Patents by Inventor Marcus Heemann
Marcus Heemann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11485884Abstract: The present invention relates to a pressure sensitive adhesive composition comprising: (i) at least one butene-1 (co)polymer; (ii) at least one liquid tackifier; (iii) at least one solid tackifier; (iv) at least one styrene copolymer; (v) optionally at least one further (co)polymer, different from (i) and (iv); (vi) optionally at least one additive. Furthermore, the use of the pressure sensitive adhesive composition according to the invention as closing mean for a packaging unit for foods, for packaging units to be heated in a microwave or oven, for a closing mean for packaging unit for drugs, hygienic tissues, cleaning tissues or cosmetic tissues. An article comprising the pressure sensitive adhesive composition according to the invention and a method of obtaining the article.Type: GrantFiled: May 14, 2019Date of Patent: November 1, 2022Assignee: HENKEL AG & CO., KGaAInventors: Marcus Heemann, Thomas Scheeren, Dirk Kasper, Andrea Queisser
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Patent number: 11414572Abstract: The present invention relates to a pressure sensitive adhesive composition comprising, i) at least one butene-1 (co)polymer; ii) at least one liquid tackifier; iii) at least one solid tackifier; iv) optionally at least one further (co)polymer, different from i); v) optionally at least one additive. Furthermore, the use of the pressure sensitive adhesive composition according to the invention as closing mean for a packaging unit for foods, for packaging units to be heated in a microwave or oven, for a closing mean for packaging unit for drugs, hygienic tissues, cleaning tissues or cosmetic tissues. An article comprising the pressure sensitive adhesive composition according to the invention and a method of obtaining the article.Type: GrantFiled: December 20, 2018Date of Patent: August 16, 2022Assignee: Henkel AG & CO, KGaAInventors: Marcus Heemann, Sebastian Kostyra, Thomas Scheeren, Dirk Kasper
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Patent number: 10544295Abstract: The invention relates to a nontacky film-forming polymer composition (cover material), and tacky hot melt adhesives in the form of pellets which are coated with the polymer composition and producible by coextruding the hot melt adhesive and the cover material. The film-forming composition comprises 5 to 40% by weight of at least one Fischer-Tropsch wax having a melting point of >95° C. and 30 to 70% by weight of at least one metallocene-catalyzed polyolefin having a softening point of >95° C. and a melt flow index (MFI) (230° C., 2.16 kg) of ?1000 and ?300 g/10 minutes. The invention further relates to suitable uses for such hot melt adhesives, methods for their use, and products containing these adhesives.Type: GrantFiled: September 12, 2017Date of Patent: January 28, 2020Assignee: Henkel AG & Co. KGaAInventors: Marcus Heemann, Sebastian Kostyra, Eckhard Puerkner, Gerald Petry, Riju Davis
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Publication number: 20190264075Abstract: The present invention relates to a pressure sensitive adhesive composition comprising: (i) at least one butene-1 (co)polymer; (ii) at least one liquid tackifier; (iii) at least one solid tackifier; (iv) at least one styrene copolymer; (v) optionally at least one further (co)polymer, different from (i) and (iv); (vi) optionally at least one additive. Furthermore, the use of the pressure sensitive adhesive composition according to the invention as closing mean for a packaging unit for foods, for packaging units to be heated in a microwave or oven, for a closing mean for packaging unit for drugs, hygienic tissues, cleaning tissues or cosmetic tissues. An article comprising the pressure sensitive adhesive composition according to the invention and a method of obtaining the article.Type: ApplicationFiled: May 14, 2019Publication date: August 29, 2019Inventors: Marcus HEEMANN, Thomas SCHEEREN, Dirk KASPER, Andrea QUEISSER
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Publication number: 20190119529Abstract: The present invention relates to a pressure sensitive adhesive composition comprising, i) at least one butene-1 (co)polymer; ii) at least one liquid tackifier; iii) at least one solid tackifier; iv) optionally at least one further (co)polymer, different from i); v) optionally at least one additive. Furthermore, the use of the pressure sensitive adhesive composition according to the invention as closing mean for a packaging unit for foods, for packaging units to be heated in a microwave or oven, for a closing mean for packaging unit for drugs, hygienic tissues, cleaning tissues or cosmetic tissues. An article comprising the pressure sensitive adhesive composition according to the invention and a method of obtaining the article.Type: ApplicationFiled: December 20, 2018Publication date: April 25, 2019Inventors: Marcus HEEMANN, Sebastian KOSTYRA, Thomas SCHEEREN, Dirk KASPER
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Patent number: 10233364Abstract: The invention relates to a hotmelt adhesive comprising 10 to 40 wt % of at least one branched styrene-isoprene-styrene block copolymer having a weight percentage diblock fraction in the polymer of less than 30% and a melt flow index of less than 5 g/10 minutes at 200° C. under a test load of 5 kg; 0 to 40 wt % of at least one styrene polymer or styrene copolymer; 20 to 60 wt % of at least one tackifying resin; 0 to 15 wt % of at least one plasticizer; and 0 to 16 wt % of additives and auxiliaries selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers. Also included are the use thereof to bond films, and products, especially packaging products, that include this adhesive.Type: GrantFiled: June 16, 2016Date of Patent: March 19, 2019Assignee: HENKEL AG & CO. KGAAInventors: Marcus Heemann, Sebastian Kostyra, Eckhard Puerkner, Dirk Kasper
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Publication number: 20170369690Abstract: The invention relates to a nontacky film-forming polymer composition (cover material), and tacky hot melt adhesives in the form of pellets which are coated with the polymer composition and producible by coextruding the hot melt adhesive and the cover material. The film-forming composition comprises 5 to 40% by weight of at least one Fischer-Tropsch wax having a melting point of >95° C. and 30 to 70% by weight of at least one metallocene-catalyzed polyolefin having a softening point of >95° C. and a melt flow index (MFI) (230° C., 2.16 kg) of ?1000 and ?300 g/10 minutes. The invention further relates to suitable uses for such hot melt adhesives, methods for their use, and products containing these adhesives.Type: ApplicationFiled: September 12, 2017Publication date: December 28, 2017Inventors: Marcus HEEMANN, Sebastian KOSTYRA, Eckhard PUERKNER, Gerald PETRY, Riju DAVIS
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Publication number: 20160289504Abstract: The invention relates to a hotmelt adhesive comprising 10 to 40 wt % of at least one branched styrene-isoprene-styrene block copolymer having a weight percentage diblock fraction in the polymer of less than 30% and a melt flow index of less than 5 g/10 minutes at 200° C. under a test load of 5 kg; 0 to 40 wt % of at least one styrene polymer or styrene copolymer; 20 to 60 wt % of at least one tackifying resin; 0 to 15 wt % of at least one plasticizer; and 0 to 16 wt % of additives and auxiliaries selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers. Also included are the use thereof to bond films, and products, especially packaging products, that include this adhesive.Type: ApplicationFiled: June 16, 2016Publication date: October 6, 2016Inventors: Marcus HEEMANN, Sebastian KOSTYRA, Eckhard PUERKNER, Dirk KASPER
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Patent number: 8877868Abstract: A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl (meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.Type: GrantFiled: February 26, 2013Date of Patent: November 4, 2014Assignees: Henkel IP & Holding GmbH, Henkel US IP LLCInventors: Marcus Heemann, Charles W. Paul, Maria Xenidou, Maja Schroeder, Sebastian Kostyra, Marisa Phelan
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Publication number: 20140238603Abstract: A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl(meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.Type: ApplicationFiled: February 26, 2013Publication date: August 28, 2014Applicants: Henkel AG & Co. KGaA, Henkel Ireland Limited, Henkel CorporationInventors: Marcus Heemann, Charles W. Paul, Maria Xenidou, Maja Schroeder, Sebastian Kostyra, Marisa Phelan
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Patent number: 8163833Abstract: Melt adhesive containing 5 to 40 wt.-% of at least one ethylene-based copolymer and at least one C3 to C20-?-olefin obtained through metallocene-catalyzed polymerization, 10 to 65 wt.-% of at least one tackifying resin, 0 to 35 wt.-% of a plasticizer, 0.01 to 30 wt.-% additives and additional ingredients selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers, wherein the total should amount to 100%, characterized in that copolymer A is a block copolymer that exhibits a substantially even elastic behavior in the range of 0° C. to 25° C., measured as the ratio of the storage modulus E? according to (E?0C?E?25C)/E?25C<1.5.Type: GrantFiled: March 4, 2011Date of Patent: April 24, 2012Assignee: Henkel AG & Co. KGaAInventors: Thomas Moeller, Volker Erb, Marcus Heemann, Dirk Kasper, Eckhard Puerkner, Bernhard Herlfterkamp
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Patent number: 8076422Abstract: A hot-melt adhesive for resealable packaging, containing 30 to 90 wt. % of at least one copolymer based on ethylene and/or propylene together with C4 to C12-?-olefins, which is obtainable by metallocene-catalyzed polymerization, with a melt index of 5 to 100 g/10 min (DIN ISO 1133), 5 to 50 wt. % of tackifier resins with a softening point of 80 to 140° C., 0 to 15 wt. % of waxes with a melting point of 120 to 170° C., 0.1 to 20 wt. % of additives and auxiliaries, the adhesive having a viscosity of 25,000 mPa·s to 250,000 mPa·s, measured at a temperature of 170 to 190° C.Type: GrantFiled: June 11, 2010Date of Patent: December 13, 2011Assignee: Henkel AG & Co. KGaAInventors: Marcus Heemann, Eckhard Pürkner, Volker Erb, Maja Schroeder, Dirk Vianden
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Publication number: 20110213067Abstract: Melt adhesive containing 5 to 40 wt.-% of at least one ethylene-based copolymer and at least one C3 to C20 -?-olefin obtained through metallocene-catalyzed polymerization, 10 to 65 wt.-% of at least one tackifying resin, 0 to 35 wt.-% of a plasticizer, 0.01 to 30 wt.-% additives and additional ingredients selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers, wherein the total should amount to 100%, characterized in that copolymer A is a block copolymer that exhibits a substantially even elastic behavior in the range of 0° C. to 25° C., measured as the ratio of the storage modulus E? according to (E?0C?E?25C)/E?25C<1.5.Type: ApplicationFiled: March 4, 2011Publication date: September 1, 2011Applicant: Henkel AG & Co. KGaAInventors: Thomas Moeller, Volker Erb, Marcus Heemann, Dirk Kasper, Eckhard Puerkner, Bernhard Herlfterkamp
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Publication number: 20100256274Abstract: A hot-melt adhesive for resealable packaging, containing 30 to 90 wt. % of at least one copolymer based on ethylene and/or propylene together with C4 to C12-?-olefins, which is obtainable by metallocene-catalyzed polymerization, with a melt index of 5 to 100 g/10 min (DIN ISO 1133), 5 to 50 wt. % of tackifier resins with a softening point of 80 to 140° C., 0 to 15 wt. % of waxes with a melting point of 120 to 170° C., 0.1 to 20 wt. % of additives and auxiliaries, the adhesive having a viscosity of 25,000 mPa·s to 250,000 mPa·s, measured at a temperature of 170 to 190° C.Type: ApplicationFiled: June 11, 2010Publication date: October 7, 2010Inventors: Marcus Heemann, Eckhard Pürkner, Volker Erb, Maja Schroeder, Dirk Vianden
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Patent number: 7166341Abstract: Water-soluble or water-dispersible hotmelt adhesives are prepared using graft copolymers produced by graft copolymerizing olefinically unsaturated monomers onto polyalkylene oxides. The adhesives additionally contain at least one resin which improves tackiness and the compatibility of the adhesive components. Other components such as polymers, plasticizers, and additives may also be present. The adhesives are especially suited for use in the labelling of recyclable or reuseable hollow containers. The adhesive may be completely separated from the hollow containers and dissolved in an alkaline washing liquor even at low temperatures.Type: GrantFiled: January 21, 2004Date of Patent: January 23, 2007Assignee: Henkel Kommanditgesellschaft auf Aktien (Henkel KGAA)Inventors: Marcus Heemann, Thomas Moeller, Ingo Gensch, Wolfgang Klingberg
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Patent number: 7156944Abstract: To obtain an adhesive having both a high initial adhesive capacity and high heat resistance, a fusible adhesive which can be cross-linked by radiation and a low tendency to creep is provided. The adhesive contains 0 to 40 weight percent of at least one elastomer which cannot be cross-linked by radiation, 15 to 40 weight percent of at least one compound containing at least two olefinic double bonds, and 20 to 85 weight percent of at least one tackifier. The adhesive is especially suitable for use on high speed labeling machines.Type: GrantFiled: January 24, 2005Date of Patent: January 2, 2007Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Thomas Moeller, Marcus Heemann, Andreas Ferencz
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Publication number: 20050165164Abstract: To obtain an adhesive having both a high initial adhesive capacity and high heat resistance, a fusible adhesive which can be cross-linked by radiation and a low tendency to creep is provided. The adhesive contains 0 to 40 weight percent of at least one elastomer which cannot be cross-linked by radiation, 15 to 40 weight percent of at least one compound containing at least two olefinic double bonds, and 20 to 85 weight percent of at least one tackifier. The adhesive is especially suitable for use on high speed labeling machines.Type: ApplicationFiled: January 24, 2005Publication date: July 28, 2005Inventors: Thomas Moeller, Marcus Heemann, Andreas Ferencz
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Publication number: 20040159394Abstract: Water-soluble or water-dispersible hotmelt adhesives are prepared using graft copolymers produced by graft copolymerizing olefinically unsaturated monomers onto polyalkylene oxides. The adhesives additionally contain at least one resin which improves tackiness and the compatibility of the adhesive components. Other components such as polymers, plasticizers, and additives may also be present. The adhesives are especially suited for use in the labelling of recyclable or reuseable hollow containers. The adhesive may be completely separated from the hollow containers and dissolved in an alkaline washing liquor even at low temperatures.Type: ApplicationFiled: January 21, 2004Publication date: August 19, 2004Inventors: Marcus Heemann, Thomas Moeller, Ingo Gensch, Wolfgang Klingberg
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Patent number: 6677394Abstract: Thermoplastic compositions based on a water-insoluble component of one or more thermoplastic copolymers and one or more resins with a saponification number and a water-soluble or water-dispersible component and a water-swellable component from the class of superabsorbers are suitable as water-swellable hotmelt adhesives. Such water-swellable hotmelt adhesives are preferably used for the production of watertight constructions, more particularly for the production of longitudinally watertight cable constructions.Type: GrantFiled: December 16, 1997Date of Patent: January 13, 2004Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Ruediger Butterbach, Ulrike Maassen, Siegfried Kopannia, Marcus Heemann
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Patent number: 6641911Abstract: Adhesive systems are useful for bonding wrap-around labels using an overlap adhesive in their application to blown plastic containers, more particularly plastic bottles. The adhesive system includes reactive contact adhesives based on multifunctional macromonomer compounds curable in steps by different reaction mechanisms, which may also be present mixed with one-stage reactive mixture components.Type: GrantFiled: September 13, 2000Date of Patent: November 4, 2003Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Eckhard Puerkner, Andreas Ferencz, Marcus Heemann, Thomas Huver, Hermann Onusseit