Abstract: Devices, systems and methods are provided for calibrating a transducer. One exemplary method involves determining a transfer function for the transducer based on a measured response of the transducer to an applied electrical signal, determining a set of values for a plurality of response parameters associated with the transducer based on the transfer function, determining a calibration coefficient value associated with the transducer based at least in part on the set of values and a correlation between physical sensitivity and the plurality of response parameters, and storing the calibration coefficient value in association with the transducer.

Abstract: An integrated device includes a MEMS device, such as a gyroscope, having a movable mass spaced apart from a substrate, the movable mass being configured to oscillate in a drive direction relative to the substrate. The integrated device further comprises an integrated circuit (IC) die having a surface coupled with the MEMS device such that the movable mass is interposed between the substrate and the surface of the IC die. An electrode structure is formed on the surface of the IC die, the electrode structure including a plurality of electrode segments vertically spaced apart from the movable mass. Openings extend through the movable mass and the electrode segments overlie the openings. Suitably selected electrode segments can be activated to electrostatically attract the movable mass toward sense electrodes vertically spaced apart from the MEMS to reduce quadrature motion of the movable mass.

Abstract: Devices, systems and methods are provided for calibrating a transducer. One exemplary method involves determining a transfer function for the transducer based on a measured response of the transducer to an applied electrical signal, determining a set of values for a plurality of response parameters associated with the transducer based on the transfer function, determining a calibration coefficient value associated with the transducer based at least in part on the set of values and a correlation between physical sensitivity and the plurality of response parameters, and storing the calibration coefficient value in association with the transducer.

Abstract: An integrated device includes a MEMS device, such as a gyroscope, having a movable mass spaced apart from a substrate, the movable mass being configured to oscillate in a drive direction relative to the substrate. The integrated device further comprises an integrated circuit (IC) die having a surface coupled with the MEMS device such that the movable mass is interposed between the substrate and the surface of the IC die. An electrode structure is formed on the surface of the IC die, the electrode structure including a plurality of electrode segments vertically spaced apart from the movable mass. Openings extend through the movable mass and the electrode segments overlie the openings. Suitably selected electrode segments can be activated to electrostatically attract the movable mass toward sense electrodes vertically spaced apart from the MEMS to reduce quadrature motion of the movable mass.

Abstract: A micro-electro-mechanical system (MEMS) device comprises a micro-electro-mechanical system (MEMS) sensor; a detector circuit; a controller circuit coupled with the MEMS sensor; a first connection arranged between a first output of the MEMS sensor and a first input of the detector circuit; a second connection arranged between a second output of the MEMS sensor and a second input of the detector circuit; and a first switch arranged in the first connection. The controller circuit is configured to open the first switch during a first test mode so as to connect only a single input of the detector circuit with an output of the MEMS sensor. A further switch may be provided to connect two outputs of the MEMS sensor to a single input of the detector circuit.

Abstract: A sacrificial oxide etching solution of carboxylic acid and HF having a high etch selectivity for silicon oxide relative to polysilicon, metal, and nitride. The solution is useful in the fabrication of microstructures having integrated electronics on the same chip. A carboxylic acid anhydride can be added to this solution to substantially remove all free water so that the etch selectivity to metal is improved. One specific solution is formed by mixing acetic acid, acetic anhydride, and aqueous HF.