Patents by Inventor Marcus Allen Childress
Marcus Allen Childress has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11649158Abstract: A microelectromechanical systems (MEMS) device includes a MEMS device body connected to a first mooring portion and a second mooring portion. The MEMS device body further includes a first cantilever and a second cantilever and connected by a spring. The spring is in operable communication with the first cantilever and the second cantilever.Type: GrantFiled: July 22, 2019Date of Patent: May 16, 2023Assignee: Rosemount Aerospace Inc.Inventors: Dosi Dosev, David P. Potasek, Marcus Allen Childress
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Patent number: 10935569Abstract: A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.Type: GrantFiled: January 18, 2019Date of Patent: March 2, 2021Assignee: Rosemount Aerospace Inc.Inventors: Jim Golden, David P. Potasek, Marcus Allen Childress
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Publication number: 20210024350Abstract: A MEMS device includes a first layer, a second layer connected to the first layer, a first mooring portion, a second mooring portion, and a MEMS device body. The MEMS device body is connected to the first mooring portion and the second mooring portion. The MEMS device body further includes a first cantilever attached to the first mooring portion, a second cantilever attached to the second mooring portion, and a spring. The spring is in operable communication with the first cantilever and the second cantilever.Type: ApplicationFiled: July 22, 2019Publication date: January 28, 2021Inventors: Dosi Dosev, David P. Potasek, Marcus Allen Childress
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Patent number: 10830657Abstract: A sensor is configured to attach to a main body and includes a sensor body, a transducer, a transmitter, and a power source. The sensor body is configured to provide a smooth transition with a surface of the main body. The transducer is positioned within the sensor body and is configured to provide a sensed output. The transmitter is positioned within the sensor body and is configured to transmit the sensed output. The power source is positioned within the sensor body and is configured to provide electrical power to the transducer and the transmitter.Type: GrantFiled: September 21, 2018Date of Patent: November 10, 2020Assignee: Rosemount Aerospace Inc.Inventors: Brian Brent Naslund, Peter Mann-Lai Chong, Marcus Allen Childress, Benjamin John Langemo
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Patent number: 10823692Abstract: A microelectromechanical systems die including a thermally conductive substrate including an outer surface, a plurality of low mass sensing structures disposed within the thermally conductive substrate to form a plurality of inter-structure spaces therebetween, each of the plurality of low mass sensing structures include a sensing structure proximal top surface, a sensing structure distal top surface, and a sensing structure width dimension.Type: GrantFiled: October 5, 2016Date of Patent: November 3, 2020Assignee: CARRIER CORPORATIONInventors: John Carl Christenson, David P. Potasek, Marcus Allen Childress
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Patent number: 10782315Abstract: A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.Type: GrantFiled: April 17, 2017Date of Patent: September 22, 2020Assignee: Rosemount Aerospace Inc.Inventors: Jim Golden, David P. Potasek, Marcus Allen Childress
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Publication number: 20190154729Abstract: A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.Type: ApplicationFiled: January 18, 2019Publication date: May 23, 2019Inventors: Jim Golden, David P. Potasek, Marcus Allen Childress
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Patent number: 10273149Abstract: A microelectromechanical systems die including a thermally conductive substrate, at least one insulator film disposed on the thermally conductive substrate, a sensor material disposed on the at least one insulator film, and a heater circumferentially disposed around the sensor material.Type: GrantFiled: July 28, 2016Date of Patent: April 30, 2019Assignee: CARRIER CORPORATIONInventors: David P. Potasek, John Carl Christenson, Marcus Allen Childress
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Publication number: 20190094094Abstract: A sensor is configured to attach to a main body and includes a sensor body, a transducer, a transmitter, and a power source. The sensor body is configured to provide a smooth transition with a surface of the main body. The transducer is positioned within the sensor body and is configured to provide a sensed output. The transmitter is positioned within the sensor body and is configured to transmit the sensed output. The power source is positioned within the sensor body and is configured to provide electrical power to the transducer and the transmitter.Type: ApplicationFiled: September 21, 2018Publication date: March 28, 2019Inventors: Brian Brent Naslund, Peter Mann-Lai Chong, Marcus Allen Childress, Benjamin John Langemo
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Publication number: 20180299482Abstract: A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.Type: ApplicationFiled: April 17, 2017Publication date: October 18, 2018Inventors: Jim Golden, David P. Potasek, Marcus Allen Childress
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Publication number: 20170097314Abstract: A microelectromechanical systems die including a thermally conductive substrate including an outer surface, a plurality of low mass sensing structures disposed within the thermally conductive substrate to form a plurality of inter-structure spaces therebetween, each of the plurality of low mass sensing structures include a sensing structure proximal top surface, a sensing structure distal top surface, and a sensing structure width dimension.Type: ApplicationFiled: October 5, 2016Publication date: April 6, 2017Inventors: John Carl Christenson, David P. Potasek, Marcus Allen Childress
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Publication number: 20170029270Abstract: A microelectromechanical systems die including a thermally conductive substrate, at least one insulator film disposed on the thermally conductive substrate, a sensor material disposed on the at least one insulator film, and a heater circumferentially disposed around the sensor material.Type: ApplicationFiled: July 28, 2016Publication date: February 2, 2017Inventors: David P. Potasek, John Carl Christenson, Marcus Allen Childress
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Patent number: 9541394Abstract: Spring set configurations that include an advantageous combination of spring geometries are disclosed. Spring elements having curved and straight sections, orientation of spring element anchor points with respect to the common radius, orientation of spring element segments with respect to a specific axis, balance of the length of spring elements about the common radius, and mass balance about the common radius can be used to mitigate unwanted out of plane motion. The spring set provides planar motion while reducing undesired out of plane motion making MEMS devices substantially insensitive to the process-induced etch angle variations of the spring elements. The spring set can be used in a MEMS gyro device which maintains the desired resonant modes and consistently low quadrature error even with process variations in manufacturing causing undesirable etch angles.Type: GrantFiled: August 23, 2013Date of Patent: January 10, 2017Assignee: Rosemount Aerospace Inc.Inventors: David Patrick Potasek, Marcus Allen Childress, John Carl Christenson
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Patent number: 9227833Abstract: A microstructure device has a microstructure (e.g., a circuit card assembly, a printed circuit board, etc.) defining a sensitive axis and one or more isolators configured and adapted to be compliant along the sensitive axis and to be rigid along one or more other axes.Type: GrantFiled: May 29, 2013Date of Patent: January 5, 2016Assignee: ROSEMOUNT AEROSPACE INC.Inventors: David Patrick Potasek, Marcus Allen Childress
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Publication number: 20140000367Abstract: Spring set configurations that include an advantageous combination of spring geometries are disclosed. Spring elements having curved and straight sections, orientation of spring element anchor points with respect to the common radius, orientation of spring element segments with respect to a specific axis, balance of the length of spring elements about the common radius, and mass balance about the common radius can be used to mitigate unwanted out of plane motion. The spring set provides planar motion while reducing undesired out of plane motion making MEMS devices substantially insensitive to the process-induced etch angle variations of the spring elements. The spring set can be used in a MEMS gyro device which maintains the desired resonant modes and consistently low quadrature error even with process variations in manufacturing causing undesirable etch angles.Type: ApplicationFiled: August 23, 2013Publication date: January 2, 2014Applicant: ROSEMOUNT AEROSPACE INC.Inventors: David Patrick Potasek, Marcus Allen Childress, John Carl Christenson
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Publication number: 20130328140Abstract: A microstructure device has a microstructure (e.g., a circuit card assembly, a printed circuit board, etc.) defining a sensitive axis and one or more isolators configured and adapted to be compliant along the sensitive axis and to be rigid along one or more other axes.Type: ApplicationFiled: May 29, 2013Publication date: December 12, 2013Inventors: David Patrick Potasek, Marcus Allen Childress
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Patent number: 8539832Abstract: Spring set configurations that include an advantageous combination of spring geometries are disclosed. Spring elements having curved and straight sections, orientation of spring element anchor points with respect to the common radius, orientation of spring element segments with respect to a specific axis, balance of the length of spring elements about the common radius, and mass balance about the common radius can be used to mitigate unwanted out of plane motion. The spring set provides planar motion while reducing undesired out of plane motion making MEMS devices substantially insensitive to the process-induced etch angle variations of the spring elements. The spring set can be used in a MEMS gyro device which maintains the desired resonant modes and consistently low quadrature error even with process variations in manufacturing causing undesirable etch angles.Type: GrantFiled: October 25, 2010Date of Patent: September 24, 2013Assignee: Rosemount Aerospace Inc.Inventors: David Patrick Potasek, Marcus Allen Childress, John Carl Christenson