Abstract: A method and machine for producing a package with a coupon, whereby a product is fed to a packing station via a feed station, where the coupon is applied on to a top wall of the product; at the packing station, a sheet of packing material is wrapped about the product to enclose both the product and the coupon, and, between the feed station and the packing station, the coupon is subjected to an electric field and charged electrostatically, so as to adhere electrostatically to the product; the electric field is generated by at least one fixed guide, which is parallel to the path so as to face the top wall of the product, and comprises a number of conducting bodies having a high direct voltage with respect to an electric earth.

Abstract: A method and machine for producing a package with a coupon, whereby a product is fed to a packing station via a feed station, where the coupon is applied on to a top wall of the product; at the packing station, a sheet of packing material is wrapped about the product to enclose both the product and the coupon, and, between the feed station and the packing station, the coupon is subjected to an electric field and charged electrostatically, so as to adhere electrostatically to the product; the electric field is generated by at least one fixed guide, which is parallel to the path so as to face the top wall of the product, and comprises a number of conducting bodies having a high direct voltage with respect to an electric earth.

Abstract: Process for coating a conductive substrate used as the anode in an electrochemical cell, in which a direct electric current is passed from a cathode to the said anode through an electrolytic liquid containing a phenolic monomer in order to form a polymeric film of phenolic resin on the substrate.The electrolyte includes from 10 to 200 g/l of allylphenol or a mixture of such with other phenols, and from 5 to 200 g/l of an aliphatic amine, in solution in a mixture of water and alcohol. The polymeric film is deposited by using an electric current of a density not greater than 50 mA/cm.sup.2 of substrate, and the polymeric film so deposited is heated to a temperature of from 100.degree. to 200.degree. C. in order to induce the hardening of the said resin.