Patents by Inventor Marco Del Sarto
Marco Del Sarto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133843Abstract: An integrated electronic system is provided with a package formed by a support base and a coating region arranged on the support base and having at least a first system die, including semiconductor material, coupled to the support base and arranged in the coating region. The integrated electronic system also has, within the package, a monitoring system configured to determine the onset of defects within the coating region, through the emission of acoustic detection waves and the acquisition of corresponding received acoustic waves, whose characteristics are affected by, and therefore are indicative of, the aforementioned defects.Type: ApplicationFiled: October 17, 2023Publication date: April 25, 2024Applicant: STMICROELECTRONICS S.r.l.Inventors: Domenico GIUSTI, Marco DEL SARTO, Fabio QUAGLIA, Enri DUQI
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Patent number: 11945714Abstract: An electronic device comprises a “waterproof” package including a substrate of an organic material permeable to humidity and/or moisture as well as one or more electronic components arranged on the substrate. The substrate comprises a barrier layer capable of countering penetration of humidity and/or moisture into the package through the organic material substrate.Type: GrantFiled: July 30, 2021Date of Patent: April 2, 2024Assignee: STMICROELECTRONICS S.r.l.Inventors: Alex Gritti, Marco Del Sarto
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Patent number: 11891298Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.Type: GrantFiled: June 13, 2022Date of Patent: February 6, 2024Assignee: STMICROELECTRONICS S.r.l.Inventors: Fabio Quaglia, Marco Ferrera, Marco Del Sarto
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Patent number: 11873215Abstract: A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.Type: GrantFiled: March 1, 2022Date of Patent: January 16, 2024Assignee: STMICROELECTRONICS S.R.L.Inventors: Enri Duqi, Marco Del Sarto, Lorenzo Baldo
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Publication number: 20230389426Abstract: MEMS thermoelectric generator comprising: a thermoelectric cell including one or more thermoelectric elements partially extending on a cavity of the thermoelectric cell; a thermoplastic layer extending on the thermoelectric cell and having a top surface and a bottom surface opposite to each other along a first axis, the bottom surface facing the thermoelectric cell and the thermoplastic layer being of thermally insulating material and configured to be processed through laser direct structuring, LDS, technique; a heat sink configured to exchange heat with the thermoelectric cell interposed, along the first axis, between the heat sink and the thermoplastic layer; and a thermal via of metal material, extending through the thermoplastic layer from the top surface to the bottom surface so that it is superimposed, along the first axis, on the cavity, wherein the thermoelectric cell may exchange heat with a thermal source through the thermal via.Type: ApplicationFiled: May 16, 2023Publication date: November 30, 2023Applicant: STMicroelectronics S.r.l.Inventors: Paolo FERRARI, Flavio Francesco VILLA, Marco DEL SARTO
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Publication number: 20230171911Abstract: The electronic module has a three-dimensional frame, a printed circuit board and a plurality of electronic devices. The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions which extend transversely to each other in space. The electronic devices are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.Type: ApplicationFiled: November 16, 2022Publication date: June 1, 2023Applicant: STMICROELECTRONICS S.r.l.Inventors: Luca MAGGI, Marco DEL SARTO, Alex GRITTI, Amedeo MAIERNA
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Publication number: 20230110259Abstract: A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.Type: ApplicationFiled: December 12, 2022Publication date: April 13, 2023Applicants: STMicroelectronics (MALTA) Ltd, STMicroelectronics S.r.l.Inventors: Kevin FORMOSA, Marco DEL SARTO
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Publication number: 20230028024Abstract: A process for manufacturing electroacoustic modules including: forming an assembly with a redistribution structure and a plurality of dice arranged in a dielectric region; forming a wafer with a semiconductor body and a plurality of respective unit portions laterally staggered, each of which includes a respective supporting region, set in contact with the semiconductor body, and a number of actuators; reducing the thickness of the semiconductor body and then selectively removing portions of the semiconductor body so as to singulate, starting from the wafer, a plurality of transduction structures, each including a semiconductor substrate, which contacts a corresponding supporting region and is traversed by cavities delimited by portions of the supporting region that form membranes mechanically coupled to the actuators; and then coupling the transduction structures to the redistribution structure of the assembly.Type: ApplicationFiled: July 15, 2022Publication date: January 26, 2023Applicant: STMICROELECTRONICS S.r.l.Inventors: Mark Andrew SHAW, Marco DEL SARTO
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Patent number: 11524892Abstract: A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.Type: GrantFiled: March 30, 2020Date of Patent: December 13, 2022Assignees: STMicroelectronics (Malta) Ltd, STMicroelectronics S.r.l.Inventors: Kevin Formosa, Marco Del Sarto
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Publication number: 20220306456Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.Type: ApplicationFiled: June 13, 2022Publication date: September 29, 2022Applicant: STMICROELECTRONICS S.r.l.Inventors: Fabio QUAGLIA, Marco FERRERA, Marco DEL SARTO
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Publication number: 20220238485Abstract: A packaged electronic system having a support formed by an insulating organic substrate housing a buried conductive region that is floating. A first die is fixed to the support and carries, on a first main surface, a first die contact region capacitively coupled to a first portion of the buried conductive region. A second die is fixed to the support and carries, on a first main surface, a second die contact region capacitively coupled to a second portion of the buried conductive region. A packaging mass encloses the first die, the second die, the first die contact region, the second die contact region, and, at least partially, the support.Type: ApplicationFiled: January 20, 2022Publication date: July 28, 2022Applicant: STMICROELECTRONICS S.r.l.Inventors: Dario PACI, Silvia ADORNO, Marco DEL SARTO, Fabrizio CERINI, Alex GRITTI
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Patent number: 11383971Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.Type: GrantFiled: July 22, 2019Date of Patent: July 12, 2022Assignee: STMICROELECTRONICS S.r.l.Inventors: Fabio Quaglia, Marco Ferrera, Marco Del Sarto
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Publication number: 20220185661Abstract: A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.Type: ApplicationFiled: March 1, 2022Publication date: June 16, 2022Applicant: STMICROELECTRONICS S.R.L.Inventors: Enri DUQI, Marco DEL SARTO, Lorenzo BALDO
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Patent number: 11358862Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.Type: GrantFiled: May 7, 2020Date of Patent: June 14, 2022Assignee: STMICROELECTRONICS S.R.L.Inventors: Enri Duqi, Lorenzo Baldo, Marco Del Sarto, Mikel Azpeitia Urquia
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Patent number: 11309237Abstract: The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.Type: GrantFiled: September 27, 2019Date of Patent: April 19, 2022Assignees: STMICROELECTRONICS S.r.l., STMICROELECTRONICS (MALTA) LTDInventors: Marco Del Sarto, Alex Gritti, Pierpaolo Recanatini, Michael Borg
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Publication number: 20220099957Abstract: An electronic module includes a first die of semiconductor material including a first reflector, a second die of semiconductor material including a second reflector, and a frame including a first supporting portion and a second supporting portion parallel to one another. The first and second dies are carried, respectively, by the first and second supporting portions and are respectively arranged so that the first reflector faces the second supporting portion and the second reflector faces the first supporting portion. An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.Type: ApplicationFiled: September 21, 2021Publication date: March 31, 2022Applicant: STMicroelectronics S.r.l.Inventors: Marco DEL SARTO, Alex GRITTI, Amedeo MAIERNA, Luca MAGGI
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Publication number: 20220033251Abstract: An electronic device comprises a “waterproof” package including a substrate of an organic material permeable to humidity and/or moisture as well as one or more electronic components arranged on the substrate. The substrate comprises a barrier layer capable of countering penetration of humidity and/or moisture into the package through the organic material substrate.Type: ApplicationFiled: July 30, 2021Publication date: February 3, 2022Applicant: STMICROELECTRONICS S.r.l.Inventors: Alex Gritti, Marco Del Sarto
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Publication number: 20210098355Abstract: The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.Type: ApplicationFiled: September 27, 2019Publication date: April 1, 2021Inventors: Marco DEL SARTO, Alex GRITTI, Pierpaolo RECANATINI, Michael BORG
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Publication number: 20200307994Abstract: A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.Type: ApplicationFiled: March 30, 2020Publication date: October 1, 2020Applicants: STMicroelectronics (Malta) Ltd, STMicroelectronics S.r.l.Inventors: Kevin FORMOSA, Marco DEL SARTO
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Publication number: 20200262699Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.Type: ApplicationFiled: May 7, 2020Publication date: August 20, 2020Inventors: Enri DUQI, Lorenzo BALDO, Marco DEL SARTO, Mikel AZPEITIA URQUIA