Abstract: A curved human interface device is manufactured by thermoforming a stack. The stack comprises a front substrate formed of a transparent, first thermoplastic material; an OLED display configured to display an image through the front substrate; and a thermomechanical buffer layer formed of a transparent, second thermoplastic material arranged between the front substrate and the OLED display. Heat is applied to the stack for causing a temperature of the front substrate and buffer layer to increase to a respective processing temperature at which the first and second thermoplastic materials become pliable. The stack is thermoformed while the thermoplastic materials are pliable to form the curved human interface device. The second thermoplastic material has a lower stiffness at the respective processing temperature than the first thermoplastic material.

Abstract: An electronic component (1) is connected to a conductive track (2) on a flexible substrate (3). A connection layer (4) of a composition comprising a thermoplastic material (TPM1) is provided on the conductive track (2). The connection layer (4) has at least one cutout (5) aligned to overlap the conductive track (2). A thermosetting material (TSM1) in liquid state is used to fill the cutout (5). The electronic component (1) is provided on top of the connection layer (4). By applying heat, a temperature of the connection layer (4) is raised to above a softening temperature of the thermoplastic material (TPM1). Pressure is applied to form a mechanical connection. By the application of heat (H) a temperature of the thermosetting material (TSM1) is raised above its thermosetting temperature for olidifying the thermosetting material (TSM1) and forming an electrical connection (E).

Abstract: An electronic device (100) comprises an electronics substrate (10) with at least one light emitting device (12), a cover substrate (20) with a graphical pattern including at least one window (22), and a thermoplastic layer (30) there between. A multilayer laminate (40) of the device (100) is formed by combining the electronics substrate (10) and the cover substrate (20) by lamination with protruding electronic components (11,12) facing the thermoplastic layer (30). At least the thermoplastic layer (30) is heated to a lamination temperature (T1) for increasing a plasticity of the thermoplastic material (30m). The electronic components (11,12) are pushed by the lamination into the heated thermoplastic layer (30) for embedding the electronic components (11,12) in the thermoplastic material (30m).

Abstract: A curved electronic device (10c) can be formed by a stack with a curved substrate (13) comprising a thermoplastic material (Ms), and at least one electronic component (14) connected to an electronic circuit (15) disposed on the substrate (13). A component area (11) of the substrate surface (11.12) around the electronic component (14) comprises a first material (M1) providing relatively low absorption (A1) to light (L) and a surrounding area (12) of the substrate (13) outside the component area (11), comprises a second material (M2) providing relatively high absorption (A2) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T1) of the substrate (13) in the component area (11) may be relatively high compared to a second thickness (T2) of the substrate (13) in the surrounding area (12).

Abstract: Illuminating sections of a light guide with LEDs leads to unwanted light bleeding to other parts of the light guide. Furthermore typically LEDs are placed at a large distance from the area that couples out light from this LED due to a spike in intensity close to the LED. In order to avoid this spike being visible in the lit area the distance is increased which results in unwanted areal increase of the overall system. The present provides a layout to overcome these challenges.

Abstract: Illuminating sections of a light guide with LEDs leads to unwanted light bleeding to other parts of the light guide. Furthermore typically LEDs are placed at a large distance from the area that couples out light from this LED due to a spike in intensity close to the LED. In order to avoid this spike being visible in the lit area the distance is increased which results in unwanted areal increase of the overall system. The present provides a layout to overcome these challenges.

Abstract: The present disclosure concerns a flexible electronic circuit (100) and method of manufacturing. A flexible substrate (30) with conductive tracks is provided with a rigid electronic component (10). The component (10) comprises electrical contacts (11, 12) on either sides. The conductive tracks connect to the contacts via an arced section that originates from respective sides of the contacts but swirls partially around the component to approaches the component along a centerline (CL) separating the contacts (11, 12).

Abstract: A device module (100) and method for connection to a textile fabric (50) with electrically conductive threads (51, 52) to provide a fabric layer assembly (150). The device module (100) comprises a flexible foil (10) and a thermoplastic layer (20) to enable a mechanical connection (M) between the flexible foil (10) and the textile fabric (50). The device module (100) has an outer circumference (C) comprising inward notches (N1,N2) configured as anchor points for respective conductive threads (51, 52) for holding and guiding the conductive threads (51,52) over and in contact with the respective conductive areas (11, 12) for providing the respective electrical connections (E1,E2) while the mechanical connection (M) by the thermoplastic layer (20) is established.

Abstract: A device module (100) and method for connection to a textile fabric (50) with electrically conductive threads (51, 52) to provide a fabric layer assembly (150). The device module (100) comprises a flexible foil (10) and a thermoplastic layer (20) to enable a mechanical connection (M) between the flexible foil (10) and the textile fabric (50). The device module (100) has an outer circumference (C) comprising inward notches (N1,N2) configured as anchor points for respective conductive threads (51, 52) for holding and guiding the conductive threads (51,52) over and in contact with the respective conductive areas (11, 12) for providing the respective electrical connections (E1,E2) while the mechanical connection (M) by the thermoplastic layer (20) is established.

Abstract: An assembly of a plurality of tiles (1) with a carrier (40), wherein the tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier, and the tiles overlay according to a fish scale pattern.

Abstract: The present invention pertains to a submount for mechanically and electrically coupling an electronic component to a carrier. The submount has a mounting portion for mounting the submount to the carrier and has attachment portions for holding the electronic component. The submount further has primary electric contacts for cooperation with respective electrical conductors in the carrier, and secondary electric contacts for cooperation with respective electric contacts of the electronic component. The secondary electric contacts are electrically connected to primary electric contacts. The attachment portions are coupled to the mounting portion by respective extension portions that are laterally stretchable in a plane defined by the mounting portion to allow a displacement of the attachment portions in a direction away from the mounting portion.

Abstract: An assembly of a plurality of tiles (1) with a carrier (40). The tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier in a connection portion (1c) of said tiles.

Abstract: A method is presented for reducing the light output capacity of light emitting components (C1, C2, C3), each with a different absorption band, of an OLED device (1). By irradiating at least a portion of each light emitting component (C1, C2, C3) with light (L) having a wavelength within at least one of the absorption bands, the light output capacity of the irradiated portion (P, P1, P2, P3) of each organic light emitting component having a light absorption band in which the wavelength of the light (L) is included is reduced. An OLED device (1) is also presented.

Abstract: An assembly is provided of an electro-physical transducer (10) on a flexible foil (20) with a carrier (40). The flexible foil (20) has a first main surface (22) provided with at least a first electrically conductive track (24) connected to the electro-physical transducer and opposite said first main surface a second main surface (23) facing towards the carrier. At least a first incision (25a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion (27) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor (421) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.

Abstract: A curved foil-shaped electro-optical product (1) is provided having at least a first region with a basis substrate layer (10) of a shrunken organic substance, having a convex side and a concave side and comprising at the convex side (12) of the basis substrate layer at least a further layer (20), the electro-optical product further comprising at least a second region with an electro-optical structure (20).

Abstract: A method of placement of a component on a stretchable substrate is described. A base substrate, having a stretchable substrate layer, and a flexible foil, having an integral arrangement of multiple flexible foil components, are aligned, so as to be used in a reel based manufacturing process. Through lamination of the base substrate and the flexible foil an electro/optical via connection between in plane interconnecting traces on the stretchable substrate layer and component pads of the integral component arrangement is provided. The integral arrangement of flexible foil components are mechanically separated. The method may be used in a manufacturing process for multi-foil systems.

Abstract: The present invention pertains to a submount for mechanically and electrically coupling an electronic component to a carrier. The submount has a mounting portion for mounting the submount to the carrier and has attachment portions for holding the electronic component. The submount further has primary electric contacts for cooperation with respective electrical conductors in the carrier, and secondary electric contacts for cooperation with respective electric contacts of the electronic component. The secondary electric contacts are electrically connected to primary electric contacts. The attachment portions are coupled to the mounting portion by respective extension portions that are laterally stretchable in a plane defined by the mounting portion to allow a displacement of the attachment portions in a direction away from the mounting portion.

Abstract: An assembly is provided of an electro-physical transducer (10) on a flexible foil (20) with a carrier (40). The flexible foil (20) has a first main surface (22) provided with at least a first electrically conductive track (24) connected to the electro-physical transducer and opposite said first main surface a second main surface (23) facing towards the carrier. At least a first incision (25a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion (27) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor (421) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.

Abstract: An assembly of a plurality of tiles (1) with a carrier (40). The tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier in a connection portion (1c) of said tiles.

Abstract: An assembly of a plurality of tiles (1) with a carrier (40), wherein the tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier, and the tiles overlay according to a fish scale pattern.