Abstract: A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach region includes depressions proximate the inner portions of the leads, and an aperture in the die attach region. A semiconductor die is mounted to the die attach region. A molding material passes through the aperture and covers the first surface of the semiconductor die and the die attach region.

Abstract: Careful repositioning of MOSFET gate contacts and increasing of their number makes MOSFET gate contacts more durable and reliable without requiring changes in either the leadframe design or the assembly process. Extension of the under-bump metal laterally from the gate contact with the gate pad metallization out to two or more gate pads not overlying the gate pad metallization minimizes the risk of delamination of the metallization due to thermal and mechanical stresses in assembly and operation. Use of more than one gate pad further reduces such failure risks. Positioning the gate pads sufficiently close to the original gate contact permits use of the same leadframe design and assembly process as would be used for a single gate pad placed directly over the gate contact. The result is a reliable, durable MOSFET gate contact compatible with current assembly methods.