Abstract: An optoelectronic module for data communication through an optical fiber. The optoelectronic module may comprise a base, an outer cap, an inner cap, a flexible substrate, an attachment member, a moisture barrier and an optoelectronic module. The outer cap may have a first cavity and coupled with the base. A slit may be formed on the outer cap. The flexible substrate may be extended through the slit of the outer cap. The inner cap may be disposed within the first cavity. The inner cap may comprise a second cavity. The attachment member may be disposed within the first cavity and configured to attach the inner cap to the base. The moisture barrier may be disposed within the first cavity and encapsulates the attachment member. The optoelectronic component may be disposed within the second cavity and proximate to the flexible substrate.

Abstract: An optoelectronic module for data communication through an optical fiber. The optoelectronic module may comprise a base, an outer cap, an inner cap, a flexible substrate, an attachment member, a moisture barrier and an optoelectronic module. The outer cap may have a first cavity and coupled with the base. A slit may be formed on the outer cap. The flexible substrate may be extended through the slit of the outer cap. The inner cap may be disposed within the first cavity. The inner cap may comprise a second cavity. The attachment member may be disposed within the first cavity and configured to attach the inner cap to the base. The moisture barrier may be disposed within the first cavity and encapsulates the attachment member. The optoelectronic component may be disposed within the second cavity and proximate to the flexible substrate.

Abstract: A TO-can header assembly is provided that has improved heat dissipation and thermal resistance characteristics. The TO-can header assembly includes a relatively large ceramic heat dissipation block that functions as both a carrier for the laser diode and as a heat dissipation device. The ceramic heat dissipation block is in contact with the upper mounting surface of the header to allow a relatively large amount of heat to quickly pass from the laser diode through the heat dissipation block and into the upper mounting surface of the header. The cylindrical side wall of the header is smooth, rather than notched, and at least a substantial portion of the smooth cylindrical side wall is in continuous contact with an external heat sink device. Heat moves rapidly from the header into the external heat sink device where it is dissipated, thereby reducing the thermal resistance of the header.

Abstract: A laser mounted in a casing is driven by and mounted close to its driving circuit. To reduce the effect on the laser of heat generated by the driver circuit, the casing includes a passive heat sink element on which the driver circuit is mounted whereby heat generated by the driver is dissipated by the passive heat sink element.

Abstract: A fiber stub assembly is provided that has a cladding layer that is reduced in diameter near the end of the stub into which light is launched from a light source. The portion of the stub having the cladding layer with the reduced diameter is surrounded by a light-absorbing material that is in contact with the inner surface of the ferule and with the outer surface of the cladding layer. The light-absorbing material and the outer surface of the cladding layer have indices of refraction that are matched, or very close to one another, such that any modes of light that are propagating in the cladding layer that impinge on the interface propagate into the light-absorbing material and are absorbed thereby. The reduced diameter of the cladding layer and the surrounding light-absorbing material form a pin hole opening through which light is received.

Abstract: A laser mounted in a casing is driven by and mounted close to its driving circuit. To reduce the effect on the laser of heat generated by the driver circuit, the casing includes a passive heat sink element on which the driver circuit is mounted whereby heat generated by the driver is dissipated by the passive heat sink element.

Abstract: A fiber stub assembly is provided that has a cladding layer that is reduced in diameter near the end of the stub into which light is launched from a light source. The portion of the stub having the cladding layer with the reduced diameter is surrounded by a light-absorbing material that is in contact with the inner surface of the ferule and with the outer surface of the cladding layer. The light-absorbing material and the outer surface of the cladding layer have indices of refraction that are matched, or very close to one another, such that any modes of light that are propagating in the cladding layer that impinge on the interface propagate into the light-absorbing material and are absorbed thereby. The reduced diameter of the cladding layer and the surrounding light-absorbing material form a pin hole opening through which light is received.

Abstract: A laser mounted in a casing is driven by and mounted close to its driving circuit. To reduce the effect on the laser of heat generated by the driver circuit, the casing includes a passive heat sink element on which the driver circuit is mounted whereby heat generated by the driver is dissipated by the passive heat sink element.

Abstract: An optical sub assembly for receiving an optical fiber transmission line for coupling to an optical device, to a receptacle for use in such a sub assembly and to a method of manufacture of such a sub assembly. The optical sub assembly preferably provides electrical isolation between a receptacle having a nose for receiving the optical fiber and a package housing an optical device. The nose houses a ferrule containing a fiber stub which may be optically aligned with an optical device housed in a package before securing the receptacle to the package. The electrical insulation is provided between the nose and the package by a sleeve extending along a middle portion of the ferrule and an insulating portion positioned between the sleeve and the nose.

Abstract: The present invention comprises an optical module, passively aligned and used in high-speed optical communication systems, having a ferrule disposed in an aperture in an upper plate of the module. The ferrule protrudes a predetermined distance through the aperture in order to guarantee butt coupling of an optical fibre to an active optical component disposed at a predetermined height on a lower plate of the module.

Abstract: A laser mounted in a casing is driven by and mounted close to its driving circuit. To reduce the effect on the laser of heat generated by the driver circuit, the casing includes a passive heat sink element on which the driver circuit is mounted whereby heat generated by the driver is dissipated by the passive heat sink element.

Abstract: A package for opto-electrical components, includes a casing having (1) a chamber and (2) at least one board or tile for carrying the opto-electrical components. The casing has an opening (shaped as a parallelogram) defining an optical feed-through path between the chamber and the outside of the casing. The casing includes ceramic material in the vicinity of the opening. An adapter associated with the opening has a substantially circular aperture to accept a fiber pigtail and/or a fiber optic connector.

Abstract: A package for opto-electrical components includes a casing having a chamber for at least one board or tile adapted to carry the opto-electrical components. The casing includes a set of electrical connections including at least one radio-frequency differential line between the chamber and the casing exterior.

Abstract: A package for opto-electrical components includes a casing having a chamber, and an optical feed-through between the chamber and the casing exterior. At least one board or tile adapted to carry opto-electrical components is in the chamber. The board or tile creates a solid mechanical structure with the casing while providing electrical ohmic connections with a set of electrical connections on the casing. The board or tile is from of an assortment of boards or tiles of different types.

Abstract: The present invention comprises an optical module, passively aligned and used in high-speed optical communication systems, having a ferrule disposed in an aperture in an upper plate of the module. The ferrule protrudes a predetermined distance through the aperture in order to guarantee butt coupling of an optical fibre to an active optical component disposed at a predetermined height on a lower plate of the module.

Abstract: This invention relates to an optical sub assembly for receiving an optical fibre transmission line for coupling to an optical device, to a receptacle for use in such a sub assembly and to a method of manufacture of such a sub assembly. In particular, this invention relates to an optical sub assembly which provides electrical isolation between a receptacle (1) having a nose (8) for receiving the optical fibre and a package (2) housing an optical device (3).

Abstract: A package for opto-electrical components includes a casing having a chamber, and an optical feed-through between the chamber and the casing exterior. At least one board or tile adapted to carry opto-electrical components is in the chamber. The board or tile creates a solid mechanical structure with the casing while providing electrical ohmic connections with a set of electrical connections on the casing. The board or tile is from of an assortment of boards or tiles of different types.

Abstract: A package for opto-electrical components, includes a casing having (1) a chamber and (2) at least one board or tile for carrying the opto-electrical components. The casing has an opening (shaped as a parallelogram) defining an optical feed-through path between the chamber and the outside of the casing. The casing includes ceramic material in the vicinity of the opening. An adapter associated with the opening has a substantially circular aperture to accept a fiber pigtail and/or a fiber optic connector.

Abstract: A package for opto-electrical components includes a casing having a chamber for at least one board or tile adapted to carry the opto-electrical components. The casing includes a set of electrical connections including at least one radio-frequency differential line between the chamber and the casing exterior.

Abstract: A laser module (1) comprises a Fabry-Perot cavity active element (2) with a facet (3) bearing an anti-reflection coating and an external cavity made by an optical fibre Bragg grating (5) with low reflectivity. This grating (5) presents a non-uniform profile of modulation of the refractive index, asymmetrical in the direction of the grating length, such as to give rise to a position of the equivalent mirror plane that is offset towards the end of the grating (5) that is closer to the active element (2).