Abstract: An optoelectronic device that includes at least one adjustable optical damping member arranged upstream of a photodetector and damps the optical radiation passing to the photodetector. The device is configured so that an electrical output of an amplifier is connected directly or indirectly to the adjustable optical damping member. An output signal of the amplifier or a control signal formed therewith drives the optical damping member, and the photodetector, the amplifier and the damping member are integrated in the same semiconductor substrate.

Abstract: The invention relates, inter alia, to a photonic component (10), which has an interference device (20), which has at least one input and at least a first and a second output.

Abstract: An exemplary embodiment of the invention relates to an optical connector comprising a wave-guiding element and a lens device configured to transmit radiation between the wave-guiding element and at least one optical port of the connector, wherein the lens device comprises a first outer surface and a second outer surface opposite the first outer surface, wherein the first outer surface is connected to the wave-guiding element and forms at least one lens, and wherein a section of the second outer surface opposite said at least one lens forms said at least one optical port of the connector.

Abstract: The invention relates to optical devices comprising polarization diversity couplers. An embodiment of the invention relates to an optical device comprising a polarization diversity coupler configured to receive a beam of optical radiation. The optical device may further comprise a phase shifter, a 2×N coupler, a photodetector and a control unit configured to generate a control signal based on a monitor signal of the photodetector.

Abstract: The invention relates, inter alia, to a photonic component (10), which has an interference device (20), which has at least one input and at least a first and a second output.

Abstract: The invention relates to a component (10) with a photodetector (PD) and an electrical amplifier (TIA) connected to the photodetector (PD), wherein the photodetector (PD) and the amplifier (TIA) are integrated in the same semiconductor substrate (11). According to the invention, at least one adjustable optical damping member (30) is arranged in front of the photodetector (PD), which damping member damps or at least can damp optical radiation arriving at the photodetector (PD), an electrical output (A) of the amplifier (TIA) is connected directly or indirectly to the adjustable optical damping member (30) and an output signal (AS) of the amplifier (TIA) or a control signal (ST) formed therewith controls the optical damping member (30), and the photodetector (PD), the amplifier (TIA) and the damping member (30) are integrated in the same semiconductor substrate (11).

Abstract: An exemplary embodiment of the invention relates to an optical connector comprising a wave-guiding element and a lens device configured to transmit radiation between the wave-guiding element and at least one optical port of the connector, wherein the lens device comprises a first outer surface and a second outer surface opposite the first outer surface, wherein the first outer surface is connected to the wave-guiding element and forms at least one lens, and wherein a section of the second outer surface opposite said at least one lens forms said at least one optical port of the connector.

Abstract: An embodiment of the invention relates to an optical assembly comprising a circuit board comprising a first side, a second side, and at least one hole that extends through the circuit board, a photonic chip having a front side and a back side, the front side of the photonic chip being mounted on the first side of the circuit board and electrically connected to at least one electrical conductor of the circuit board, at least one component being mounted on the front side of the photonic chip opposite the hole and protruding from the front side of the photonic chip into the hole or through the hole, and a wave-guiding element that is located on the second side of the circuit board and optically coupled to the photonic chip through said hole.