Abstract: Methods, systems, and devices for circuit partitioning for a memory device are described. In one example, a memory device may include a set of memory tiles that each include a respective array of memory cells (e.g., in an array level or layer). Each of the memory tiles may include a respective circuit level or layer associated with circuitry configured to operate the respective array of memory cells. The memory device may also include circuitry for communicating data between the memory cells of the set of memory tiles and an input/output component. Aspects of the circuitry for communicating the data may be subdivided into repeatable blocks each configured to communicate one or more bits, and the repeatable blocks and other aspects of the circuitry for communicating the data is distributed across the circuit layer of two or more of the set of memory tiles.

Abstract: Methods, systems, and devices for circuit partitioning for a memory device are described. In one example, a memory device may include a set of memory tiles that each include a respective array of memory cells (e.g., in an array level or layer). Each of the memory tiles may include a respective circuit level or layer associated with circuitry configured to operate the respective array of memory cells. The memory device may also include circuitry for communicating data between the memory cells of the set of memory tiles and an input/output component. Aspects of the circuitry for communicating the data may be subdivided into repeatable blocks each configured to communicate one or more bits, and the repeatable blocks and other aspects of the circuitry for communicating the data is distributed across the circuit layer of two or more of the set of memory tiles.

Abstract: Methods, systems, and devices for circuit partitioning for a memory device are described. In one example, a memory device may include a set of memory tiles that each include a respective array of memory cells (e.g., in an array level or layer). Each of the memory tiles may include a respective circuit level or layer associated with circuitry configured to operate the respective array of memory cells. The memory device may also include circuitry for communicating data between the memory cells of the set of memory tiles and an input/output component. Aspects of the circuitry for communicating the data may be subdivided into repeatable blocks each configured to communicate one or more bits, and the repeatable blocks and other aspects of the circuitry for communicating the data is distributed across the circuit layer of two or more of the set of memory tiles.

Abstract: The memory device includes a plurality of memory chips of a certain capacity assembled in a single package and sharing input/output pins, the memories being selectable and singularly enabled one at the time by appropriate external commands coherently with the currently addressed memory location. The device uses only one external enable/disable logic command applied through a single dedicated pin. Each of the memory chips has a number of additional input/output pads equal to 2*n, where 2n is the number of memory chips contained in the device, and a dedicated circuit that generates an internal enable/disable command, as a function of logic inputs corresponding to the logic states of the additional pads and the external enable/disable command.

Abstract: The memory device includes a plurality of memory chips of a certain capacity assembled in a single package and sharing input/output pins, the memories being selectable and singularly enabled one at the time by appropriate external commands coherently with the currently addressed memory location. The device uses only one external enable/disable logic command applied through a single dedicated pin. Each of the memory chips has a number of additional input/output pads equal to 2*n, where 2n is the number of memory chips contained in the device, and a dedicated circuit that generates an internal enable/disable command, as a function of logic inputs corresponding to the logic states of the additional pads and the external enable/disable command.

Abstract: A circuit for reading a semiconductor memory device includes at least one global circuit for generating a global reference signal for a respective plurality of cell-reading circuits disposed locally in the memory device. The circuit includes at least one circuit for replicating the reference signal locally in order to generate a local reference signal to be supplied to at least one respective cell-reading circuit.

Abstract: A method of avoiding disturbance during the step of programming and erasing an electrically programmable, semiconductor integrated non-volatile memory device which includes a matrix of memory cells divided into sectors and programmable in a byte mode is disclosed. An operation of verification of the contents of the byte to be programmed, to be carried out for each individual bit, is provided even before the first program pulse is applied. The method also provides for the parallel erasing of several sectors during an erase step, and a verification of the erase step for each sector in the matrix. If the verification shows that a sector has been erased, the sector is applied no further erase pulses.

Abstract: A voltage generator for electrically programmable non-volatile memory cells, constructed of a number of charge pump circuits having inputs controlled by a number of phase generators. The charge pump circuits are laid as pairs of first and second charge pump circuits. The first charge pump circuits are active when the second charge pump circuits are inactive, and vice versa.

Abstract: An electrically erasable and programmable non-volatile memory device comprises at least one memory sector comprising an array of memory cells arranged in rows and first-level columns, the first-level columns being grouped together in groups of first-level columns each coupled to a respective second-level column, first-level selection means for selectively coupling one first-level column for each group to the respective second-level column, second-level selection means for selecting one of the second-level columns, first direct memory access test means activatable in a first test mode for directly coupling a selected memory cell of the array to a respective output terminal of the memory device, redundancy columns of redundancy memory cells for replacing defective columns of memory cells, and a redundancy control circuit comprising defective-address storage means for storing addresses of the defective columns and activating respective redundancy columns when the defective columns are addressed.

Abstract: A method and a circuit generates a pulse synchronization signal in order to control the reading phase of memory cells in semiconductor integrated, electronic memory devices. The pulse synchronization signal is generated upon sensing a change in logic state on at least one of a plurality of address input terminals of the memory cells to also generate an equalization signal for a sense amplifier. The logic state of said pulse synchronization signal is re-acknowledged by a fed-back response having a predetermined delay and being generated upon reception of a corresponding signal to said equalization signal. To this aim, a re-acknowledge circuit portion is provided which is input a corresponding signal to the equalization signal and feedback connected to the output node to drive the discharging of the node with a predetermined delay from the reception of the input signal.

Abstract: The invention relates to a method of erasing an electrically programmable non-volatile memory device constructed as a multi-sector matrix memory and being of the type with an erase algorithm integrated into the device. The method comprises the following steps of: erasing some or all of the matrix sectors in parallel; subsequently reading and checking each erased sector; storing the address of a sector being checked when the issue of a check is unfavorable; carrying out a fresh parallel erasing step; and starting a new reading/checking step from the sector that has checked unfavorably.

Abstract: A voltage generator for electrically programmable non-volatile memory cells, constructed of a number of charge pump circuits having inputs controlled by a number of phase generators. The charge pump circuits are laid as pairs of first and second charge pump circuits. The first charge pump circuits are active when the second charge pump circuits are inactive, and vice versa.

Abstract: A negative charge pump circuit having a plurality of charge pump stages. Each charge pump stage has an input node and an output node and includes a pass transistor and a first coupling capacitor. The pass transistor has a first terminal connected to the input node, a second terminal connected to the output node and a control terminal connected to an internal node of the charge pump stage. The first coupling capacitor has a first plate connected to said output node and a second plate connected to a respective clock signal. Negative voltage regulation means are provided for regulating a negative output voltage on an output node of the negative charge pump circuit to provide a fixed negative voltage value. The negative charge pump circuit includes at least one negative voltage limiting means electrically coupling said output node of the negative charge pump circuit with the internal node of the last charge pump stage of the negative charge pump circuit.

Abstract: Redundancy circuitry layout for a semiconductor memory device comprises an array of programmable non-volatile memory elements for storing the addresses of detective bit lines and word lines which must be functionally replaced respectively by redundancy bit lines and word lines. The redundancy circuitry layout is divided into identical layout strips which are perpendicular to the array of memory elements and which each comprise first and a second strip sides located at opposite sides of the array of memory elements, the first strip side containing at least one programmable non-volatile memory register of a first plurality for the selection or redundancy bit lines and being crossed by a column address signal bus running parallel to the array or memory elements, the second strip side containing one programmable non-volatile memory register of a second plurality for the selection or redundancy word lines and being crossed by a row address signal bus running parallel to the array of memory elements.