Abstract: An electrical device including a conductor cable having an electrical conductor embedded in an insulation sheath of the conductor cable in a contact plane. The electrical conductor is stripped of the insulation sheath in a predetermined contact section at least on one contact side, the contact section of the conductor is bent out with the contact side from the contact plane to beyond the insulation sheath. The device further includes an electrical connection counterpart. The contact side of the contact section of the conductor rests on the electrical connection counterpart and is connected directly to the electrical connection counterpart to form an electrical contact.

Abstract: An electrical device including a conductor cable having an electrical conductor embedded in an insulation sheath of the conductor cable in a contact plane. The electrical conductor is stripped of the insulation sheath in a predetermined contact section at least on one contact side, the contact section of the conductor is bent out with the contact side from the contact plane to beyond the insulation sheath. The device further includes an electrical connection counterpart. The contact side of the contact section of the conductor rests on the electrical connection counterpart and is connected directly to the electrical connection counterpart to form an electrical contact.

Abstract: An RFID transponder antenna has a carrier substrate and an auxiliary substrate. The carrier substrate is provided with a contact point for a first connection to an integrated circuit, and a first conductor path including at least two coil turns. A first end of the path forms a contact terminal for a second connection to the integrated circuit. The other end forms a connection point for an electrical connection to a second conductor path. The second path on the auxiliary substrate forms a bridge over the coil turns. The second conductor path has one end connected to the contact point, and another end connected to the connection point providing a permanent connection between the auxiliary substrate and/or the first conductor path, and the carrier substrate and/or second conductor path; the permanent connection being formed at least at one point lying between both ends of the auxiliary substrate.

Abstract: A method is provided for producing an arrangement, which, for example, may be used for further processing into a non-contact chip card or an identification document and which comprises a multi-layer structure, with a first part of an RFID antenna, at least comprising a coil-shaped antenna structure and a connecting structure, being arranged on a carrier layer and the chip being directly mounted on this part of the antenna structure and contacted, with a compensation layer being arranged thereabove, which in the area of the chip comprises an embedding opening and which comprises at least two contacting openings in the intersection area of the first part of the RFID antenna with a bridge structure, which is located on a cover layer, and subsequently the individual layers being connected to each other via lamination.

Abstract: A method is provided for producing an arrangement, which, for example, may be used for further processing into a non-contact chip card or an identification document and which comprises a multi-layer structure, with a first part of an RFID antenna, at least comprising a coil-shaped antenna structure and a connecting structure, being arranged on a carrier layer and the chip being directly mounted on this part of the antenna structure and contacted, with a compensation layer being arranged thereabove, which in the area of the chip comprises an embedding opening and which comprises at least two contacting openings in the intersection area of the first part of the RFID antenna with a bridge structure, which is located on a cover layer, and subsequently the individual layers being connected to each other via lamination.

Abstract: An RFID transponder antenna has a carrier substrate and an auxiliary substrate. The carrier substrate is provided with a contact point for a first connection to an integrated circuit, and a first conductor path including at least two coil turns. A first end of the path forms a contact terminal for a second connection to the integrated circuit. The other end forms a connection point for an electrical connection to a second conductor path. The second path on the auxiliary substrate forms a bridge over the coil turns. The second conductor path has one end connected to the contact point, and another end connected to the connection point providing a permanent connection between the auxiliary substrate and/or the first conductor path, and the carrier substrate and/or second conductor path; the permanent connection being formed at least at one point lying between both ends of the auxiliary substrate.