Patents by Inventor Marco Lederer
Marco Lederer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11837525Abstract: A module and a power semiconductor device wherein a module is configured with a molded plastic body and load terminal elements of the power semiconductor device, wherein respective load terminal elements are configured as a flat shaped metal body having a first main face and an opposite second main face, and having a first secondary face and an opposite second secondary face. The secondary faces connect the main faces, and have a terminal section, wherein the molded plastic body forms channels and comprises a bottom body part, a first and a second edge body and a partition body. The load terminal elements are arranged with a section in an associated channel, and an edge body of the channel has an indentation directed towards the one main face of the directly neighboring terminal element.Type: GrantFiled: June 28, 2023Date of Patent: December 5, 2023Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KGInventors: Harald Kobolla, Marco Lederer, Rainer Popp
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Patent number: 11776878Abstract: A power electronics system has a switching device and a liquid cooling device. A switching device has a plate element, and power semiconductor devices are arranged on conductor tracks and connected by means of a connecting device, wherein the liquid cooling device has a first partial body having an inlet volume region and an outlet volume region and a second partial body. A cooling volume region is formed between the two partial bodies, wherein heat transfer bodies protrude into the cooling volume region from the second partial body. The second partial body is arranged in a recess of the first partial body and the two partial bodies are connected to each other and have a common plane surface which forms a first main surface.Type: GrantFiled: December 3, 2021Date of Patent: October 3, 2023Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KGInventors: Marco Lederer, Christian Zeiler
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Publication number: 20220181234Abstract: A power electronics system has a switching device and a liquid cooling device. A switching device has a plate element, and power semiconductor devices are arranged on conductor tracks and connected by means of a connecting device, wherein the liquid cooling device has a first partial body having an inlet volume region and an outlet volume region and a second partial body. A cooling volume region is formed between the two partial bodies, wherein heat transfer bodies protrude into the cooling volume region from the second partial body. The second partial body is arranged in a recess of the first partial body and the two partial bodies are connected to each other and have a common plane surface which forms a first main surface.Type: ApplicationFiled: December 3, 2021Publication date: June 9, 2022Applicant: SEMIKRON ELEKTRONIK GMBH & CO. KGInventors: Marco LEDERER, Christian ZEILER
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Patent number: 10893602Abstract: A method for producing a power electronics system having a cooling device, a switching device, a terminal device, a capacitor device and a control device includes the following production steps: providing a cooling device with a plurality of first and second positioning cutouts; providing the switching device with a substrate and a first mounting device, which has first positioning devices; providing the terminal device, which is completely independent of the switching device, i.e. forms a dedicated component part or a dedicated assembly, with a second mounting device, which has second positioning devices; arranging the switching device on the cooling device, wherein the first positioning devices are arranged in the respectively assigned first positioning cutouts; arranging the terminal device on the cooling device, wherein the respective second positioning devices are arranged in the assigned second positioning cutouts; arranging the capacitor device.Type: GrantFiled: November 8, 2018Date of Patent: January 12, 2021Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KGInventors: Thomas Hunka, Marco Lederer, Rainer Popp, Stefan Weiss, Patrick Sturm
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Publication number: 20190182945Abstract: A method for producing a power electronics system having a cooling device, a switching device, a terminal device, a capacitor device and a control device includes the following production steps: providing a cooling device with a plurality of first and second positioning cutouts; providing the switching device with a substrate and a first mounting device, which has first positioning devices; providing the terminal device, which is completely independent of the switching device, i.e. forms a dedicated component part or a dedicated assembly, with a second mounting device, which has second positioning devices; arranging the switching device on the cooling device, wherein the first positioning devices are arranged in the respectively assigned first positioning cutouts; arranging the terminal device on the cooling device, wherein the respective second positioning devices are arranged in the assigned second positioning cutouts; arranging the capacitor device.Type: ApplicationFiled: November 8, 2018Publication date: June 13, 2019Applicant: SEMIKRON ELEKTRONIK GMBH & CO. KGInventors: Thomas Hunka, Marco Lederer, Rainer Popp, Stefan Weiss, Patrick Sturm
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Patent number: 9907215Abstract: A power electronic subassembly having a housing and a capacitor arranged therein. The housing has an internally arranged cooling area, which is cooled by a cooling device integrated in the housing or an external cooling device. The capacitor has a contact device of a first polarity and a contact device of a second polarity and a capacitor busbar system. This capacitor busbar system comprises first and second sheet-like shaped metal bodies. The first metal body with the first contact device of the first polarity and the second metal body with the second contact device of the second polarity are electrically conductively connected. A first portion of the first metal body has a first subportion, which is arranged parallel to and at a distance from the cooling area, and a second subportion, which is in thermal contact with the cooling area, wherein the two subportions are connected by an intermediate portion.Type: GrantFiled: August 22, 2016Date of Patent: February 27, 2018Assignee: Semikron GmbH & Co., KGInventors: Klaus Backhaus, Roland Bittner, Marco Lederer, Rainer Popp
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Patent number: 9661740Abstract: An arrangement comprising a power semiconductor module, a capacitor, a DC-voltage busbar and a connection device. The module has two flat DC-voltage connection conductors each having a contact section. The DC-voltage connection conductors are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction. The capacitor has two flat capacitor connection conductors each having a contact section. The DC-voltage busbar has two partial busbars each having a contact section. The connection device has a yoke with a die and a bearing. The respective contact sections of the DC-voltage connection conductors are clamped flat above one another between the die and the bearing. The contact sections, of the capacitor or the DC-voltage busbar, are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction, and are thus force-fittingly and electrically conductively connected to one another.Type: GrantFiled: October 13, 2015Date of Patent: May 23, 2017Assignee: Semikron Elektronik GmbH & Co., KGInventors: Roland Bittner, Marco Lederer, Sven Teuber, Matthias Spang
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Publication number: 20170055366Abstract: A power electronic subassembly having a housing and a capacitor arranged therein. The housing has an internally arranged cooling area, which is cooled by a cooling device integrated in the housing or an external cooling device. The capacitor has a contact device of a first polarity and a contact device of a second polarity and a capacitor busbar system. This capacitor busbar system comprises first and second sheet-like shaped metal bodies. The first metal body with the first contact device of the first polarity and the second metal body with the second contact device of the second polarity are electrically conductively connected. A first portion of the first metal body has a first subportion, which is arranged parallel to and at a distance from the cooling area, and a second subportion, which is in thermal contact with the cooling area, wherein the two subportions are connected by an intermediate portion.Type: ApplicationFiled: August 22, 2016Publication date: February 23, 2017Applicant: Semikron Elektronik GmbH & Co., KGInventors: Klaus BACKHAUS, Roland BITTNER, Marco LEDERER, Rainer POPP
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Publication number: 20160234926Abstract: An arrangement comprising a power semiconductor module, a capacitor, a DC-voltage busbar and a connection device. The module has two flat DC-voltage connection conductors each having a contact section. The DC-voltage connection conductors are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction. The capacitor has two flat capacitor connection conductors each having a contact section. The DC-voltage busbar has two partial busbars each having a contact section. The connection device has a yoke with a die and a bearing. The respective contact sections of the DC-voltage connection conductors are clamped flat above one another between the die and the bearing. The contact sections, of the capacitor or the DC-voltage busbar, are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction, and are thus force-fittingly and electrically conductively connected to one another.Type: ApplicationFiled: October 13, 2015Publication date: August 11, 2016Inventors: Roland BITTNER, Marco LEDERER, Sven TEUBER, Matthias SPANG
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Patent number: 9380367Abstract: In order to protect a microphone from moisture and/or dirt, there is provided a microphone protective device that needs only relatively little space for installation into an electroacoustic device for a relatively large effective surface area. For this purpose, the novel microphone protective device has an at least partially cylindrical-shell-shaped membrane, for preventing dirt and/or moisture from entering a sound inlet opening of the microphone.Type: GrantFiled: August 20, 2010Date of Patent: June 28, 2016Assignee: Sivantos Pte. Ltd.Inventors: Anton Gebert, Marco Lederer
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Patent number: 9025807Abstract: A hearing apparatus includes a sound tube with a tube-side coupling element and an earpiece with an earpiece-side coupling element. The tube-side coupling element and the earpiece-side coupling element can be reversibly coupled. The tube-side coupling element has a tube-side pressure canal and the earpiece-side coupling element has an earpiece-side pressure canal, which form a coupled pressure canal in a coupled state of the coupling elements. The tube-side coupling element or the earpiece-side coupling element is supported by at least one pressure element which improves air-tightness of the coupled pressure canal. A coupling element and a hearing device are also provided.Type: GrantFiled: September 12, 2013Date of Patent: May 5, 2015Assignee: Siemens Medical Instruments Pte. Ltd.Inventors: Anton Gebert, Thomas Harsch, Marco Lederer
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Publication number: 20140072165Abstract: A hearing apparatus includes a sound tube with a tube-side coupling element and an earpiece with an earpiece-side coupling element. The tube-side coupling element and the earpiece-side coupling element can be reversibly coupled. The tube-side coupling element has a tube-side pressure canal and the earpiece-side coupling element has an earpiece-side pressure canal, which form a coupled pressure canal in a coupled state of the coupling elements. The tube-side coupling element or the earpiece-side coupling element is supported by at least one pressure element which improves air-tightness of the coupled pressure canal. A coupling element and a hearing device are also provided.Type: ApplicationFiled: September 12, 2013Publication date: March 13, 2014Applicant: SIEMENS MEDICAL INSTRUMENTS PTE. LTD.Inventors: ANTON GEBERT, THOMAS HARSCH, MARCO LEDERER
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Patent number: 8644543Abstract: With a hearing aid device in a frame configuration, acoustic feedback is avoided with an opened battery charger. To this end, a seal surrounds the frame component in an annular manner, the seal sealing a gap between the frame component and the housing thus providing a more user friendly hearing aid.Type: GrantFiled: October 1, 2012Date of Patent: February 4, 2014Assignee: Siemens Medical Instruments Pte. Ltd.Inventors: Marco Lederer, Andreas Ratay, Hartmut Ritter
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Patent number: 8644541Abstract: A hearing apparatus and in particular a hearing aid are to be optimized as regards the risk of feedback. The hearing apparatus contains a housing, having a first opening and a second opening, and with a frame, in or on which a signal processing component is attached, and which can be inserted into the first opening of the housing as far as an end position. A ramp is disposed in the housing which interacts with the frame such that the frame is also moved perpendicular to the direction of insertion toward the second opening during insertion into the housing along a direction of insertion only in one section as far as the end position, which is less than 30% of the insertion path from the first opening to the end position.Type: GrantFiled: August 8, 2012Date of Patent: February 4, 2014Assignee: Siemens Medical Instruments Pte. Ltd.Inventors: Sebastian Lackert, Marco Lederer, Hartmut Ritter, Friedrich Zenk
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Publication number: 20130202139Abstract: A hearing apparatus and in particular a hearing aid are to be optimized as regards the risk of feedback. The hearing apparatus contains a housing, having a first opening and a second opening, and with a frame, in or on which a signal processing component is attached, and which can be inserted into the first opening of the housing as far as an end position. A ramp is disposed in the housing which interacts with the frame such that the frame is also moved perpendicular to the direction of insertion toward the second opening during insertion into the housing along a direction of insertion only in one section as far as the end position, which is less than 30% of the insertion path from the first opening to the end position.Type: ApplicationFiled: August 8, 2012Publication date: August 8, 2013Applicant: SIEMENS MEDICAL INSTRUMENTS PTE. LTD.Inventors: SEBASTIAN LACKERT, MARCO LEDERER, HARTMUT RITTER, FRIEDRICH ZENK
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Publication number: 20130148832Abstract: In order to protect a microphone from moisture and/or dirt, there is provided a microphone protective device that needs only relatively little space for installation into an electroacoustic device for a relatively large effective surface area. For this purpose, the novel microphone protective device has an at least partially cylindrical-shell-shaped membrane, for preventing dirt and/or moisture from entering a sound inlet opening of the microphone.Type: ApplicationFiled: August 20, 2010Publication date: June 13, 2013Applicant: SIEMENS MEDICAL INSTRUMENTS PTE. LTD.Inventors: Anton Gebert, Marco Lederer
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Patent number: 8355519Abstract: A tool is provided with which a receiver of a hearing aid can be easily fitted into an earpiece or an ear mold and removed therefrom. The tool has an elongate main body, a first tool part for removing the receiver from a first earpiece, a second tool part for removing the receiver from a second earpiece, and a third tool part for fitting the receiver into the first or second earpiece. The elongate main body is divided into a first subsidiary body and a second subsidiary body). The two subsidiary bodies can be plugged at least partially one inside the other in the direction of the longitudinal axis of the main body. In addition, two of the three tool parts are arranged on one of the two subsidiary bodies, and the remaining tool part is arranged on the other of the two subsidiary bodies.Type: GrantFiled: February 1, 2011Date of Patent: January 15, 2013Assignee: Siemens Medical Instruments Pte. Ltd.Inventors: Uli Gommel, Marco Lederer, Ottmar Ruschig, Friedrich Zenk
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Patent number: 8338942Abstract: A power semiconductor module, for placement on a cooling component. The module includes a substrate, at least two power semiconductor components arranged on the substrate, a housing and outwardly routed load and control connections. The substrate has an insulator body with a first main area that faces the interior of the power semiconductor module, and has interconnects at load potential arranged thereon. Each load connection is formed as a shaped metal body with outer contacts, a strip-like section and with inner contacts extending from the strip-like section to the substrate and making circuit-compliant contact therewith. In addition, the load connections are substantially completely encased by insulation except in the vicinity of the outer and inner contacts and accordingly are electrically insulated from one another.Type: GrantFiled: June 14, 2007Date of Patent: December 25, 2012Assignee: Semikron Elektronik GmbH & Co. KGInventors: Marco Lederer, Rainer Popp
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Patent number: D906240Type: GrantFiled: November 28, 2018Date of Patent: December 29, 2020Assignee: SEMIKRON ELEKTRONIK GmbH & CO. KGInventors: Thomas Frank, Stefan Weiss, Patrick Sturm, Thomas Ziegler, Marco Lederer, Thomas Hunka, Rainer Popp
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Patent number: D925448Type: GrantFiled: July 29, 2020Date of Patent: July 20, 2021Assignee: SEMIKRON ELEKTRONIK GmbH & Co. KGInventors: Thomas Frank, Stefan Weiss, Patrick Sturm, Thomas Ziegler, Marco Lederer, Thomas Hunka, Rainer Popp