Abstract: An ultra-compact stacked differential pressure sensor is provided, which includes a differential pressure sensor stacked on an ASIC stacked on a substrate. The differential pressure sensor is connected to the ASIC by an inner ring and outer ring. The region between the inner ring and outer ring forms an isolation region. The ASIC may be connected to the substrate with glue. Each of the ASIC and substrate may have a through hole channel and the differential pressure sensor may have a back channel. The differential pressure sensor is exposed to a first pressure on a first side and a second pressure via the differential pressure back channel, the ASIC channel, and the substrate channel. The differential pressure sensor may generate an electrical signal based on a difference in pressures between the first environment and the second environment.

Abstract: An ambient temperature sensor is provided that may be coupled to a PCB. The ambient temperature sensor includes a package including a first cap and an insulating structure. The insulating structure is formed of thermally insulating material, and the first cap and the insulating structure delimit a first cavity. A semiconductor device is included and generates an electrical signal indicative of a temperature. The semiconductor device is fixed on top of the insulating structure and arranged within the first cavity. The package may be coupled to the PCB so that the insulating structure is interposed between the semiconductor device and the PCB. The insulating structure delimits a second cavity, which extends below the semiconductor device and is open laterally.

Abstract: A packaged environmental sensor includes a supporting structure and a sensor die, which incorporates an environmental sensor and is arranged on a first side of the supporting structure. A control chip is coupled to the sensor die and is arranged on a second side of the supporting structure opposite to the first side. A lid is bonded to the first side of the supporting structure and is open towards the outside in a direction opposite to the supporting structure. The sensor die is housed within the lid.

Abstract: An ambient temperature sensor is provided that may be coupled to a PCB. The ambient temperature sensor includes a package including a first cap and an insulating structure. The insulating structure is formed of thermally insulating material, and the first cap and the insulating structure delimit a first cavity. A semiconductor device is included and generates an electrical signal indicative of a temperature. The semiconductor device is fixed on top of the insulating structure and arranged within the first cavity. The package may be coupled to the PCB so that the insulating structure is interposed between the semiconductor device and the PCB. The insulating structure delimits a second cavity, which extends below the semiconductor device and is open laterally.

Abstract: An integrated semiconductor device and a method for manufacturing the integrated semiconductor device are disclosed. In an embodiment an integrated semiconductor device includes a supporting substrate having a first substrate face and a second substrate face opposite to the first substrate face, a semiconductor die having a first die face coupled to the first substrate face of the supporting substrate, the first die face including first die contact pads, wherein the supporting substrate has at least one through opening, wherein the first die contact pads are arranged facing the through opening, and wherein the supporting substrate comprises first substrate contact pads connected by first bonding wires to the respective first die contact pads through the through opening.

Abstract: A transducer modulus, comprising: a substrate; a cap on the substrate, defining a chamber; and a sensor modulus in the chamber, integrating a first MEMS transducer facing the chamber, and a second MEMS transducer facing the supporting substrate. The cap has a first opening that forms a path for access of the first environmental quantity exclusively towards a sensitive element of the first transducer, and the supporting substrate has a second opening that forms a path for access of the second environmental quantity exclusively towards a sensitive element of the second transducer.

Abstract: A packaged environmental sensor includes a supporting structure and a sensor die, which incorporates an environmental sensor and is arranged on a first side of the supporting structure. A control chip is coupled to the sensor die and is arranged on a second side of the supporting structure opposite to the first side. A lid is bonded to the first side of the supporting structure and is open towards the outside in a direction opposite to the supporting structure. The sensor die is housed within the lid.

Abstract: In an embodiment of the present invention, a load sensor package includes a housing having a cap, a column, a peripheral structure, and a base. The base includes a major surface configured to mount a stress sensor, while the cap includes a cap major surface configured to receive a load to be measured. The column is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor. The peripheral structure is configured to transfer the remaining fraction of the load to be measured to the base.

Abstract: An integrated semiconductor device and a method for manufacturing the integrated semiconductor device are disclosed. In an embodiment an integrated semiconductor device includes a supporting substrate having a first substrate face and a second substrate face opposite to the first substrate face, a semiconductor die having a first die face coupled to the first substrate face of the supporting substrate, the first die face including first die contact pads, wherein the supporting substrate has at least one through opening, wherein the first die contact pads are arranged facing the through opening, and wherein the supporting substrate comprises first substrate contact pads connected by first bonding wires to the respective first die contact pads through the through opening.

Abstract: A transducer modulus, comprising: a supporting substrate; a cap, which is arranged on the supporting substrate and defines a chamber therewith; a pressure transducer in the chamber; an acoustic transducer in the chamber; and a processing chip, or ASIC, operatively coupled to the pressure transducer and to the acoustic transducer. The pressure transducer and the acoustic transducer are arranged on top of one another to form a stack.

Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

Abstract: In an embodiment of the present invention, a load sensor package includes a housing having a cap, a column, a peripheral structure, and a base. The base includes a major surface configured to mount a stress sensor, while the cap includes a cap major surface configured to receive a load to be measured. The column is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor. The peripheral structure is configured to transfer the remaining fraction of the load to be measured to the base.

Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.

Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

Abstract: A transducer modulus, comprising: a supporting substrate; a cap, which is arranged on the supporting substrate and defines a chamber therewith; a pressure transducer in the chamber; an acoustic transducer in the chamber; and a processing chip, or ASIC, operatively coupled to the pressure transducer and to the acoustic transducer. The pressure transducer and the acoustic transducer are arranged on top of one another to form a stack.

Abstract: A transducer modulus, comprising: a substrate; a cap on the substrate, defining a chamber; and a sensor modulus in the chamber, integrating a first MEMS transducer facing the chamber, and a second MEMS transducer facing the supporting substrate. The cap has a first opening that forms a path for access of the first environmental quantity exclusively towards a sensitive element of the first transducer, and the supporting substrate has a second opening that forms a path for access of the second environmental quantity exclusively towards a sensitive element of the second transducer.

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.