Patents by Inventor Marco Marchitto

Marco Marchitto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11081464
    Abstract: A powder carrier, to which a powder layer containing a metal powder is applied, is provided by an automatic powder carrier feed. A first joining partner is pressed onto the powder layer located on the powder carrier so as to bond a powder layer portion to the first joining partner. The first joining partner is raised from the powder carrier together with the powder layer portion bonded to the first joining partner, and the powder layer portion bonded to the first joining partner is arranged between the first and second joining partners. A sintered join is produced between the first and second joining partners by pressing the first and second joining partners against one another such that the powder layer portion makes contact with both the first and second joining partners. The powder layer portion is sintered as the joining partners are being pressed against one another.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: August 3, 2021
    Assignee: Infineon Technologies AG
    Inventors: Nicolas Heuck, Marco Marchitto, Roland Speckels
  • Patent number: 10615138
    Abstract: A method for producing a layer including a connecting medium on an assembly partner is provided. The method includes providing a carrier on which the connecting medium is applied. The connecting medium contains a metal in the form of a multiplicity of metal particles. The assembly partner is placed on the connecting medium located on the carrier and pressed onto the connecting medium located on the carrier, so that a layer of the connecting medium adheres to the assembly partner. The assembly partner together with the layer adhering thereto is removed from the carrier. By means of a gas flow, edges of the layer, at which the latter extends laterally beyond the assembly partner, are removed so that a layer residue of the layer remains adhering to the assembly partner.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: April 7, 2020
    Assignee: Infineon Technologies AG
    Inventors: Nicolas Heuck, Marco Marchitto, Roland Speckels
  • Publication number: 20160351533
    Abstract: A powder carrier, to which a powder layer containing a metal powder is applied, is provided by an automatic powder carrier feed. A first joining partner is pressed onto the powder layer located on the powder carrier so as to bond a powder layer portion to the first joining partner. The first joining partner is raised from the powder carrier together with the powder layer portion bonded to the first joining partner, and the powder layer portion bonded to the first joining partner is arranged between the first and second joining partners. A sintered join is produced between the first and second joining partners by pressing the first and second joining partners against one another such that the powder layer portion makes contact with both the first and second joining partners. The powder layer portion is sintered as the joining partners are being pressed against one another.
    Type: Application
    Filed: May 27, 2016
    Publication date: December 1, 2016
    Inventors: Nicolas Heuck, Marco Marchitto, Roland Speckels
  • Publication number: 20160225735
    Abstract: A method for producing a layer including a connecting medium on an assembly partner is provided. The method incudes providing a carrier on which the connecting medium is applied. The connecting medium contains a metal in the form of a multiplicity of metal particles. The assembly partner is placed on the connecting medium located on the carrier and pressed onto the connecting medium located on the carrier, so that a layer of the connecting medium adheres to the assembly partner. The assembly partner together with the layer adhering thereto is removed from the carrier. By means of a gas flow, edges of the layer, at which the latter extends laterally beyond the assembly partner, are removed so that a layer residue of the layer remains adhering to the assembly partner.
    Type: Application
    Filed: January 29, 2016
    Publication date: August 4, 2016
    Inventors: Nicolas Heuck, Marco Marchitto, Roland Speckels