Patents by Inventor Marco Koitz

Marco Koitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip and method for forming a chip pad
    Patent number: 10636754
    Abstract: A semiconductor chip with different chip pads and a method for forming a semiconductor chip with different chip pads are disclosed. In some embodiments, a semiconductor chip includes a chip front side, a first chip pad located on the chip front side, a second chip pad located on the chip front side and an electrically insulating material located between the first chip pad and the second chip pad, wherein the first chip pad includes a surface layer predominantly comprising copper and the second chip pad includes a surface layer predominantly comprising aluminum.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: April 28, 2020
    Assignee: Infineon Technologies AG
    Inventors: Stefan Kramp, Marco Koitz
  • Semiconductor Chip and Method for Forming a Chip Pad
    Publication number: 20190189574
    Abstract: A semiconductor chip with different chip pads and a method for forming a semiconductor chip with different chip pads are disclosed. In some embodiments, a semiconductor chip includes a chip front side, a first chip pad located on the chip front side, a second chip pad located on the chip front side and an electrically insulating material located between the first chip pad and the second chip pad, wherein the first chip pad includes a surface layer predominantly comprising copper and the second chip pad includes a surface layer predominantly comprising aluminum.
    Type: Application
    Filed: January 30, 2019
    Publication date: June 20, 2019
    Inventors: Stefan Kramp, Marco Koitz
  • Semiconductor chip and method for forming a chip pad
    Patent number: 10236265
    Abstract: A semiconductor chip with different chip pads and a method for forming a semiconductor chip with different chip pads are disclosed. In some embodiments, the method comprises depositing a barrier layer over a chip front side, depositing a copper layer after depositing the barrier layer, and removing a part of the copper layer located outside a first chip pad region, wherein a remaining portion of the copper layer within the first chip pad region forms a surface layer of the chip pad. The method further comprises removing a part of the barrier layer located outside the first chip pad region.
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: March 19, 2019
    Assignee: Infineon Technologies AG
    Inventors: Stefan Kramp, Marco Koitz
  • Semiconductor Chip and Method for Forming a Chip Pad
    Publication number: 20160027746
    Abstract: A semiconductor chip with different chip pads and a method for forming a semiconductor chip with different chip pads are disclosed. In some embodiments, the method comprises depositing a barrier layer over a chip front side, depositing a copper layer after depositing the barrier layer, and removing a part of the copper layer located outside a first chip pad region, wherein a remaining portion of the copper layer within the first chip pad region forms a surface layer of the chip pad. The method further comprises removing a part of the barrier layer located outside the first chip pad region.
    Type: Application
    Filed: July 28, 2014
    Publication date: January 28, 2016
    Inventors: Stefan Kramp, Marco Koitz
  • Method of processing a contact pad
    Patent number: 8603910
    Abstract: In various embodiments, a method of processing a contact pad may include providing a contact pad, a topmost layer of the contact pad containing aluminum or an aluminum alloy, at least part of the topmost layer of the contact pad being exposed; subjecting the contact pad to a thermally activated atmosphere containing water or reactive components of water.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: December 10, 2013
    Assignee: Infineon Technologies AG
    Inventors: Marco Koitz, Guenter Zieger, Christian Krenn, Franz Kleinbichler, Guenther Zoth, Karl Mayer
  • METHOD OF PROCESSING A CONTACT PAD
    Publication number: 20130180945
    Abstract: In various embodiments, a method of processing a contact pad may include providing a contact pad, a topmost layer of the contact pad containing aluminum or an aluminum alloy, at least part of the topmost layer of the contact pad being exposed; subjecting the contact pad to a thermally activated atmosphere containing water or reactive components of water.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 18, 2013
    Applicant: Infineon Technologies AG
    Inventors: Marco Koitz, Guenter Zieger, Christian Krenn, Franz Kleinbichler, Guenther Zoth, Karl Mayer