Patents by Inventor Marcus Bernard Hsu

Marcus Bernard Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package-on-package structure with reduced height
    Patent number: 9484327
    Abstract: To achieve a package-on-package having an advantageously reduced height, a first package substrate has a window sized to receive a second package die. The first package substrate interconnects to the second package substrate through a plurality of package-to-package interconnects such that the first and second substrates are separated by a gap. The second package die has a thickness greater than the gap such that the second package die is at least partially disposed within the first package substrate's window.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 1, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Chin-Kwan Kim, Omar James Bchir, Milind Pravin Shah, Marcus Bernard Hsu, David Fraser Rae