Abstract: An arrangement for increasing the packing density on a printed circuit with surface mounted electrical components. The printed circuit is formed by two films which are pressed against one another with a dielectric arranged between them. At least one of the mutually opposite faces of the films are fitted with surface mounted electrical components. The via holes are provided in the printed circuit in order to connect the two films, with each via hole being a direct connection between the mutually opposite faces of the films.

Abstract: A waveguide filter formed from a substrate (S), which is coated on the upper face with a structured metallic layer (TM) and one or more metallic striplines (ML1, ML2), and a component (FB) fitted to the upper face of the substrate (S) and with one side wall of the waveguide filter being formed by the structured metallic layer (TM) of the substrate (S). The other side walls of the waveguide filter are formed by the component (FB), and with the waveguide filter having input and output points for coupling the electromagnetic waves carried in the stripline (ML1, ML2) to the waveguide filter, and vice versa.