Abstract: A microstructure device package includes a package housing configured and adapted to house a microstructure device. A bracket is housed in the package housing. The bracket includes a bracket base with a first bracket arm and a second bracket arm each extending from the bracket base. A channel is defined between the first and second bracket arms. The first bracket aim defines a first mounting surface facing inward with respect to the channel. The second bracket aim defines a second mounting surface facing outward with respect to the channel. The second mounting surface of the bracket is mounted to the package housing. A microstructure device is mounted to the first mounting surface in the channel. The bracket is configured and adapted to isolate the microstructure device from packaging stress imparted from the package housing on the second mounting surface of the bracket.

Abstract: A microstructure device package includes a package housing configured and adapted to house a microstructure device. A bracket is housed in the package housing. The bracket includes a bracket base with a first bracket arm and a second bracket arm each extending from the bracket base. A channel is defined between the first and second bracket arms. The first bracket aim defines a first mounting surface facing inward with respect to the channel. The second bracket aim defines a second mounting surface facing outward with respect to the channel. The second mounting surface of the bracket is mounted to the package housing. A microstructure device is mounted to the first mounting surface in the channel. The bracket is configured and adapted to isolate the microstructure device from packaging stress imparted from the package housing on the second mounting surface of the bracket.

Abstract: Spring set configurations that include an advantageous combination of spring geometries are disclosed. Spring elements having curved and straight sections, orientation of spring element anchor points with respect to the common radius, orientation of spring element segments with respect to a specific axis, balance of the length of spring elements about the common radius, and mass balance about the common radius can be used to mitigate unwanted out of plane motion. The spring set provides planar motion while reducing undesired out of plane motion making MEMS devices substantially insensitive to the process-induced etch angle variations of the spring elements. The spring set can be used in a MEMS gyro device which maintains the desired resonant modes and consistently low quadrature error even with process variations in manufacturing causing undesirable etch angles.