Patents by Inventor Marcus Rudolf ZIMNIK

Marcus Rudolf ZIMNIK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGES INCLUDING INTERFACE MEMBERS FOR WELDING
    Publication number: 20220223488
    Abstract: An example semiconductor package includes a semiconductor die. In addition, the semiconductor package includes a mold compound having a first side, a second side opposite the first side, and an axis extending between the first side and the second side, the mold compound covering the semiconductor die. Further, the semiconductor package includes an interface member including a first portion and a second portion, the first portion is coupled to the second portion. The first portion is positioned along the first side, the second portion is positioned along the second side, and an engagement of a welding horn with the first portion is adapted to weld the second portion to a surface.
    Type: Application
    Filed: November 30, 2021
    Publication date: July 14, 2022
    Inventors: Tobias Bernhard FRITZ, Marcus Rudolf ZIMNIK