Abstract: Small form factor package structures are disclosed for LiNbO3 optical modulator by reducing the package dimension for minimize the unused free space inside a modulator package. If a first aspect of the invention, the structure of the small form factor package for LiNbO3 optical modulator employs a metal round block having an inner part that is made of zirconia or glass like borosilicate BK7 or Pyrex and the outer part that is made with stainless steel or kovar. The inner and outer parts represent a two-pieces optical fiber assembly that are held together by a resin. In a second aspect of the invention, a surface of the lithium niobate chip is attached to a surface of the metal round block (or a glass block) that results in an angular positioning of the lithium niobate chip inside the optical package, which significantly reduces the mechanical stress induced by different polishing angle of the metal round block as well as the polishing angle of the lithium niobate chip.

Abstract: An integrated optical chip has a crystalline structure cut along parallel principal crystallographic planes and a thickness of less than 1.0 mm. An optical signal pathway is disposed generally longitudinally in one of the cut surfaces of the chip, and the chip is attached to a substrate material up to 1.0 mm thick and having similar coefficients of thermal expansion in that principal crystallographic plane. A grounding plane is disposed between the chip and substrate to provide an electrically conductive path between opposite lateral surfaces of the chip. A method of making the chip is also described.

Abstract: Small form factor package structures are disclosed for LiNbO3 optical modulator by reducing the package dimension for minimize the unused free space inside a modulator package. If a first aspect of the invention, the structure of the small form factor package for LiNbO3 optical modulator employs a metal round block having an inner part that is made of zirconia or glass like borosilicate BK7 or Pyrex and the outer part that is made with stainless steel or kovar. The inner and outer parts represent a two-pieces optical fiber assembly that are held together by a resin. In a second aspect of the invention, a surface of the lithium niobate chip is attached to a surface of the metal round block (or a glass block) that results in an angular positioning of the lithium niobate chip inside the optical package, which significantly reduces the mechanical stress induced by different polishing angle of the metal round block as well as the polishing angle of the lithium niobate chip.

Abstract: An integrated optical chip has a crystalline structure cut along parallel principal crystallographic planes and a thickness of less than 1.0 mm. An optical signal pathway is disposed generally longitudinally in one of the cut surfaces of the chip, and the chip is attached to a substrate material up to 1.0 mm thick and having similar coefficients of thermal expansion in that principal crystallographic plane. A grounding plane is disposed between the chip and substrate to provide an electrically conductive path between opposite lateral surfaces of the chip. A method of making the chip is also described.

Abstract: An active optical device comprises a packaged optical chip, an optical fiber coupled to the chip to receive an optical output from it, and a photodetector located within the package for receiving radiation light responsive to the amplitude of that optical output. The radiation light is produced by destructive interference in a pair of waveguides that merge together at a chosen small angle and sufficiently smoothly for a substantial part of the light (ideally nearly all of it) to propagate through the substrate of the chip close to the output waveguide and preferably in only two directions (corresponding to a first-order diffraction). The optical fiber is coupled to the chip by means of a fiber support (such as a fiber block or a ferrule) made of transparent material, and the photodetector is positioned to receive the radiation light at least partly through the fiber support and at least partly by reflection from the interior of the package.

Abstract: A method for removing a coating (14) from a portion of optical fiber (11) including the steps of mechanically removing the coating (14) from two portions of fiber (16a, 16b) of predetermined length and spaced each other of a predetermined distance, and then immersing the portion of fiber (17) interposed between the two considered portions (16a, 16b) in a liquid solvent (28) so as to chemically remove the coating (14) thereof; the two portions of fiber (16a, 16b) from where the coating (14) has been mechanically removed are held only partially dipped in the liquid solvent (28), so that the liquid solvent (28) is prevented from reaching the portions of the fiber (18a, 18b) outside the liquid solvent (28) by capillary action through the coating.

Abstract: An optical device comprises an optical chip contained in a package formed at least in part of an enclosure wall; the chip provides an optical signal output and an optical monitoring output and the device includes a photodetector responsive to the optical monitor output

Abstract: Active device assembly comprising a substrate having at least a planar surface on which a plurality of electrical contact pads are formed, a chip having a surface on which at least one optical waveguide and a plurality of electrodes are formed. Said chip surface is in a facing relationship with the planar surface of the substrate, and said electrical contact pads are in electrical contact to said electrodes. Said contact pads and said electrodes provide mechanical connection between said chip and said substrate and the coefficient of thermal expansion of the substrate is greater than or equal to the coefficient of thermal expansion of the chip in a length direction.

Abstract: A method for removing a coating (14) from a portion of optical fiber (11) comprises mechanically removing the coating (14) from two portions of fiber (16a, 16b) of predetermined length and spaced each other of a predetermined distance, and then immersing the portion of fiber (17) interposed between the two considered portions (16a, 16b) in a solvent liquid (28) so as to chemically remove the coating (14) thereof; the two portion of fiber (16a, 16b) from where the coating (14) has been mechanically removed are held only partially dipped in the solvent liquid (28), so that the solvent liquid (28) is prevented from reaching the portions of the fiber (18a, 18b) outside the solvent liquid (28) by capillary action through the coating.