Patents by Inventor Marc O. Schweitzer
Marc O. Schweitzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8073572Abstract: An apparatus, method and computer program product for modifying a surface of a component is provided. In use, a surface of a component is translated relative to at least one jet for a period of time to form a plurality of features thereon.Type: GrantFiled: April 3, 2008Date of Patent: December 6, 2011Assignee: Tara Technologies, Inc.Inventor: Marc O. Schweitzer
-
Patent number: 7993470Abstract: A method of fabricating a substrate processing chamber component involves forming a component having a textured surface and sweeping a jet of pressurized fluid across the textured surface of the component. The jet of fluid is pressurized sufficiently high to dislodge substantially all the particles from the textured surface. The method can be applied to dislodge grit particles from textured exposed surfaces formed by electromagnetic energy beam scanning and grit blasting. The method can also be applied to remove loosely adhered coating particles from the textured surfaces of coated components.Type: GrantFiled: December 16, 2008Date of Patent: August 9, 2011Assignee: Applied Materials, Inc.Inventors: Brian T West, Marc O Schweitzer, Jennifer L Watia
-
Publication number: 20090120462Abstract: A method of fabricating a substrate processing chamber component involves forming a component having a textured surface and sweeping a jet of pressurized fluid across the textured surface of the component. The jet of fluid is pressurized sufficiently high to dislodge substantially all the particles from the textured surface. The method can be applied to dislodge grit particles from textured exposed surfaces formed by electromagnetic energy beam scanning and grit blasting. The method can also be applied to remove loosely adhered coating particles from the textured surfaces of coated components.Type: ApplicationFiled: December 16, 2008Publication date: May 14, 2009Inventors: Brian T. West, Marc O. Schweitzer, Jennifer L. Watia
-
Publication number: 20080248719Abstract: An apparatus, method and computer program product for modifying a surface of a component is provided. In use, a surface of a component is translated relative to at least one jet for a period of time to form a plurality of features thereon.Type: ApplicationFiled: April 3, 2008Publication date: October 9, 2008Inventor: Marc O. Schweitzer
-
Patent number: 7371285Abstract: A semiconductor processing chamber having a motorized lid is provided. In one embodiment, the semiconductor processing chamber generally includes a chamber body having sidewalls and a bottom defining an interior volume. A lid assembly is coupled to the chamber body and is movable between a first position that encloses the interior volume and a second position. A hinge assembly thereto is coupled between the lid assembly and the chamber body. A motor is coupled to the hinge assembly to facilitate moving the lid assembly between the first position and the second position.Type: GrantFiled: March 19, 2004Date of Patent: May 13, 2008Assignee: Applied Materials, Inc.Inventors: Michael Rosenstein, Alex Shenderovich, Marc O. Schweitzer, Ilya Lavitsky, Alvin Lau, Michael Feltsman
-
Patent number: 7097744Abstract: In one embodiment, a target alignment surface disposed on a target support mechanically engages a darkspace shield alignment surface disposed on a darkspace shield as the target is lodged into a chamber body. The respective alignment surfaces are shaped and positioned so that the darkspace shield is physically moved to a desired aligned position as the alignment surfaces engage each other. In this manner a darkspace shield may be directly aligned to a target within a semiconductor fabrication chamber to provide a suitable darkspace gap between the target and the darkspace shield.Type: GrantFiled: June 12, 2003Date of Patent: August 29, 2006Assignee: Applied Materials, Inc.Inventors: Alan Barry Liu, Marc O. Schweitzer, James Stephen Van Gogh, Michael Rosenstein, Jennifer L. Watia, Xinyu Zhang, Yoichiro Tanaka, John C. Forster, Anthony Chen
-
Patent number: 7048837Abstract: Plasma etching or resputtering of a layer of sputtered materials including opaque metal conductor materials may be controlled in a sputter reactor system. In one embodiment, resputtering of a sputter deposited layer is performed after material has been sputtered deposited and while additional material is being sputter deposited onto a substrate. A path positioned within a chamber of the system directs light or other radiation emitted by the plasma to a chamber window or other optical view-port which is protected by a shield against deposition by the conductor material. In one embodiment, the radiation path is folded to reflect plasma light around the chamber shield and through the window to a detector positioned outside the chamber window.Type: GrantFiled: September 11, 2003Date of Patent: May 23, 2006Assignee: Applied Materials, Inc.Inventors: Sasson R. Somekh, Marc O. Schweitzer, John C. Forster, Zheng Xu, Roderick C. Mosely, Barry L. Chin, Howard E. Grunes
-
Patent number: 6933508Abstract: A method and system for providing a texture to a surface of a workpiece is provided. The method comprises providing a workpiece to a texturizing chamber and scanning a beam of electromagnetic energy across the surface of the workpiece to form a plurality of features thereon. The features formed are generally depressions, protuberances, and combinations thereof. Also provided is a method of reducing contamination in a process chamber. The method comprises scanning a beam of electromagnetic energy across a surface of one or more process chamber components to form a plurality of features thereon, positioning the one or more chamber components into a process chamber, and initiating a process sequence within the process chamber.Type: GrantFiled: March 13, 2002Date of Patent: August 23, 2005Assignee: Applied Materials, Inc.Inventors: Alan R. Popiolkowski, Shannon M. Hart, Marc O. Schweitzer, Alan B. Liu, Jennifer L. Watia
-
Publication number: 20040251130Abstract: In one embodiment, a target alignment surface disposed on a target support mechanically engages a darkspace shield alignment surface disposed on a darkspace shield as the target is lodged into a chamber body. The respective alignment surfaces are shaped and positioned so that the darkspace shield is physically moved to a desired aligned position as the alignment surfaces engage each other. In this manner a darkspace shield may be directly aligned to a target within a semiconductor fabrication chamber to provide a suitable darkspace gap between the target and the darkspace shield.Type: ApplicationFiled: June 12, 2003Publication date: December 16, 2004Applicant: APPLIED MATERIALS, INC.Inventors: Alan Barry Liu, Marc O. Schweitzer, James Stephen Van Gogh, Michael Rosenstein, Jennifer L. Watia, Xinyu Zhang, Yoichiro Tanaka, John C. Forster, Anthony Chan
-
Patent number: 6827825Abstract: The present invention generally provides a physical vapor deposition chamber and a method for detecting a position of a shutter disk within a physical vapor deposition chamber. In one embodiment, a physical vapor deposition chamber includes a chamber body having a shutter disk mechanism disposed therein. A housing is sealingly coupled to a sidewall of the chamber body and communicates therewith through a slot formed through the sidewall. At least a first sensor is disposed adjacent to the housing and orientated to detect the presence of a shutter disk mechanism within the housing. In one embodiment, a method for detecting the position of a shutter disk within a physical vapor deposition chamber having a substrate support generally includes moving the shutter disk away from a substrate support, and changing a state of a first sensor in response to a position of an edge the shutter disk.Type: GrantFiled: November 6, 2003Date of Patent: December 7, 2004Assignee: Applied Materials, Inc.Inventors: Michael Feltsman, Allen Lau, Michael Rosenstein, Marc O. Schweitzer
-
Patent number: 6812471Abstract: A method and system for providing a texture to a surface of a workpiece, such as a chamber component is provided. The method comprises providing a workpiece to a texturizing chamber and scanning a beam of electromagnetic energy across the surface of the workpiece to form a plurality of features thereon. The features formed are generally depressions, protuberances, and combinations thereof. The chamber components may include, for example, a chamber shield and related assembly, a target, a shadow ring, a contact ring, a substrate support or other component disposable within a processing chamber. Also provided is a method of reducing contamination in a process chamber. The method comprises scanning a beam of electromagnetic energy across a surface of one or more process chamber components to form a plurality of features thereon, positioning the one or more chamber components into a process chamber, and initiating a process sequence within the process chamber.Type: GrantFiled: July 17, 2003Date of Patent: November 2, 2004Assignee: Applied Materials, Inc.Inventors: Alan R Popiolkowski, Shannon M. Hart, Marc O. Schweitzer, Alan B. Liu, Jennifer L. Watia, Brian West, Mark Menzie
-
Publication number: 20040173162Abstract: A semiconductor processing chamber having a motorized lid is provided. In one embodiment, the semiconductor processing chamber generally includes a chamber body having sidewalls and a bottom defining an interior volume. A lid assembly is coupled to the chamber body and is movable between a first position that encloses the interior volume and a second position. A hinge assembly thereto is coupled between the lid assembly and the chamber body. A motor is coupled to the hinge assembly to facilitate moving the lid assembly between the first position and the second position.Type: ApplicationFiled: March 19, 2004Publication date: September 9, 2004Applicant: Applied Materials, Inc.Inventors: Michael Rosenstein, Alex Shenderovich, Marc O. Schweitzer, Ilya Lavitsky, Alvin Lau, Michael Feltsman
-
Patent number: 6776848Abstract: A semiconductor processing chamber having a motorized lid is provided. In one embodiment, the semiconductor processing chamber generally includes a chamber body having sidewalls and a bottom defining an interior volume. A lid assembly is coupled to the chamber body and is movable between a first position that encloses the interior volume and a second position. A hinge assembly thereto is coupled between the lid assembly and the chamber body. A motor is coupled to the hinge assembly to facilitate moving the lid assembly between the first position and the second position.Type: GrantFiled: January 17, 2002Date of Patent: August 17, 2004Assignee: Applied Materials, Inc.Inventors: Michael Rosenstein, Alex Shenderovich, Marc O. Schweitzer, Ilya Lavitsky, Alvin Lau, Michael Feltsman
-
Publication number: 20040089536Abstract: The present invention generally provides a physical vapor deposition chamber and a method for detecting a position of a shutter disk within a physical vapor deposition chamber. In one embodiment, a physical vapor deposition chamber includes a chamber body having a shutter disk mechanism disposed therein. A housing is sealingly coupled to a sidewall of the chamber body and communicates therewith through a slot formed through the sidewall. At least a first sensor is disposed adjacent to the housing and orientated to detect the presence of a shutter disk mechanism within the housing. In one embodiment, a method for detecting the position of a shutter disk within a physical vapor deposition chamber having a substrate support generally includes moving the shutter disk away from a substrate support, and changing a state of a first sensor in response to a position of an edge the shutter disk.Type: ApplicationFiled: November 6, 2003Publication date: May 13, 2004Applicant: Applied Materials, Inc.Inventors: Michael Feltsman, Allen Lau, Michael Rosenstein, Marc O. Schweitzer
-
Publication number: 20040056211Abstract: A method and system for providing a texture to a surface of a workpiece, such as a chamber component is provided. The method comprises providing a workpiece to a texturizing chamber and scanning a beam of electromagnetic energy across the surface of the workpiece to form a plurality of features thereon. The features formed are generally depressions, protuberances, and combinations thereof. The chamber components may include, for example, a chamber shield and related assembly, a target, a shadow ring, a contact ring, a substrate support or other component disposable within a processing chamber. Also provided is a method of reducing contamination in a process chamber. The method comprises scanning a beam of electromagnetic energy across a surface of one or more process chamber components to form a plurality of features thereon, positioning the one or more chamber components into a process chamber, and initiating a process sequence within the process chamber.Type: ApplicationFiled: July 17, 2003Publication date: March 25, 2004Applicant: Applied Materials, Inc.Inventors: Alan R. Popiolkowski, Shannon M. Hart, Marc O. Schweitzer, Alan B. Liu, Jennifer L. Watia, Brian West, Mark Menzie
-
Patent number: 6669829Abstract: The present invention generally provides a physical vapor deposition chamber and a method for detecting a position of a shutter disk within a physical vapor deposition chamber. In one embodiment, a physical vapor deposition chamber includes a chamber body having a shutter disk mechanism disposed therein. A housing is sealingly coupled to a sidewall of the chamber body and communicates therewith through a slot formed through the sidewall. At least a first sensor is disposed adjacent to the housing and orientated to detect the presence of a shutter disk mechanism within the housing. In one embodiment, a method for detecting the position of a shutter disk within a physical vapor deposition chamber having a substrate support generally includes moving the shutter disk away from a substrate support, and changing a state of a first sensor in response to a position of an edge the shutter disk.Type: GrantFiled: February 20, 2002Date of Patent: December 30, 2003Assignee: Applied Materials, Inc.Inventors: Michael Feltsman, Allen Lau, Michael Rosenstein, Marc O. Schweitzer
-
Publication number: 20030173526Abstract: A method and system for providing a texture to a surface of a workpiece is provided. The method comprises providing a workpiece to a texturizing chamber and scanning a beam of electromagnetic energy across the surface of the workpiece to form a plurality of features thereon. The features formed are generally depressions, protuberances, and combinations thereof. Also provided is a method of reducing contamination in a process chamber. The method comprises scanning a beam of electromagnetic energy across a surface of one or more process chamber components to form a plurality of features thereon, positioning the one or more chamber components into a process chamber, and initiating a process sequence within the process chamber.Type: ApplicationFiled: March 13, 2002Publication date: September 18, 2003Applicant: Applied Materials, Inc.Inventors: Alan R. Popiolkowski, Shannon M. Hart, Marc O. Schweitzer, Alan B. Liu, Jennifer L. Watia
-
Publication number: 20030155234Abstract: The present invention generally provides a physical vapor deposition chamber and a method for detecting a position of a shutter disk within a physical vapor deposition chamber. In one embodiment, a physical vapor deposition chamber includes a chamber body having a shutter disk mechanism disposed therein. A housing is sealingly coupled to a sidewall of the chamber body and communicates therewith through a slot formed through the sidewall. At least a first sensor is disposed adjacent to the housing and orientated to detect the presence of a shutter disk mechanism within the housing. In one embodiment, a method for detecting the position of a shutter disk within a physical vapor deposition chamber having a substrate support generally includes moving the shutter disk away from a substrate support, and changing a state of a first sensor in response to a position of an edge the shutter disk.Type: ApplicationFiled: February 20, 2002Publication date: August 21, 2003Applicant: Applied Materials, Inc.Inventors: Michael Feltsman, Allen Lau, Michael Rosenstein, Marc O. Schweitzer
-
Publication number: 20030131794Abstract: A semiconductor processing chamber having a motorized lid is provided. In one embodiment, the semiconductor processing chamber generally includes a chamber body having sidewalls and a bottom defining an interior volume. A lid assembly is coupled to the chamber body and is movable between a first position that encloses the interior volume and a second position. A hinge assembly thereto is coupled between the lid assembly and the chamber body. A motor is coupled to the hinge assembly to facilitate moving the lid assembly between the first position and the second position.Type: ApplicationFiled: January 17, 2002Publication date: July 17, 2003Applicant: Applied Materials, Inc.Inventors: Michael Rosenstein, Alex Shenderovich, Marc O. Schweitzer, Ilya Lavitsky, Alvin Lau, Michael Feltsman
-
Publication number: 20030116432Abstract: Embodiments of the invention provide a processing apparatus having a lower reactor portion, an adjustable reactor wall portion attached to an upper portion of the lower reactor portion, the adjustable reactor wall portion being configured for selective linear expansion and contraction, and a source assembly positioned above the adjustable reactor wall portion. The cooperative operation of the source, adjustable wall, and the lower reactor creates a processing apparatus wherein the throw distance may be varied without disassembly of the reactor.Type: ApplicationFiled: December 26, 2001Publication date: June 26, 2003Applicant: APPLIED MATERIALS, INC.Inventors: Marc O. Schweitzer, Dinesh Saigal, Alan Liu