Abstract: A method of cleaning a chamber for an electronics manufacturing system includes flowing a gas mixture comprising oxygen and a carrier gas into a remote plasma generator. The method further includes generating a plasma from the gas mixture by the remote plasma generator and performing a remote plasma cleaning of the chamber by flowing the plasma into an interior of the chamber, wherein the plasma removes a plurality of organic contaminants from the chamber.

Abstract: A method of cleaning a chamber for an electronics manufacturing system includes flowing a gas mixture comprising oxygen and a carrier gas into a remote plasma generator. The method further includes generating a plasma from the gas mixture by the remote plasma generator and performing a remote plasma cleaning of the chamber by flowing the plasma into an interior of the chamber, wherein the plasma removes a plurality of organic contaminants from the chamber.

Abstract: Embodiments described herein provide for link tools and linked processing systems having two or more processing tools connected by one or more link tools. Each arrangement of the link processing system includes adjacent processing tools coupled to a link chamber at the transfer modules at the backend of the processing tools. The backend coupling utilizes of floor space away from the factory interfaces of the processing tools. The link chambers have at least five facets. The system further includes two or more transfer vias. Each transfer via is coupled to a facet of the link chamber. The transfer vias are connectable to transfer modules of processing tools. The system further includes a link robot disposed in the link chamber operable to transfer one or more substrates between the transfer vias connectable to the transfer modules of the processing tools.

Abstract: A substrate processing system includes an equipment front end module (EFEM) coupled to a vacuum-based mainframe, the EFEM including multiple interface openings. The system further includes a batch degas chamber attached to the EFEM at an interface opening of the multiple interface openings. The batch degas chamber includes a housing that is sealed to the interface opening of the EFEM. Within the housing is located a cassette configured to hold multiple substrates. A reactor chamber, attached to the housing, is to receive the cassette and perform an active degas process on the multiple substrates. The active degas process removes moisture and contaminants from surfaces of the multiple substrates. An exhaust line is attached to the reactor chamber to provide an exit for the moisture and contaminants.

Abstract: A method of cleaning a chamber for an electronics manufacturing system includes flowing a gas mixture comprising oxygen and a carrier gas into a remote plasma generator. The method further includes generating a plasma from the gas mixture by the remote plasma generator and performing a remote plasma cleaning of the chamber by flowing the plasma into an interior of the chamber, wherein the plasma removes a plurality of organic contaminants from the chamber.