Patents by Inventor Marek Hempel

Marek Hempel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGH ELECTRON MOBILITY TRANSISTOR DEVICE WITH HEAT SPREADER
    Publication number: 20260033335
    Abstract: A heat spreader is described that may include a substrate of a top device, and that cools the top die of a flip-chipped die combination. The heat spreader includes a material with a high thermal conductivity, such as a material including diamond. The top heat spreader substrate may have a connection to the bottom base substrate, e.g., carrier.
    Type: Application
    Filed: July 23, 2024
    Publication date: January 29, 2026
    Inventors: Justin Scott Reiter, Marek Hempel, Daniel Piedra, James G. Fiorenza
  • SEMICONDUCTOR DEVICES TO MEASURE ELECTRICAL SIGNALS OF MATERIAL DISPOSED IN FLUID
    Publication number: 20250020629
    Abstract: Semiconductor devices can include features to apply electrical stimulation to liquids in which material is present and to measure the response to the electrical stimulation.
    Type: Application
    Filed: July 10, 2024
    Publication date: January 16, 2025
    Inventors: Phillip Michel Nadeau, David Duncan Lloyd, Michael C.W. Coln, Roman Trogan, Junfei Xia, Marek Hempel, Chen Yang, Ramji Sitaraman Lakshmanan