Abstract: A method for manufacturing an RRAM cell includes providing a metal-insulator-metal stack and exposing a subsection of a MIM stack to particle bombardment and/or radiation. Exposing a subsection of the MIM stack to particle bombardment and/or radiation forms localized defects in the functional layer of the MIM stack, thereby reducing the required forming voltage of the RRAM cell and further providing precise control over the location of a conductive filament created in the MIM stack during forming of the device.

Abstract: A method for manufacturing an RRAM cell includes providing a metal-insulator-metal stack and exposing a subsection of a MIM stack to particle bombardment and/or radiation. Exposing a subsection of the MIM stack to particle bombardment and/or radiation forms localized defects in the functional layer of the MIM stack, thereby reducing the required forming voltage of the RRAM cell and further providing precise control over the location of a conductive filament created in the MIM stack during forming of the device.

Abstract: The halide chemical vapor deposition process deposits a chemical compound comprised of at least two different elements. The method employs a first process gas which includes a halogenated compound of a first one of the at least two different elements, and a second process gas which includes hydrogen and a second one of at least two different elements. The process gases are maintained in separation until they are contacted in a deposition chamber proximate a substrate. The gases, which are generally preheated to a temperature of less than their thermal decomposition temperatures, are contacted in a deposition region proximate the substrate, and react to generate a deposition species and a hydrogen halide which is removed. Also disclosed is an apparatus for practicing the invention.