Patents by Inventor Marcus Ahles

Marcus Ahles has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10281358
    Abstract: A semiconductor sensor includes a cavity; a fluid connection between the cavity and an inlet area; a pump diaphragm that bounds the cavity; and a measuring diaphragm that bounds the cavity. The fluid connection includes a diffusion channel having multiple openings in the inlet area or multiple diffusion channels having respectively an opening in the inlet area, and it is possible to close at least one of the openings using laser light in order to influence an effective length or an effective cross section of the fluid connection.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: May 7, 2019
    Assignee: ROBERT BOSCH GMBH
    Inventors: Andreas Haeffelin, Harald Guenschel, Janine Riedrich-Moeller, Marcus Ahles
  • Publication number: 20170212009
    Abstract: A semiconductor sensor includes a cavity; a fluid connection between the cavity and an inlet area; a pump diaphragm that bounds the cavity; and a measuring diaphragm that bounds the cavity. The fluid connection includes a diffusion channel having multiple openings in the inlet area or multiple diffusion channels having respectively an opening in the inlet area, and it is possible to close at least one of the openings using laser light in order to influence an effective length or an effective cross section of the fluid connection.
    Type: Application
    Filed: January 26, 2017
    Publication date: July 27, 2017
    Inventors: Andreas Haeffelin, Harald Guenschel, Janine Riedrich-Moeller, Marcus Ahles
  • Patent number: 9082831
    Abstract: A component having a via includes: (i) a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, the first via portion being separated by the first trench structure from the first surrounding layer portion; (ii) a second layer having a second via portion, a second trench structure, and a second surrounding layer portion, the second via portion being separated by the second trench structure from the second surrounding layer portion; (iii) an insulation layer disposed between the first and the second layer, the insulation layer having an opening so that the first and the second via portions of the first and the second layers are directly connected to one another in the region of the opening. The first via portion and the second surrounding layer portion at least partially overlap.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: July 14, 2015
    Assignee: ROBERT BOSCH GMBH
    Inventors: Marcus Ahles, Jochen Reinmuth, Hubert Benzel, Simon Armbruster
  • Patent number: 8519494
    Abstract: A method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate includes: n-doping at least one contiguous lattice-type area of a p-doped silicon substrate surface; porously etching a substrate area beneath the n-doped lattice structure; producing a cavity in this substrate area beneath the n-doped lattice structure; growing a first monocrystalline silicon epitaxial layer on the n-doped lattice structure; at least one opening in the n-doped lattice structure being dimensioned in such a way that it is not closed by the growing first epitaxial layer but instead forms an access opening to the cavity; an oxide layer being created on the cavity wall; a rear access to the cavity being created, the oxide layer on the cavity wall acting as an etch stop layer; and the oxide layer being removed in the area of the cavity.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: August 27, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Torsten Kramer, Marcus Ahles, Armin Grundmann, Kathrin Knese, Hubert Benzel, Gregor Schuermann, Simon Armbruster
  • Patent number: 8485041
    Abstract: A sensor system, e.g., a pressure sensor system, includes a substrate having at least one trench on a first side. The trench is provided for forming a first diaphragm region on a second side opposite from the first side. In addition, a second diaphragm region and a cavern are integrated into the material of the first diaphragm region.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: July 16, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Marcus Ahles, Hubert Benzel, Heribert Weber
  • Patent number: 8429977
    Abstract: A very robust sensor element for an absolute-pressure measurement is described, which is suitable for high temperatures and able to be miniaturized to a large extent. The micromechanical pressure-sensor element includes a sensor diaphragm having a rear-side pressure connection and at least one dielectrically insulated piezo resistor for signal acquisition. Furthermore, the pressure-sensor element has a front-side reference volume, which is sealed by a cap structure spanning the sensor diaphragm. The cap structure is realized as thin-film structure.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: April 30, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Marcus Ahles, Hubert Benzel
  • Patent number: 8293957
    Abstract: Described are oligotetracenes of formula I which may either be unsubstituted or carry one or more substituents R and R? which are selected from the group comprising halogen, CN, alkyl or alkoxy radicals containing 1 to 18 carbon atoms, aryl radicals containing up to 10 carbon atoms which may also contain one or more heteroatoms, and/or fluorinated or perfluorinated alkyl or alkoxy radicals containing 1 to 18 carbon atoms, where n is an integer from 1 to 20, preferably 1 to 6, very particularly preferably 1 or 2, and X stands for a single bond, an alklyene group containing 1 to 6 carbon atoms, a hydrocarbon chain having one or more conjugated double bonds, an aryl group, or a system composed of one or more condensed aromatic rings. In the oligotetracenes according to the invention, one or more of the condensed aromatic six-atom rings may be substituted by a five-atom ring which may also contain a heteroatom.
    Type: Grant
    Filed: June 21, 2006
    Date of Patent: October 23, 2012
    Assignee: Dritte Patentportfolio Beteiligungsgesellschaft mbH & Co. KG
    Inventors: Matthias Rehahn, Michael Roth, Heinz Von Seggern, Roland Schmechel, Marcus Ahles
  • Patent number: 8146439
    Abstract: A sensor system, in particular a pressure sensor system, having a substrate having a main extension plane, the substrate having at least one trench on a first side, and the trench being provided to produce a diaphragm area on a second side of the substrate diametrically opposite to the first side perpendicularly to the main extension plane, and a decoupling element further being integrated in the material of the diaphragm area.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: April 3, 2012
    Assignee: Robert Bosch GmbH
    Inventors: Marcus Ahles, Hubert Benzel
  • Publication number: 20120073379
    Abstract: A sensor system for detecting high pressures includes a micromechanical sensor element which is situated on a support and is mounted via this support. A diaphragm is formed in the upper surface of the sensor element, the diaphragm spanning a cavern having a rear opening. The support has a passage opening and is connected to the rear side of the sensor element in such a way that the passage opening opens into the rear opening of the cavern. An annular recess is formed in the rear side of the sensor element, the annular recess being situated above the edge area of the passage opening, so that the joining surface between the sensor element and the support does not extend to the edge of the passage opening.
    Type: Application
    Filed: February 1, 2010
    Publication date: March 29, 2012
    Inventors: Marcus Ahles, Hubert Benzel
  • Publication number: 20120068356
    Abstract: A component having a via includes: (i) a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, the first via portion being separated by the first trench structure from the first surrounding layer portion; (ii) a second layer having a second via portion, a second trench structure, and a second surrounding layer portion, the second via portion being separated by the second trench structure from the second surrounding layer portion; (iii) an insulation layer disposed between the first and the second layer, the insulation layer having an opening so that the first and the second via portions of the first and the second layers are directly connected to one another in the region of the opening. The first via portion and the second surrounding layer portion at least partially overlap.
    Type: Application
    Filed: September 7, 2011
    Publication date: March 22, 2012
    Inventors: Marcus Ahles, Jochen Reinmuth, Hubert Benzel, Simon Armbruster
  • Publication number: 20110259109
    Abstract: A sensor system, e.g., a pressure sensor system, includes a substrate having at least one trench on a first side. The trench is provided for forming a first diaphragm region on a second side opposite from the first side. In addition, a second diaphragm region and a cavern are integrated into the material of the first diaphragm region.
    Type: Application
    Filed: July 10, 2009
    Publication date: October 27, 2011
    Inventors: Marcus Ahles, Hubert Benzel, Heribert Weber
  • Publication number: 20110209555
    Abstract: A very robust sensor element for an absolute-pressure measurement is described, which is suitable for high temperatures and able to be miniaturized to a large extent. The micromechanical pressure-sensor element includes a sensor diaphragm having a rear-side pressure connection and at least one dielectrically insulated piezo resistor for signal acquisition. Furthermore, the pressure-sensor element has a front-side reference volume, which is sealed by a cap structure spanning the sensor diaphragm. The cap structure is realized as thin-film structure.
    Type: Application
    Filed: February 25, 2011
    Publication date: September 1, 2011
    Inventors: Marcus Ahles, Hubert Benzel
  • Publication number: 20110147864
    Abstract: A method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate includes: n-doping at least one contiguous lattice-type area of a p-doped silicon substrate surface; porously etching a substrate area beneath the n-doped lattice structure; producing a cavity in this substrate area beneath the n-doped lattice structure; growing a first monocrystalline silicon epitaxial layer on the n-doped lattice structure; at least one opening in the n-doped lattice structure being dimensioned in such a way that it is not closed by the growing first epitaxial layer but instead forms an access opening to the cavity; an oxide layer being created on the cavity wall; a rear access to the cavity being created, the oxide layer on the cavity wall acting as an etch stop layer; and the oxide layer being removed in the area of the cavity.
    Type: Application
    Filed: April 21, 2009
    Publication date: June 23, 2011
    Inventors: Torsten Kramer, Marcus Ahles, Armin Grundmann, Kathrin Knese, Hubert Benzel, Gregor Schuermann, Simon Armbruster
  • Publication number: 20110072906
    Abstract: A sensor system, in particular a pressure sensor system, having a substrate having a main extension plane, the substrate having at least one trench on a first side, and the trench being provided to produce a diaphragm area on a second side of the substrate diametrically opposite to the first side perpendicularly to the main extension plane, and a decoupling element further being integrated in the material of the diaphragm area.
    Type: Application
    Filed: September 21, 2010
    Publication date: March 31, 2011
    Inventors: Marcus AHLES, Hubert BENZEL
  • Publication number: 20080214838
    Abstract: Described are oligotetracenes of formula I which may either be unsubstituted or carry one or more substituents R and R? which are selected from the group comprising halogen, CN, alkyl or alkoxy radicals containing 1 to 18 carbon atoms, aryl radicals containing up to 10 carbon atoms which may also contain one or more heteroatoms, and/or fluorinated or perfluorinated alkyl or alkoxy radicals containing 1 to 18 carbon atoms, where n is an integer from 1 to 20, preferably 1 to 6, very particularly preferably 1 or 2, and X stands for a single bond, an alklyene group containing 1 to 6 carbon atoms, a hydrocarbon chain having one or more conjugated double bonds, an aryl group, or a system composed of one or more condensed aromatic rings. In the oligotetracenes according to the invention, one or more of the condensed aromatic six-atom rings may be substituted by a five-atom ring which may also contain a heteroatom.
    Type: Application
    Filed: June 21, 2006
    Publication date: September 4, 2008
    Inventors: Matthias Rehahn, Michael Roth, Heinz Von Seggern, Roland Schmechel, Marcus Ahles