Abstract: In a general aspect, a packaged semiconductor device can include a semiconductor die having at least a first terminal on a first side of the semiconductor die and a second terminal on a second side of the semiconductor die. The device can include a leadframe portion electrically coupled to the first terminal of the semiconductor die and a clip portion electrically coupled to the second terminal of the semiconductor die. The device can include a molding compound. A surface of the leadframe portion and a first surface of the molding compound can define at least a portion of a first surface of the device. A surface of the clip portion and a second surface of the molding compound can define at least a portion of a second surface of the device that is parallel to the first surface of the device.

Abstract: In a general aspect, a packaged semiconductor device can include a semiconductor die having at least a first terminal on a first side of the semiconductor die and a second terminal on a second side of the semiconductor die. The device can include a leadframe portion electrically coupled to the first terminal of the semiconductor die and a clip portion electrically coupled to the second terminal of the semiconductor die. The device can include a molding compound. A surface of the leadframe portion and a first surface of the molding compound can define at least a portion of a first surface of the device. A surface of the clip portion and a second surface of the molding compound can define at least a portion of a second surface of the device that is parallel to the first surface of the device.

Abstract: A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed to the conductive region on the semiconductor die. The coated wire is cut, thereby leaving a conductive stud bump on the conductive region, where the conductive stud bump includes an inner conductive portion and an outer oxidation-resistant layer.

Abstract: A packaging assembly for semiconductor devices and a method for making such packaging is described. The invention provides a non-Pb bump design during a new flip-chip method of packaging. The design uses special conductive materials in a stud form, rather than a solder ball containing Pb. This configuration maintains a desirable solder thickness between the die and the leadframe and forms a high standoff by restricting solder wettabilty on the leadframe side. This configuration also absorbs any stress and protects the die from cracking. The invention also provides methods for making such semiconductor packages.