Abstract: A method of manufacturing a metal oxide varistor (MOV), the method including placing a quantity of a MOV composition in a pressing die, the MOV composition including metal oxide granules mixed with a polyaniline-polymer, performing a pressing operation including operating the pressing die to compress the MOV composition into a solid MOV chip, and applying first and second electrodes to opposing first and second sides of the MOV chip, wherein the pressing operation is performed at a temperature in a range of 15 degrees Celsius to 200 degrees Celsius.

Abstract: Systems and methods for identifying a location of a thermal event detected by a temperature sensing tape are provided. In some embodiments, the temperature sensing tape can include a resistive ladder with parallel resistors between a plurality of temperature sensing elements to create voltage dividers, and unique analog output voltages can correspond to different ones of the plurality of temperature sensing elements being activated. In some embodiments, pulses injected into and reflected by the temperature sensing tape can be used detect a distance to a location where a triggering event is detected.

Abstract: A method for preparing a preparing a polymeric positive temperature coefficient (PPTC) compound and conformally applying such compound to a substrate in accordance with an embodiment of the present disclosure may include preparing and mixing raw materials to form a PPTC mixture, processing the PPTC mixture through polymer compounding equipment, wherein the PPTC mixture is heated and is extruded as a PPTC compound, performing a beaming process on the polymer compound to establish crosslinking between polymer chains in the PPTC compound, and applying the PPTC compound to a substrate using a hot application process wherein the PPTC compound is heated and is conformally applied to a surface of the substrate.

Abstract: A circuit protection device may include a varistor body including a first side, wherein a thermal electrode is disposed along the first side, and wherein a first lead is electrically connected to the thermal electrode and a second lead is electrically connected to a second side. The circuit protection device may further include a reflowable circuit protection device atop the thermal electrode, and a third lead connected to the reflowable circuit protection device, wherein an end of the third lead is a spring connected to the thermal electrode by a conductive element.

Abstract: A semiconductor device protection arrangement. The semiconductor device protection arrangement may include a semiconductor chip; a controller, coupled to the power semiconductor chip; and a temperature sensor, disposed in thermal contact with the semiconductor chip, where the temperature sensor includes a positive temperature indicator (PTI) component.

Abstract: A fuse including a fuse body, a fusible element disposed within the fuse body, first and second terminals extending from opposite ends of the fusible element and out of the fuse body, and a quantity of arc suppressing material formed on the fusible element, wherein the arc suppressing material is formed of a mixture of sand, an arc suppressant, and a flame retarding binder.

Abstract: A fuse comprising including a housing, a fusible element disposed within the housing, first and second terminals extending from opposite ends of the fusible element and out of the housing, and a quantity of arc suppressing material disposed on the fusible element, wherein the arc suppressing material is formed of a polyamide hotmelt adhesive mixed with a flame retardant.

Abstract: A method of manufacturing a metal oxide varistor (MOV), the method including placing a quantity of a MOV composition in a pressing die, the MOV composition including metal oxide granules mixed with a polyaniline-polymer, performing a pressing operation including operating the pressing die to compress the MOV composition into a solid MOV chip, and applying first and second electrodes to opposing first and second sides of the MOV chip, wherein the pressing operation is performed at a temperature in a range of 15 degrees Celsius to 200 degrees Celsius.

Abstract: A semiconductor device protection arrangement. The semiconductor device protection arrangement may include a semiconductor chip; a controller, coupled to the power semiconductor chip; and a temperature sensor, disposed in thermal contact with the semiconductor chip, where the temperature sensor includes a positive temperature indicator (PTI) component.

Abstract: A device assembly for surface mount devices includes a matrix of SMD skeletons and a polymeric positive temperature coefficient (PPTC) material disposed over the matrix. The matrix consists of multiple rows, with each SMD skeleton having a pair of terminals and multiple whiskers perpendicular to and between the terminals. The PPTC material connects the terminals to the whiskers.

Abstract: A fuse comprising including a housing, a fusible element disposed within the housing, first and second terminals extending from opposite ends of the fusible element and out of the housing, and a quantity of arc suppressing material disposed on the fusible element, wherein the arc suppressing material is formed of a polyamide hotmelt adhesive mixed with a flame retardant.

Abstract: A temperature sensing tape is provided and can include an insulating support structure and at least one temperature sensing element disposed on the insulating support structure wherein the at least one temperature sensing element can be formed from a single polymer mixture that includes two or more polymers, and wherein each of the two or more polymers can have a respective, different crystallinity point.

Abstract: A method for manufacturing a connection between two ceramic parts comprises: providing a first ceramic part and a second ceramic part; providing an active hard solder, or active braze, on at least one surface section of at least one of the ceramic parts; and heating the active hard solder, or active braze, in a vacuum soldering, brazing process. The entire active hard solder, or active braze, for connecting the first and second ceramic parts is provided in such a manner that at least one surface section of at least one of the ceramic parts, preferably both ceramic parts, is coated by means of gas phase deposition of the alloy of the active hard solder, or active braze.

Abstract: A method for manufacturing a connection between two ceramic parts comprises: providing a first ceramic part and a second ceramic part; providing an active hard solder, or active braze, on at least one surface section of at least one of the ceramic parts; and heating the active hard solder, or active braze, in a vacuum soldering, brazing process. The entire active hard solder, or active braze, for connecting the first and second ceramic parts is provided in such a manner that at least one surface section of at least one of the ceramic parts, preferably both ceramic parts, is coated by means of gas phase deposition of the alloy of the active hard solder, or active braze.

Abstract: A driving agent vacuum pump configured as a micropump is presented. The vacuum pump includes an evaporation chamber and a pumping chamber, which are separated by a jet arrangement. The jet arrangement includes a planar arrangement of at least one jet running vertically in depth between two plates. The two plates cover the evaporation chamber and the pumping chamber about the jet arrangement. An opening is provided in the pumping chamber above the jet arrangement for taking in an agent to be pumped. A second opening is provided for driving out a compressed gas below the jet arrangement. A connection is provided between the evaporation chamber and the pumping chamber through which a condensed driving agent is returned.

Abstract: A driving agent vacuum pump configured as a micropump is presented. The vacuum pump includes an evaporation chamber and a pumping chamber, which are separated by a jet arrangement. The jet arrangement includes a planar arrangement of at least one jet running vertically in depth between two plates. The two plates cover the evaporation chamber and the pumping chamber about the jet arrangement. An opening is provided in the pumping chamber above the jet arrangement for taking in an agent to be pumped. A second opening is provided for driving out a compressed gas below the jet arrangement. A connection is provided between the evaporation chamber and the pumping chamber through which a condensed driving agent is returned.

Abstract: The invention relates to a driving agent vacuum pump used in microsystems technology, comprising an evaporator chamber and a pump chamber that are separated by a jet arrangement. The design of the driving agent vacuum pump is improved by: a planar arrangement of at least one jet, which extends vertically in depth and which is situated between two, in particular, parallel plates, these plates closing the evaporator chamber and the pump chamber; an opening in the pump chamber, preferably above the jet arrangement, for drawing in a medium to be pumped, and; an opening for expelling a preferably compressed gas underneath the jet arrangement.