Patents by Inventor Mari Holcomb

Mari Holcomb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED assembly having maximum metal support for laser lift-off of growth substrate
    Patent number: 8384118
    Abstract: Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process.
    Type: Grant
    Filed: April 27, 2010
    Date of Patent: February 26, 2013
    Assignees: Koninklijke Philips electronics N.V., Philips Lumileds Lighting Company LLC
    Inventors: Stefano Schiaffino, Daniel A. Steigerwald, Mari Holcomb, Grigoriy Basin, Paul Martin, John Epler
  • LED ASSEMBLY HAVING MAXIMUM METAL SUPPORT FOR LASER LIFT-OFF OF GROWTH SUBSTRATE
    Publication number: 20100207157
    Abstract: Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process.
    Type: Application
    Filed: April 27, 2010
    Publication date: August 19, 2010
    Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V., PHILIPS LUMILEDS LIGHTING COMPANY, LLC
    Inventors: Stefano SCHIAFFINO, Daniel A. STEIGERWALD, Mari HOLCOMB, Grigoriy BASIN, Paul MARTIN, John EPLER
  • LED assembly having maximum metal support for laser lift-off of growth substrate
    Patent number: 7736945
    Abstract: Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: June 15, 2010
    Assignees: Philips Lumileds Lighting Company, LLC, Koninklijke Philips Electronics N.V.
    Inventors: Stefano Schiaffino, Daniel A. Steigerwald, Mari Holcomb, Grigoriy Basin, Paul Martin, John Epler
  • LED Assembly Having Maximum Metal Support for Laser Lift-Off of Growth Substrate
    Publication number: 20070096130
    Abstract: Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process.
    Type: Application
    Filed: December 15, 2006
    Publication date: May 3, 2007
    Applicant: PHILIPS LUMILEDS LIGHTING COMPANY, LLC
    Inventors: Stefano Schiaffino, Daniel Steigerwald, Mari Holcomb, Grigoriy Basin, Paul Martin, John Epler