Abstract: Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.

Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

Abstract: Laser processing of sapphire is performed using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm (hereinafter “QCW laser”). Laser processing of sapphire using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 10%) and in an inert gas atmosphere such as argon or helium. Laser processing of sapphire using a QCW laser may further include the use of an assist laser having a shorter wavelength and/or pulse duration to modify a property of the sapphire substrate to form absorption centers, which facilitate coupling of the laser light pulses of the QCW laser into the sapphire.

Abstract: A method for configuring an automation device or simulator for controlling mechatronics components of an automation system, including: generating HLPN component models for each type of the mechatronic components of the automation system, creating a component instance model from an HLPN component model for each physically present mechatronic component, creating a layout configuration file, which describes relationships of the component instance models to be connected, composing the component instance models into a system model based on the layout configuration file, wherein logic ports of the component instance models are connected/linked to each other, generating configuration files based on a system model and device description files and WSDL files of the component instance models, loading the configuration files into the automation device or simulator containing the HLPN orchestration machine, and executing the configuration files by the HLPN orchestration machine of the automation device or the simulator.

Abstract: Multiple-beam laser processing may be performed on a workpiece using at least first and second laser beams with different characteristics (e.g., wavelengths and/or pulse durations). In some applications, an assist laser beam is directed at a target location on or within the workpiece to modify a property of the non-absorptive material. A process laser beam is directed at the target location and is coupled into absorption centers formed in the non-absorptive material to complete processing of the non-absorptive material. Multiple-beam laser processing may be used, for example, to drill holes in a substrate made of alumina or other transparent ceramics. In other applications, multiple-beam laser processing may be used in melting applications such as micro-welding, soldering, and forming laser fired contacts. In these applications, the assist laser beam may be used to modify a property of the material or to change the geometry of the parts.

Abstract: Laser lift off systems and methods may be used to provide monolithic laser lift off with minimal cracking by reducing the size of one or more beam spots in one or more dimensions to reduce plume pressure while maintaining sufficient energy to provide separation. By irradiating irradiation zones with various shapes and in various patterns, the laser lift off systems and methods use laser energy more efficiently, reduce cracking when separating layers, and improve productivity. Some laser lift off systems and methods described herein separate layers of material by irradiating non-contiguous irradiation zones with laser lift off zones (LOZs) that extend beyond the irradiation zones. Other laser lift off systems and methods described herein separate layers of material by shaping the irradiation zones and by controlling the overlap of the irradiation zones in a way that avoids uneven exposure of the workpiece.

Abstract: Laser lift off systems and methods may be used to provide monolithic laser lift off with minimal cracking by reducing the size of one or more beam spots in one or more dimensions to reduce plume pressure while maintaining sufficient energy to provide separation. By irradiating irradiation zones with various shapes and in various patterns, the laser lift off systems and methods use laser energy more efficiently, reduce cracking when separating layers, and improve productivity. Some laser lift off systems and methods described herein separate layers of material by irradiating non-contiguous irradiation zones with laser lift off zones (LOZs) that extend beyond the irradiation zones. Other laser lift off systems and methods described herein separate layers of material by shaping the irradiation zones and by controlling the overlap of the irradiation zones in a way that avoids uneven exposure of the workpiece.

Abstract: An interaction method between service-oriented components and devices, where services offered by a service-provider are requested by a service-requester. In order to broaden flexibility and to simplify reconfiguration of the system, each service includes a set of ports and each port is an instance of a port-type that defines a set of interaction operations and corresponding message transfers between the service-provider and service-requester. The service provided by the service-provider is carried out in several interaction phases with the service-requester, and the interaction phases follow the specific protocols linked to the instances of port-type and the service is accessed by a sequence of different ports that are linked to the phases.

Abstract: Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.

Abstract: A method for orchestrating services of a service-oriented automation system (SOAS), system components (SMC, LCC) offering services (S, WS) that represent the functionality thereof and requesting services (S) of other system components (SMC, LCC), the behavior of the automation system (SOAS) being controlled by the orchestration of the services (S) of the system components (SMC, LCC) using an orchestration machine (OE), and to an orchestration machine for orchestrating services of a service-oriented automation system (SOAS). In order to achieve an orchestration of services at a device level, it is provided that the orchestration machine (OE) uses high-level Petri nets tailored to service-oriented systems and the orchestration of the services (S) at the device level is performed by interpretation and execution of various HLPN models, which represent the behavior of the automation system (SOAS) and/or the system components (SMC, LCC).

Abstract: An adjustable astigmatic elongated beam spot may be formed from a laser beam having ultrashort laser pulses and/or longer wavelengths to machine substrates made of a variety of different materials. The laser beam may be generated with pulses having a pulse duration of less than 1 ns and/or having a wavelength greater than 400 nm. The laser beam is modified to produce an astigmatic beam that is collimated in a first axis and converging in a second axis. The astigmatic beam is focused to form the astigmatic elongated beam spot on a substrate, which is focused on the substrate in the first axis and defocused in the second axis. The astigmatic elongated beam spot may be adjusted in length to provide an energy density sufficient for a single ultrashort pulse to cause cold ablation of at least a portion of the substrate material.

Abstract: A method for specifying the behavior of autonomous and collaborative automation devices in manufacturing plants with a service-oriented architecture and to a service-oriented automation device. In order to describe the operating behavior of such devices, the invention proposes the steps of original setting-up of the automation device, including configuration, depiction of services, establishment of connections to other automation devices and transfer of the set-up to waiting original status, receiving the events through service operations, internal device interfaces of inputs/outputs and/or generated directly from the controls, evaluating the received events, executing the events and changing the state of the model-based middleware shell, wherein the system achieves the next state and is capable of receiving further events.

Abstract: Laser machining systems and methods may use one or more moving laser scanning stages with force cancellation. The force cancellation is provided by moving masses linearly with equal and opposition motion. One or more of the masses may be a laser scanning stage. The laser machining systems may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost.

Abstract: Multiple beamlet laser beam delivery systems and methods may be used in laser machining systems and methods to machine multiple regions on a workpiece simultaneously. One embodiment of a laser machining system and method may be used, for example, to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The multiple beam delivery systems may be movable to scribe multiple lines simultaneously in the workpiece.

Abstract: A method for configuring an automation device or simulator for controlling mechatronics components of an automation system, including: generating HLPN component models for each type of the mechatronic components of the automation system, creating a component instance model from an HLPN component model for each physically present mechatronic component, creating a layout configuration file, which describes relationships of the component instance models to be connected, composing the component instance models into a system model based on the layout configuration file, wherein logic ports of the component instance models are connected/linked to each other, generating configuration files based on a system model and device description files and WSDL files of the component instance models, loading the configuration files into the automation device or simulator containing the HLPN orchestration machine, and executing the configuration files by the HLPN orchestration machine of the automation device or the simulator.

Abstract: Systems and methods for laser scribing provide extended depth affectation into a substrate or workpiece by focusing a laser beam such that the beam passes into the workpiece using a waveguide, self-focusing effect to cause internal crystal damage along a channel extending into the workpiece. Different optical effects may be used to facilitate the waveguide, self-focusing effect, such as multi-photon absorption in the material of the workpiece, transparency of the material of the workpiece, and aberrations of the focused laser. The laser beam may have a wavelength, pulse duration, and pulse energy, for example, to provide transmission through the material and multi-photon absorption in the material. An aberrated, focused laser beam may also be used to provide a longitudinal spherical aberration range sufficient to extend the effective depth of field (DOF) into the workpiece.

Abstract: The invention relates to a collaborative automation system (PS), comprising devices providing divided production and control services (D) such as transport and processing machines (M) with associated device agents (ST-AG, MA-AG), products with associated product agents (WP-AG), and a coordination unit (CO) providing a communication platform (SKP); the invention further relates to a method for the control of such a system. In order to obtain a dynamic detection and calling of processes in a loosely coupled production structure and infrastructure, the invention provides for devices (ST, MA, WP) providing the production and control services to be associated with a DPWS-based web service (ST-WS; MA-WS), wherein device functions are implemented into the DPWS-based web service as device service and agent functions. The communication platform (SKP) is designed as a uniform, DPWS-oriented SOA platform.

Abstract: A method for developing a multi-agent system and a multi-agent system, such as an automation and/or production system, including software and/or hardware components, the resources and functions of these components being represented and/or controlled through software agents, each of the software agents having the capability of achieving goals through interaction with the environment and with other agents. In order to increase reconfigurability and flexibility, the resources and functions of the software agents are depicted as services, where each software agent, in order to achieve its own goals, calls up services of other software agents and offers its own resources and functions to other software agents as services.

Abstract: Laser lift off systems and methods may be used to provide monolithic laser lift off with minimal cracking by reducing the size of one or more beam spots in one or more dimensions to reduce plume pressure while maintaining sufficient energy to provide separation. By irradiating irradiation zones with various shapes and in various patterns, the laser lift off systems and methods use laser energy more efficiently, reduce cracking when separating layers, and improve productivity. Some laser lift off systems and methods described herein separate layers of material by irradiating non-contiguous irradiation zones with laser lift off zones (LOZs) that extend beyond the irradiation zones. Other laser lift off systems and methods described herein separate layers of material by shaping the irradiation zones and by controlling the overlap of the irradiation zones in a way that avoids uneven exposure of the workpiece.