Abstract: A semiconductor element (semiconductor device) including a substrate having a patterned structure of an organic semiconductor material and a method of manufacturing the semiconductor element are disclosed. According to one embodiment, the method of manufacturing the semiconductor element provides a substrate having a patterned structure of an organic semiconductor material which is cost-effective and which realizes a structure having a high degree of uniformity of the patterned semiconductor regions. The method includes: providing the substrate, applying a continuous layer of an organic semiconductor material onto the substrate, applying a solvent onto the continuous layer in the second regions thereby dissolving and removing the organic semiconductor material, which is located in the second regions, from the continuous layer.

Abstract: Provided are an electronic device including a bank structure and a method of manufacturing the same. The method of manufacturing the electronic device requires a fewer number of processes and comprises a direct patterning of insulating layers, such as fluorinated organic polymer layers, is possible using cost-efficient techniques such as inkjet printing.

Abstract: Provided are an electronic device including a bank structure and a method of manufacturing the same. The method of manufacturing the electronic device requires a fewer number of processes and comprises a direct patterning of insulating layers, such as fluorinated organic polymer layers, is possible using cost-efficient techniques such as inkjet printing.

Abstract: Provided are an electronic device including a bank structure and a method of manufacturing the same. The method of manufacturing the electronic device requires a fewer number of processes and comprises a direct patterning of insulating layers, such as fluorinated organic polymer layers, is possible using cost-efficient techniques such as inkjet printing.

Abstract: A substrate for inkjet printing, which includes a photoresist layer structure on a base substrate, and a method of manufacturing the same are provided. The substrate, which has high surface tension variation and slight thickness variation, may be manufactured at a low cost. The substrate includes a discontinuous organic layer structure made of a fluorinated hydrocarbon or a polysiloxane on the photoresist layer structure.

Abstract: A method of an electrophoretic display (EPD) having an organic thin film transistor thin film (OTFT) control circuit. The method includes: providing an EPD module including a plurality of EPD units on a common substrate, wherein each of the EPD units includes a cell having optical characteristic (or performance) that can be capacitively switched; coating a plurality of pixel electrodes on a side of the EPD module; and preparing the OTFT control circuit by directly coating a plurality of OTFT layers on the side of the EPD module supporting the pixel electrodes.

Abstract: A method of an electrophoretic display (EPD) having an organic thin film transistor thin film (OTFT) control circuit. The method includes: providing an EPD module including a plurality of EPD units on a common substrate, wherein each of the EPD units includes a cell having optical characteristic (or performance) that can be capacitively switched; coating a plurality of pixel electrodes on a side of the EPD module; and preparing the OTFT control circuit by directly coating a plurality of OTFT layers on the side of the EPD module supporting the pixel electrodes.

Abstract: Provided are an electronic device including a bank structure and a method of manufacturing the same. The method of manufacturing the electronic device requires a fewer number of processes and comprises a direct patterning of insulating layers, such as fluorinated organic polymer layers, is possible using cost-efficient techniques such as inkjet printing.

Abstract: A semiconductor element (semiconductor device) including a substrate having a patterned structure of an organic semiconductor material and a method of manufacturing the semiconductor element are disclosed. According to one embodiment, the method of manufacturing the semiconductor element provides a substrate having a patterned structure of an organic semiconductor material which is cost-effective and which realizes a structure having a high degree of uniformity of the patterned semiconductor regions. The method includes: providing the substrate, applying a continuous layer of an organic semiconductor material onto the substrate, applying a solvent onto the continuous layer in the second regions thereby dissolving and removing the organic semiconductor material, which is located in the second regions, from the continuous layer.

Abstract: A flat display device and a method of manufacturing the same are disclosed. The flat panel display includes first electrode layers and second electrode layers arranged on top of a substrate. Multiple pixel regions, arranged between the first electrode layer and the second electrode layer, are formed by a light-emitting portion which includes light-emitting layers. Barriers are formed with at least one or more layers at least partially between the pixel regions, and a groove portion is formed at least partially on one side of each barrier.

Abstract: A metal ink for ink-jet printing conductive lines, a method of preparing the metal ink, a substrate for a display having a plurality of ink-jet printed conductive lines, and a method of manufacturing the substrate are provided. The metal ink includes dispersed metal nano powders and a solvent, wherein the metal ink includes antiabrasion-promoting nano particles and/or a flexibility-promoting polymer. The dispersed metal nano powders include at least one of silver, gold, platinum, palladium nickel, and/or copper. The metal ink for ink-jet printing conductive lines improves the adhesion, abrasive resistance and flexibility of ink-jet printed conductive lines, such as, ink-jet printed address and bus electrodes, to a ground substrate.

Abstract: A substrate for a plasma display panel (PDP) having a plurality of ink-jet printed conductive lines for address and bus electrodes, and a method of manufacturing the substrate are provided. The method includes applying metal adhesion promoter layer to a ground substrate, applying a layer of fluorinated precursors, and applying a plurality of conductive lines. The adhesion of the ink-jet printed conductive lines, i.e. ink-jet printed address and bus electrodes to the ground substrate, and the contact angle of the ink-jet printed conductive lines with respect to the ground substrate are improved, enabling a high resolution display to be manufactured.

Abstract: A substrate and an organic electroluminescence device employing the substrate are provided. The substrate has at least one non-continuous photo-resist coating layer formed on at least one surface of a supporting substrate and the non-continuous photo-resist coating has a plurality of continuous portions. The continuous portions may have high surface energy areas and low surface energy areas. A second photo-resist coating layer is used to at least temporarily overlap the continuous portion which corresponds to the high surface energy area in order to form the low surface energy area.

Abstract: An organic light emitting diode (OLED) includes a substrate having a first electrode layer formed thereon in a predetermined pattern, an insulator layer defining the upper portion of the substrate having the first electrode layer in a predetermined pattern, an organic polymer layer formed based on the pattern defined by the insulator layer, a barrier for blocking flow of the organic polymer layer at both ends of the pattern defined by the insulator layer, and a second electrode layer formed on the organic polymer layer.

Abstract: A flat display device and a method of manufacturing the same are disclosed. The flat panel display includes first electrode layers and second electrode layers arranged on top of a substrate. Multiple pixel regions, arranged between the first electrode layer and the second electrode layer, are formed by a light-emitting portion which includes light-emitting layers. Barriers are formed with at least one or more layers at least partially between the pixel regions, and a groove portion is formed at least partially on one side of each barrier.

Abstract: A substrate for inkjet printing, which includes a photoresist layer structure on a base substrate, and a method of manufacturing the same are provided. The substrate, which has high surface tension variation and slight thickness variation, may be manufactured at a low cost. The substrate includes a discontinuous organic layer structure made of a fluorinated hydrocarbon or a polysiloxane on the photoresist layer structure.

Abstract: A substrate and an organic electroluminescence device employing the substrate are provided. The substrate has at least one non-continuous photo-resist coating layer formed on at least one surface of a supporting substrate and the non-continuous photo-resist coating has a plurality of continuous portions. The continuous portions may have high surface energy areas and low surface energy areas. A second photo-resist coating layer is used to at least temporarily overlap the continuous portion which corresponds to the high surface energy area in order to form the low surface energy area.