Abstract: A generally flexible strain gage comprising a strain sensing element, and a generally flexible substrate supporting the strain sensing element. The strain sensing element is made of single crystal or polycrystalline semiconducting material. The invention also includes a method for forming a generally flexible strain gage comprising the step of selecting a wafer having a portion of a base material and portion of a single crystal or polycrystalline semiconducting material located thereon. The method further comprises the steps of etching a strain sensing element out of the semiconducting material and forming a generally flexible substrate onto said sensing element.

Abstract: A generally flexible strain gage comprising a strain sensing element, and a generally flexible substrate supporting the strain sensing element. The strain sensing element is made of single crystal or polycrystalline semiconducting material. The invention also includes a method for forming a generally flexible strain gage comprising the step of selecting a wafer having a portion of a base material and portion of a single crystal or polycrystalline semiconducting material located thereon. The method further comprises the steps of etching a strain sensing element out of the semiconducting material and forming a generally flexible substrate onto said sensing element.

Abstract: A media compatible package for a pressure sensing device is made from a non-corrosive, highly chemical resistant material. The package includes a base which holds a printed circuit board having a pressure sensor mounted thereon. A sealing member is placed on the circuit board encircling the pressure sensor and a diaphragm is disposed on the sealing member. A fluid port is attached to the base and compressingly engages the diaphragm creating a sealed chamber around the pressure sensor. The sealed chamber is filled with a pressure transmissive fluid such as oil through a fill hole provided in the printed circuit board. This configuration allows the sensor package to be easily assembled with ordinary components and provides a design where all exposed surfaces of the package can be made from a highly corrosion resistive material.