for producing photovoltaic cells are also proposed.

Abstract: A method for making a micro structure (100) is proposed. The method starts with the step of providing a silicon substrate (102), which has a main surface. A porous silicon layer (103)—extending into the silicon substrate from the main surface—is then formed. The method continues by etching the porous silicon layer selectively to obtain a set of projecting microelements of porous silicon (112); each projecting microelement projects from a remaining portion of the silicon substrate (106), thereby exposing a corresponding external surface. The projecting microelements are then treated to obtain a set of corresponding conductive (115) or insulating (115?) microelements; each conductive or insulating microelement is obtained by converting at least a prevalent portion of the porous silicon (extending into the corresponding projecting element from the external surface) into porous metal or ceramics, respectively.

Abstract: An embodiment of an elastic contact device for electrically contacting electronic components is proposed. The contact device includes at least one basic module, which has a longitudinal axis. In turn, each basic module includes an elastic core for defining an elasticity of the basic module; the elastic core undergoes an axial elastic deformation in response to an axial compression. A first contact terminal element and a second contact terminal element are coupled with the elastic core in axially opposed positions. Moreover, one or more elongated contact elements extend axially between the first terminal element and the second terminal element.

Abstract: A method for making a micro structure (100) is proposed. The method starts with the step of providing a silicon substrate (102), which has a main surface. A porous silicon layer (103)—extending into the silicon substrate from the main surface—is then formed. The method continues by etching the porous silicon layer selectively to obtain a set of projecting microelements of porous silicon (112); each projecting microelement projects from a remaining portion of the silicon substrate (106), thereby exposing a corresponding external surface. The projecting microelements are then treated to obtain a set of corresponding conductive (115) or insulating (115?) microelements; each conductive or insulating microelement is obtained by converting at least a prevalent portion of the porous silicon (extending into the corresponding projecting element from the external surface) into porous metal or ceramics, respectively.

Abstract: An embodiment of a process of manufacturing an interconnection element for contacting electronic devices is proposed. The process starts with the step of forming a plurality of leads on a main surface of a first substrate; each lead has a first end and a second end. The second end of each lead is coupled with a second substrate. The second substrate and the first substrate are then spaced apart, so as to extend the leads between the first substrate and the second substrate. The process also includes the step of treating the main surface before forming the leads to control an adhesion of the leads on the main surface.

Abstract: An embodiment of a system for contacting at least one electronic device having a plurality of contact elements is proposed. The system includes a substrate having a main surface and a plurality of contact terminals projecting from the main surface, wherein each contact terminal includes a core of polymeric material and a covering of conductive material surrounding the core, the covering having an operative portion spaced apart from the main surface for electrically connecting a corresponding contact element and a lateral portion extending between the main surface and the operative portion. In an embodiment, the lateral portion forms an angle with the main surface between 45° and 75°.

Abstract: An embodiment of a process of manufacturing an interconnection element for contacting electronic devices is proposed. The process starts with the step of forming a plurality of leads on a main surface of a first substrate; each lead has a first end and a second end. The second end of each lead is coupled with a second substrate. The second substrate and the first substrate are then spaced apart, so as to extend the leads between the first substrate and the second substrate. The process also includes the step of treating the main surface before forming the leads to control an adhesion of the leads on the main surface.

Abstract: An embodiment of a system for contacting at least one electronic device having a plurality of contact elements is proposed. The system includes a substrate having a main surface and a plurality of contact terminals projecting from the main surface, wherein each contact terminal includes a core of polymeric material and a covering of conductive material surrounding the core, the covering having an operative portion spaced apart from the main surface for electrically connecting a corresponding contact element and a lateral portion extending between the main surface and the operative portion. In an embodiment, the lateral portion forms an angle with the main surface between 45° and 75°.