Patents by Inventor Marcus Elmar LANG

Marcus Elmar LANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12207417
    Abstract: The present invention discloses a three-dimensional circuit board processing apparatus, including an input module, a vertical processing module, and an output module, which are arranged in sequence. The vertical processing module includes a conveying unit and a processing assembly. A vertical conveying port is arranged on each of two sides of the vertical processing module. The input module is connected to one end of the conveying unit, and the output module is connected to another end of the conveying unit. The input module and/or the output module are/is a flippable module. According to embodiments of the present invention, by arranging the flippable input module and/or output module, the circuit board may enter and exit the vertical processing module vertically, and may be uniformly processed through the vertical processing module, thereby enhancing the processing quality of the circuit board and improving the automation performance of three-dimensional processing.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: January 21, 2025
    Assignee: Simetric Semiconductor Solutions Co., Ltd.
    Inventors: Marcus Elmar Lang, Kei Ming Yip
  • Publication number: 20240224428
    Abstract: The present invention discloses a three-dimensional circuit board processing apparatus, including an input module, a vertical processing module, and an output module, which are arranged in sequence. The vertical processing module includes a conveying unit and a processing assembly. A vertical conveying port is arranged on each of two sides of the vertical processing module. The input module is connected to one end of the conveying unit, and the output module is connected to another end of the conveying unit. The input module and/or the output module are/is a flippable module. According to embodiments of the present invention, by arranging the flippable input module and/or output module, the circuit board may enter and exit the vertical processing module vertically, and may be uniformly processed through the vertical processing module, thereby enhancing the processing quality of the circuit board and improving the automation performance of three-dimensional processing.
    Type: Application
    Filed: January 3, 2023
    Publication date: July 4, 2024
    Inventors: Marcus Elmar Lang, Kei Ming Yip
  • Patent number: 11854829
    Abstract: A method for structuring a substrate is specified, in particular structuring by means of selective etching in the semiconductor and IC substrate industry, in which the following steps are carried out: providing a substrate, applying a titanium seed layer, full-area coating with a photoresist layer, lithographic structuring of the photoresist layer, in order to expose regions of the titanium seed layer, selectively depositing copper as conductor tracks in those areas in which the titanium seed layer is exposed, removing the structured photoresist, and etching the titanium seed layer in the areas previously covered by the structured photoresist, wherein phosphoric acid is used to etch the titanium seed layer and, in addition, exposure to UV light is carried out during the etching of the titanium.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: December 26, 2023
    Assignee: LSR Engineering & Consulting Limited
    Inventor: Marcus Elmar Lang
  • Patent number: 11702758
    Abstract: An electroplating device and an electroplating method, the electroplating device includes an electroplating unit for electroplating a production panel. The electroplating unit includes an electrolyte channel for jetting an electrolyte toward the production panel, and an electroplating assembly disposed on an outer surface of the electrolyte channel. The electroplating assembly includes an anode disposed on the outer surface of the electrolyte channel, and a suction channel in the anode which is used for absorbing the electrolyte in a direction opposite to a jet-plating direction. The electrolyte may be uniformly distributed on the production panel by the combination of the electrolyte channel and the electroplating assembly.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: July 18, 2023
    Assignee: Simetric Semiconductor Solutions Co., Ltd.
    Inventor: Marcus Elmar Lang
  • Publication number: 20220349081
    Abstract: An electroplating device and an electroplating method, the electroplating device includes an electroplating unit for electroplating a production panel. The electroplating unit includes an electrolyte channel for jetting an electrolyte toward the production panel, and an electroplating assembly disposed on an outer surface of the electrolyte channel. The electroplating assembly includes an anode disposed on the outer surface of the electrolyte channel, and a suction channel in the anode which is used for absorbing the electrolyte in a direction opposite to a jet-plating direction. The electrolyte may be uniformly distributed on the production panel by the combination of the electrolyte channel and the electroplating assembly.
    Type: Application
    Filed: July 14, 2022
    Publication date: November 3, 2022
    Inventor: Marcus Elmar Lang
  • Publication number: 20220130680
    Abstract: A method for structuring a substrate is specified, in particular structuring by means of selective etching in the semiconductor and IC substrate industry, in which the following steps are carried out: providing a substrate, applying a titanium seed layer, full-area coating with a photoresist layer, lithographic structuring of the photoresist layer, in order to expose regions of the titanium seed layer, selectively depositing copper as conductor tracks in those areas in which the titanium seed layer is exposed, removing the structured photoresist, and etching the titanium seed layer in the areas previously covered by the structured photoresist, wherein phosphoric acid is used to etch the titanium seed layer and, in addition, exposure to UV light is carried out during the etching of the titanium.
    Type: Application
    Filed: May 8, 2020
    Publication date: April 28, 2022
    Applicant: LSR Engineering & Consulting Limited
    Inventor: Marcus Elmar LANG