Abstract: A drive circuit includes a first input terminal configured to receive a first input signal, a first output terminal configured to provide a first drive signal, a second output terminal configured to provide a second drive signal, and a mode selection terminal configured to have a mode selection element connected thereto. The drive circuit is configured to generate the first and second drive signals dependent on the first input signal such that there is a dead time between a time when one of the first and second drive signals assumes an off-level and a time when the other one of the first and second drive signals assumes an on-level, and evaluate at least one electrical parameter of the mode selection element and is configured to adjust a first signal range of the first drive signal and a second signal range of the second drive signal dependent on the evaluated parameter and to adjust the dead time dependent on the evaluated parameter.

Abstract: A drive circuit includes a first input terminal configured to receive a first input signal, a first output terminal configured to provide a first drive signal, a second output terminal configured to provide a second drive signal, and a mode selection terminal configured to have a mode selection element connected thereto. The drive circuit is configured to generate the first and second drive signals dependent on the first input signal such that there is a dead time between a time when one of the first and second drive signals assumes an off-level and a time when the other one of the first and second drive signals assumes an on-level, and evaluate at least one electrical parameter of the mode selection element and is configured to adjust a first signal range of the first drive signal and a second signal range of the second drive signal dependent on the evaluated parameter and to adjust the dead time dependent on the evaluated parameter.

Abstract: A component includes a first semiconductor chip attached to a first carrier and second semiconductor chip attached to a second carrier. The first carrier has a first extension, which forms a first external contact element. The second carrier has a second extension, which forms a second external contact element. The first and the second carriers are arranged in such a way that the first and the second extension point in different directions.

Abstract: A component includes a first semiconductor chip attached to a first carrier and second semiconductor chip attached to a second carrier. The first carrier has a first extension, which forms a first external contact element. The second carrier has a second extension, which forms a second external contact element. The first and the second carriers are arranged in such a way that the first and the second extension point in different directions.

Abstract: In order to keep the mounting outlay for shielding measures as low as possible, a semiconductor device having a semiconductor component in a housing element is proposed. At least one capacitive element having a first electrode, a second electrode and a dielectric is provided in an integrated manner in the housing element or in the region thereof. The electrode regions of the capacitive element are electrically contact-connected to terminal regions of the semiconductor component, in such a way that high-frequency interference signals between terminal regions can be suppressed.