Patents by Inventor Mareike Klee

Mareike Klee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020135970
    Abstract: The invention relates to a passive ceramic component with a carrier substrate (1), a first and a second electrode (2, 6), and a ferroelectric dielectric (5). The electrodes (2, 6) and the dielectric (5) preferably comprise a multilayer structure with at least a first and a second layer. The capacitance value C of the capacitor can be varied through the application of a voltage to the electrodes (2, 6), owing to the field dependence of the dielectric constant ≮r of the dielectric (5).
    Type: Application
    Filed: April 3, 2000
    Publication date: September 26, 2002
    Inventors: Mareike Klee, Rainer Kiewitt, Hans-Peter Lobl, Paul Van Oppen, Rob Derksen
  • Publication number: 20020105250
    Abstract: The invention relates to an array of ultrasound transducers which each comprise a substrate (1), a membrane (2), a first electrode (4), a piezoelectric layer (5), and a second electrode (6), wherein the substrate (1) comprises at least one opening (3) which adjoins the membrane (2) at one side, while the piezoelectric layer (5) has a high piezoelectric coupling coefficient k and is textured. The invention further relates to an ultrasound transducer and to a method of manufacturing an array of ultrasound transducers.
    Type: Application
    Filed: January 24, 2001
    Publication date: August 8, 2002
    Applicant: U.S. PHILIPS CORPORATION
    Inventors: Mareike Klee, Tilman Schlenker, Olaf Dannappel, Hans-Peter Loebl, Georg Schmitz, John Fraser
  • Patent number: 6420096
    Abstract: The invention describes a method of manufacturing an electronic thin-film component comprising at least one stripline. In this method, first a metallic base layer is deposited on a substrate layer, a photoresist layer is applied to this metallic base layer, and structured in accordance with the stripline(s) to be formed. An electroconductive layer is deposited on the exposed regions of the metallic base layer. Subsequently, the photoresist is removed and the metallic base layer is etched. This method has the advantage that less metal is required as compared to other thin-film methods. Overlapping areas of the striplines can be formed readily, economically, and with small current capacitances by means of bridges. By means of the method described herein, passive components, such as thin-film couplers for high-frequency applications or thin-film coils can be readily obtained.
    Type: Grant
    Filed: April 3, 2000
    Date of Patent: July 16, 2002
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Hans-Peter Löbl, Paul Van Oppen, Mareike Klee, Martin Fleuster
  • Patent number: 6125027
    Abstract: A component includes a substrate layer (1) of glass or Al.sub.2 O.sub.3, an anti-reaction layer (2) or a levelling layer (2), two electrode layers (3, 5) and a dielectric layer (4) as well as such a capacitor. Manufacture a component which provides for cost-effective, surface-mountable (SMD). The anti-reaction layer (2) on the glass substrate (1) or the levelling layer (2) on the Al.sub.2 O.sub.3 -substrate (1) is made of at least one specific material. An anti-reaction layer or a levelling layer (2) of one of the above-mentioned substances or a combination of several substances, enables a dielectric layer (4) to be provided by means of which a high capacitance value is achieved.
    Type: Grant
    Filed: July 30, 1997
    Date of Patent: September 26, 2000
    Assignee: U.S. Philips Corporation
    Inventors: Mareike Klee, Wolfgang Brand, Wilhelm Hermann, Mathieu J. E. Ulenaers, Gijsbertus A. C. M. Spierings, Hendrikus J. J. M. Van Haren
  • Patent number: 6007868
    Abstract: A method is described of manufacturing ferroelectric bismuth-titanate layers Bi.sub.4 Ti.sub.3 O.sub.12 on a substrate, A solution containing bismuth and titanium is provided, in a stoichiometric ratio, in the form of a metallo-organic or inorganic compound which is homogeneously mixed in an organic solvent, being brought into contact with the substrate and thermally treated at a temperature in the range from 500.degree. C. to 650.degree. C., thereby forming bismuth-titanate Bi.sub.4 Ti.sub.3 O.sub.12.
    Type: Grant
    Filed: November 12, 1993
    Date of Patent: December 28, 1999
    Assignee: U.S. Philips Corporation
    Inventors: Mareike Klee, Wolfgang Brand, Henricus A.M. Van Hal