Abstract: A cantilever for a scanning probe microscope is disclosed. The cantilever includes a piezoresistor for detecting the deflection of the cantilever, and a tip which is formed integrally with the cantilever. A process of fabricating such a cantilever is also disclosed, the process yielding a tip which has a high aspect ratio and a small radius of curvature at its apex. A combined atomic force/lateral force microscope including two or more piezoresistors responsive to both the bending and torsion of the cantilever is also disclosed.

Abstract: A microminiature cantilever structure is provided having a cantilever arm with a piezoresistive resistor embedded in at least the fixed end of the cantilever arm. Deflection of the free end of the cantilever arm produces stress in the base of the cantilever. That stress changes the piezoresistive resistor's resistance at the base of the cantilever in proportion to the cantilever arm's deflection. Resistance measuring apparatus is coupled to the piezoresistive resistor to measure its resistance and to generate a signal corresponding to the cantilever arm's deflection. The microminiature cantilever is formed on a semiconductor substrate. A portion of the free end of the cantilever arm is doped to form an electrically separate U-shaped piezoresistive resistor. The U-shaped resistor has two legs oriented parallel to an axis of the semiconductor substrate having a non-zero piezoresistive coefficient.

Abstract: A nitride cantilever is formed with an integral conical silicon tip at the free end thereof. A top layer of silicon dioxide is patterned into a tip mask on a doped or epitaxial silicon layer in a silicon substrate. Photoresist is spun on the silicon substrate and patterned and the silicon is etched to define a cantilever pattern in the substrate with the tip mask positioned to be near the free end of a nitride cantilever to be subsequently formed. A bottom layer of silicon dioxide is formed on the silicon substrate and then patterned and etched to define a masking aperture on the bottom silicon dioxide layer. The bottom of the silicon substrate is anisotropically etched through the masking aperture and the etch stops at the doped silicon layer. Alternatively, electrochemical etching is done by applying an electric potential across the P-N junction between the doped silicon layer and the appropriately-doped substrate. This releases the free end of the doped silicon layer from the silicon substrate.