Patents by Inventor Marco Natale Valtolina

Marco Natale Valtolina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7868474
    Abstract: A method of indexing a plurality of dice obtained from a material wafer comprising a plurality of stacked material layers, each die being obtained in a respective die position in the wafer, the method including providing a visible index on each die indicative of the respective die position, wherein providing the visible index on each die includes: forming in a first material layer of the die a reference structure adapted to defining a mapping of the wafer; and forming in a second material layer of the die a marker associated with the reference structure, a position of the marker with respect to the reference structure being adapted to provide an indication of the die position in the wafer.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: January 11, 2011
    Assignee: STMicroelectronics, S.r.l.
    Inventors: Daniele Alfredo Brambilla, Marco Natale Valtolina
  • Publication number: 20090146326
    Abstract: A method of indexing a plurality of dice obtained from a material wafer comprising a plurality of stacked material layers, each die being obtained in a respective die position in the wafer, the method including providing a visible index on each die indicative of the respective die position, wherein providing the visible index on each die includes: forming in a first material layer of the die a reference structure adapted to defining a mapping of the wafer; and forming in a second material layer of the die a marker associated with the reference structure, a position of the marker with respect to the reference structure being adapted to provide an indication of the die position in the wafer.
    Type: Application
    Filed: February 10, 2009
    Publication date: June 11, 2009
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Daniele Alfredo Brambilla, Marco Natale Valtolina
  • Patent number: 7491620
    Abstract: A method of indexing a plurality of dice obtained from a material wafer comprising a plurality of stacked material layers, each die being obtained in a respective die position in the wafer, the method including providing a visible index on each die indicative of the respective die position, wherein providing the visible index on each die includes: forming in a first material layer of the die a reference structure adapted to defining a mapping of the wafer; and forming in a second material layer of the die a marker associated with the reference structure, a position of the marker with respect to the reference structure being adapted to provide an indication of the die position in the wafer.
    Type: Grant
    Filed: February 19, 2008
    Date of Patent: February 17, 2009
    Assignee: STMicroelectronics S.r.l.
    Inventors: Daniele Alfredo Brambilla, Marco Natale Valtolina
  • Publication number: 20080153250
    Abstract: A method of indexing a plurality of dice obtained from a material wafer comprising a plurality of stacked material layers, each die being obtained in a respective die position in the wafer, the method including providing a visible index on each die indicative of the respective die position, wherein providing the visible index on each die includes: forming in a first material layer of the die a reference structure adapted to defining a mapping of the wafer; and forming in a second material layer of the die a marker associated with the reference structure, a position of the marker with respect to the reference structure being adapted to provide an indication of the die position in the wafer.
    Type: Application
    Filed: February 19, 2008
    Publication date: June 26, 2008
    Applicant: STMicroelectronics S.r.l.
    Inventors: Daniele Alfredo Brambilla, Marco Natale Valtolina
  • Patent number: 7348682
    Abstract: A method of indexing a plurality of dice obtained from a material wafer comprising a plurality of stacked material layers, each die being obtained in a respective die position in the wafer, the method including providing a visible index on each die indicative of the respective die position, wherein providing the visible index on each die includes: forming in a first material layer of the die a reference structure adapted to defining a mapping of the wafer; and forming in a second material layer of the die a marker associated with the reference structure, a position of the marker with respect to the reference structure being adapted to provide an indication of the die position in the wafer.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: March 25, 2008
    Assignee: STMicroelectronics S.r.l.
    Inventors: Daniele Alfredo Brambilla, Marco Natale Valtolina